Manufacturing method of multilayer printed wiring board
    1.
    发明授权
    Manufacturing method of multilayer printed wiring board 有权
    多层印刷线路板的制造方法

    公开(公告)号:US09585261B2

    公开(公告)日:2017-02-28

    申请号:US14008034

    申请日:2012-03-29

    IPC分类号: H05K3/30 H05K3/46 H05K3/02

    摘要: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译: 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法,使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD
    2.
    发明申请
    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
    制造方法由多层印刷线路板和制造方法获得的多层印刷线路板的制造方法

    公开(公告)号:US20140096381A1

    公开(公告)日:2014-04-10

    申请号:US14008034

    申请日:2012-03-29

    IPC分类号: H05K3/46

    摘要: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译: 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法,使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

    Manufacturing method of multilayer printed wiring board
    3.
    发明授权
    Manufacturing method of multilayer printed wiring board 有权
    多层印刷线路板的制造方法

    公开(公告)号:US09066459B2

    公开(公告)日:2015-06-23

    申请号:US14008038

    申请日:2012-03-29

    IPC分类号: H01B13/00 H05K3/46 H05K3/02

    摘要: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译: 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法,使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD
    4.
    发明申请
    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
    制造方法由多层印刷线路板和制造方法获得的多层印刷线路板的制造方法

    公开(公告)号:US20140054259A1

    公开(公告)日:2014-02-27

    申请号:US14008038

    申请日:2012-03-29

    IPC分类号: H05K3/46

    摘要: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译: 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法,使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

    Biaxially oriented, laminated polyamide resin film

    公开(公告)号:US10093083B2

    公开(公告)日:2018-10-09

    申请号:US14239720

    申请日:2012-06-15

    摘要: The present invention is to provide stable slipperiness in highly humid environments, further to provide suitability for printing and packaging with various design properties, stable bagmaking workability, and processability properties by simultaneously giving excellent transparency as same as that of common polyamide resin films, and still further to provide a biaxially oriented, laminated polyamide resin film producible at a low cost in the case of film production. A biaxially oriented, laminated polyamide resin film comprising at least one substrate layer and at least one slippery layer, wherein the substrate layer and the slippery layer contain polyamide resins and the biaxially oriented, laminated polyamide resin film has a static friction coefficient of 0.9 or lower in 65% RH environments and a haze value of 3.0% or lower.

    In-vehicle information system
    6.
    发明授权
    In-vehicle information system 有权
    车载信息系统

    公开(公告)号:US08909422B2

    公开(公告)日:2014-12-09

    申请号:US13639043

    申请日:2010-05-20

    IPC分类号: G06F17/00 B61D37/00 B61L15/00

    摘要: An in-vehicle information system that notifies passengers in a vehicle of guidance information, including a display input unit having a display unit that displays the guidance information and an input unit that covers the display unit and detects touch operations by the passengers to be output as input operation information, and an information control unit that switches and outputs the guidance information to the display unit according to driving states of the vehicle and classifies the guidance information into first information to be provided to the passengers according to the input operation information and second information to be provided to the passengers according to the driving states of the vehicle to output the first information to the display unit according to the input operation information.

    摘要翻译: 一种车内信息系统,其向车辆中的乘客通知指导信息,包括具有显示引导信息的显示单元的显示输入单元和覆盖显示单元的输入单元,并检测由乘客输出的触摸操作作为 输入操作信息,以及信息控制单元,其根据车辆的驾驶状态将指导信息切换并输出到显示单元,并根据输入的操作信息和第二信息将引导信息分类为要提供给乘客的第一信息 根据车辆的驾驶状态向乘客提供,以根据输入的操作信息向显示单元输出第一信息。

    STRETCHED POLYAMIDE FILM
    7.
    发明申请
    STRETCHED POLYAMIDE FILM 有权
    拉伸聚酰胺薄膜

    公开(公告)号:US20130323485A1

    公开(公告)日:2013-12-05

    申请号:US13985496

    申请日:2012-02-21

    IPC分类号: C08L77/06

    摘要: The objective of the present invention is to provide a stretched polyamide film which is excellent in laminatability, lamination strength, mechanical properties and shock resistance property and which has effects to prevent goods being broken and protect a content from vibration and shock at the time of transportation when used as various packaging materials. The present invention relates to a stretched polyamide film, wherein a main constituent is nylon 6; at least one surface layer meets the following conditions (1) and (2); and the stretched polyamide film meets the following condition (3): (1) a relaxation degree of a surface layer orientation measured by IR spectroscopy is within a range of not less than 0.3 and not more than 0.5; (2) a crystallization degree of a surface layer measured by IR spectroscopy is within a range of not less than 1.0 and not more than 1.4; (3) a heat shrinkage rate (%) in TD direction at 160° C. for 10 minutes is within a range of not less than 0.6 and not more than 4.

    摘要翻译: 本发明的目的是提供一种拉伸聚酰胺薄膜,其具有优异的层合性,层压强度,机械性能和抗冲击性能,并且具有防止货物破裂的效果,并且在运输时保护内容物免受振动和冲击 用作各种包装材料。 本发明涉及拉伸聚酰胺薄膜,其中主要成分是尼龙6; 至少一个表面层满足以下条件(1)和(2); 拉伸聚酰胺膜满足以下条件(3):(1)通过IR光谱测定的表面层取向的松弛度在0.3以上且0.5以下的范围内; (2)通过IR光谱测定的表面层的结晶度在1.0以上且1.4以下的范围内, (3)在160℃下10分钟的TD方向的热收缩率(%)在0.6以上且4以下的范围内。

    Capacitor, integrated device, radio frequency switching device, and electronic apparatus
    8.
    发明授权
    Capacitor, integrated device, radio frequency switching device, and electronic apparatus 有权
    电容器,集成装置,射频切换装置和电子装置

    公开(公告)号:US08324710B2

    公开(公告)日:2012-12-04

    申请号:US13043988

    申请日:2011-03-09

    IPC分类号: H01L29/92

    摘要: According to one embodiment, a capacitor includes a substrate, a first electrode, a second electrode, and a first dielectric portion. The substrate includes an insulating layer and a semiconductor layer provided on the insulating layer. The semiconductor layer includes a dummy active region electrically isolated from an active region including an active element. The first electrode and the second electrode are located to oppose each other above the dummy active region. The first dielectric portion is provided between the first electrode and the second electrode.

    摘要翻译: 根据一个实施例,电容器包括衬底,第一电极,第二电极和第一电介质部分。 衬底包括绝缘层和设置在绝缘层上的半导体层。 半导体层包括与包括有源元件的有源区电隔离的虚拟有源区。 第一电极和第二电极位于虚拟有源区以上彼此相对的位置。 第一电介质部分设置在第一电极和第二电极之间。