Abstract:
The disclosure provides a method of manufacturing a semiconductor device. The method comprises forming a shallow trench isolation structure, including performing a wet etch process to remove a patterned pad oxide layer located on a semiconductor substrate. The wet etch thereby produces a divot on upper lateral edges of a insulator-filled trench in the semiconductor substrate. Forming the shallow trench isolation structure also includes forming a nitride post on a vertical wall of the divot. Forming the nitride post includes depositing a nitride layer on the insulator, and dry etching the nitride layer. The dry etch is selective towards the nitride located adjacent the vertical wall such that a portion of the nitride layer remains on the vertical wall subsequent to the dry etching.
Abstract:
A gaming machine arranged to display a symbol in each element of a matrix of elements; each column of elements of said matrix of elements comprising a portion of a simulated rotatable reel and wherein at an occurrence of a trigger event at end of play of a main game; (a) said main game is completed and any prize is awarded, (b) at least one feature game may be awarded wherein each said rotatable reel is caused to be spun and brought to rest to display elements of said matrix in a first stage; said first stage displaying symbols in elements of at least one said column and uniform imagery in elements of each remaining said column; said feature game then progressing to a further stage wherein elements with said uniform imagery are populated by symbols of said elements of said at least one column.
Abstract:
The outer diameter roughing in a CNC lathe turning process utilizes generally inserts with zero degree negative clearance angle (N−0 degree Negative) for economic purposes. The common roughing tool holder is using the diamond shape insert, the so called CN_or DN_insert. In a variation of these conventional tool holders only one corner (mostly 80/55 degree) of the insert is in cutting operation. The other corner (110/125 degree) could be reused in another tool holder.
Abstract:
A metal fuse process that uses a thinner (e.g., 6000 Å) oxide (108) over the top interconnect (102). The oxide (108) is removed over the probe pads (106) for testing but is not removed over the fuses (104). Because the oxide (108) is thin at the upper corners of the fuse (104), the oxide (108) cracks over the fuse (104) during a laser pulse (114). A wet etch is then used to dissolve the exposed fuses (104).
Abstract:
A system for secure information storage and delivery includes a vault repository that includes a secure vault associated with a user, wherein the secure vault is configured to receive at least one data entry. A mobile vault server coupled to the vault repository creates a mobile vault on a mobile device based on the secure vault and is capable of authenticating the mobile device based on user authentication information. The mobile vault server includes a mobile device handler that communicates with the mobile device. A synchronization utility determines whether the at least one data entry on the secure vault is transferable to or storable on the mobile vault. and transfers the data entry from the secure vault to a corresponding data entry on the mobile vault if the at least one data entry on the secure vault is determined to be transferable to or storable on the mobile vault.
Abstract:
Dual gate dielectric layers are formed on a semiconductor substrate for MOS transistor fabrication. A first dielectric layer (30) is formed on a semiconductor substrate (10). A first plasma nitridation process is performed on said first dielectric layer. The first dielectric layer (30) is removed in regions of the substrate and a second dielectric layer (50) is formed in these regions. A second plasma nitridation process is performed on the first dielectric layer and the second dielectric layer. MOS transistors (160, 170) are then fabricated using the dielectric layers (30, 50).
Abstract:
Dual gate dielectric layers are formed on a semiconductor substrate for MOS transistor fabrication. A first dielectric layer (30) is formed on a semiconductor substrate (10). A first plasma nitridation process is performed on said first dielectric layer. The first dielectric layer (30) is removed in regions of the substrate and a second dielectric layer (50) is formed in these regions. A second plasma nitridation process is performed on the first dielectric layer and the second dielectric layer. MOS transistors (160, 170) are then fabricated using the dielectric layers (30, 50).
Abstract:
Techniques for a door system for sealing an opening between two chambers in a semiconductor processing system are described. A sealing member seals the opening when a door is in a closed position. To selectively open and close the opening, an actuator moves the door. A valve actuator switch provides a first or second pressure to the actuator depending on the pressure inside a first chamber. In one embodiment, a sensor monitors the pressure inside the first chamber.
Abstract:
A milling cutter with two faces of cutting end and two mirror symmetrical central bores for the mounting in a shell mill holder on either one of them. The aligned key grooves are formed on the bottom surface of each central bore. The inserts are located on the periphery of each cutting end.
Abstract:
A process for making a metal fuse link in a MOS or CMOS process which includes depositing a refractory metal or metal alloy over an already deposited multi-level oxide and patterning the deposited metal or metal alloy so that it has a fusing segment between and integral with expanded segments such that the length and cross sectional area of the fusing segment is sufficiently small so that the fusing current therethrough is less than 20 milliamperes. The fuse and surrounding circuitry is covered with a passivation layer and contacts formed in the passivation layer to the expanded segments.