公开(公告)号：US08692136B2

公开(公告)日：2014-04-08

申请号：US12926802

申请日：2010-12-09

申请人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

发明人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

IPC分类号： H05K1/11

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K1/0292 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/225 ,  H05K3/4629 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/173

摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

摘要翻译： 提供了一种修复探针卡和修理的探针板的方法。 修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘 在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

公开(公告)号：US20070246825A1

公开(公告)日：2007-10-25

申请号：US11736201

申请日：2007-04-17

申请人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

发明人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K9/003 ,  H05K9/0032 ,  H01L2924/00

摘要： A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.

摘要翻译： 高频模块及其制造方法在该模块中，基板具有接地。 多个表面安装的装置安装在基板上。 金属壁连接到基板的地面。 树脂模制气密地密封表面安装的装置和金属壁，形成为暴露金属壁的顶表面的树脂模制件。 另外，在树脂成形体上形成金属膜，与露出的金属壁的顶面接触。