公开(公告)号：US08482023B2

公开(公告)日：2013-07-09

申请号：US12304663

申请日：2007-06-28

Applicant: Do Hyung Kim ,  Suk Jin Kang ,  Hyuck Jung Choi ,  Jung Hoo Seo

Inventor： Do Hyung Kim ,  Suk Jin Kang ,  Hyuck Jung Choi ,  Jung Hoo Seo

IPC: H01L33/00 ,  H01L23/495 ,  H01L21/50

CPC classification number: H01L33/62 ,  H01L23/4334 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005

Abstract: Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.

Abstract translation: 公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。 引线框架包括围绕预定区域的外框架。 散热器支撑部件向内延伸以从外框架彼此面对。 每个支撑部分具有联接到散热器的端部。 此外，引线端子向内延伸以从外框架彼此面对。 引线端子与支撑部分间隔开。 因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

公开(公告)号：US08288793B2

公开(公告)日：2012-10-16

申请号：US13078497

申请日：2011-04-01

Applicant: Do Hyung Kim ,  Suk Jin Kang

Inventor： Do Hyung Kim ,  Suk Jin Kang

IPC: H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.

Abstract translation: LED封装技术领域本发明涉及一种LED封装，其包括引线框架，该引线框架包括具有附接到其上的至少一个LED芯片的芯片附接部分和具有比芯片附接部分窄的宽度的多个端子部分，以及用于支撑引线框架 。 多个端子部分包括从芯片安装部分的宽度的一部分延伸的至少一个第一端子部分和与芯片附接部分间隔开的多个第二端子部分。

公开(公告)号：US07642563B2

公开(公告)日：2010-01-05

申请号：US12058417

申请日：2008-03-28

Applicant: Suk Jin Kang ,  Do Hyung Kim

Inventor： Suk Jin Kang ,  Do Hyung Kim

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.

Abstract translation: 本发明涉及发光二极管（LED）封装。 本发明的目的是提供一种具有优异的散热性和紧凑结构的具有金属PCB的LED封装，不会大大限制常规设备的使用，并且与目前使用的电子设备或照明设备兼容 广泛。 为此，根据本发明的LED封装包括通过层叠第一和第二金属板与介于其间的电绝缘层形成的金属印刷电路板（PCB）; 以及安装在金属PCB的第一金属板上的LED芯片，其中第一金属板具有分别从电极图案延伸的电极图案和引线。