Abstract:
A chassis set includes a first chassis and a second chassis. The first chassis includes a first connecting portion having at least one guide protrusion. The second chassis includes a second connecting portion having at least one guide hole that receives the guide protrusion of the first chassis to combine the first and second chassis. Therefore, a manufacturing cost is reduced and productivity is enhanced. Additionally, the chassis can be made easily.
Abstract:
There are provided a semiconductor light emitting device and a manufacturing method of the same. The semiconductor light emitting device includes a light emitting structure including first and second conductive semiconductor layers with an active layer interposed therebetween; first and second bonding electrodes connected to the first and second conductive semiconductor layers, respectively; a transparent electrode layer formed on the second conductive semiconductor layer; a plurality of nano structures formed on the transparent electrode layer; and a passivation layer formed to cover the plurality of nano-structures, wherein refractive indexes of the transparent electrode layer, the plurality of nano-structures, and the passivation layer may be sequentially reduced.
Abstract:
The present invention provides an apparatus for deposition of thin films on a plurality of wafers through an atomic layer epitaxial process within a reaction chamber. The apparatus has a susceptor, provided within the reaction chamber to hold the wafers and has of a plurality of wafer stations. A plurality of wafer seating units are provided in the wafer stations, and seat the wafers in the wafer stations. A gas ejecting unit is provided within the reaction chamber, and ejects reaction gases onto the reaction surfaces of the wafers. A gas feeding unit feeds the reaction gases to the gas ejecting unit at predetermined time intervals so as to allow the gas ejecting unit to alternately eject the reaction gases through each of two gas outlets into the reaction chamber. A susceptor drive unit rotates the susceptor at a predetermined velocity and vertically moves the susceptor to an upper optimal reaction position close to the ceiling of the reaction chamber. A vacuum pumping unit maintains pressure of the reaction gases within the reaction chamber, and discharges the reaction gases to the outside of the chamber. A wafer heating is positioned under the susceptor within the chamber, and heats the wafers on the susceptor within the chamber, and heats the wafers on the susceptor to a predetermined temperature. A plurality of chamber heaters are regularly set within the reaction chamber in a radial direction, and heat the interior.