公开(公告)号：US20070050525A1

公开(公告)日：2007-03-01

申请号：US11162003

申请日：2005-08-25

Applicant: Yi-Ming Pao ,  Yu-Hung Cheng

Inventor： Yi-Ming Pao ,  Yu-Hung Cheng

IPC: G06F13/38

CPC classification number: G06F13/385

Abstract: A virtual COM port for remote I/O controller comprises a virtual COM port in a host end. The virtual COM port is connected to a remote I/O controller via a network, wherein the virtual COM port is adopted for receiving and converting commands or data of a COM port interface transmitted from the host end into an acceptable format for the remote I/O controller, and then transmitting to the remote I/O controller for processing. The virtual COM port is also adopted for receiving and converting commands or data transmitted from the remote I/O controller via the network into an acceptable format for the COM port interface, and then transmitting to the host end for processing.

Abstract translation: 用于远程I / O控制器的虚拟COM端口包括主机端的虚拟COM端口。 虚拟COM端口通过网络连接到远程I / O控制器，其中采用虚拟COM端口，用于接收和转换从主机端发送的COM端口接口的命令或数据为远程I / O控制器，然后发送到远程I / O控制器进行处理。 虚拟COM端口也被用于接收和转换从远程I / O控制器经由网络发送的命令或数据到COM端口接口的可接受格式，然后发送到主机端进行处理。

公开(公告)号：US08530316B2

公开(公告)日：2013-09-10

申请号：US13736453

申请日：2013-01-08

Applicant: Yu-Hung Cheng ,  Jhi-Cherng Lu ,  Ming-Hua Yu ,  Chii-Horng Li ,  Tze-Liang Lee

Inventor： Yu-Hung Cheng ,  Jhi-Cherng Lu ,  Ming-Hua Yu ,  Chii-Horng Li ,  Tze-Liang Lee

IPC: H01L21/336

CPC classification number: H01L21/20 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/3065 ,  H01L21/823412 ,  H01L21/823425 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/66477 ,  H01L29/7848

Abstract: A method for fabricating a semiconductor device, the method including growing a first semiconductor structure comprising a first semiconductor material on a surface of a substrate, wherein growing the first semiconductor structure includes forming a semiconductor particle comprising the first semiconductor material on a second semiconductor structure of the semiconductor device. The method further includes forming a protection layer of a second semiconductor material on the first semiconductor structure, wherein forming the protection layer includes forming the protection layer on the semiconductor particle. The method further includes removing a portion of the protection layer, wherein removing the portion of the protection layer includes fully removing the protection layer on the semiconductor particle and the semiconductor particle.

Abstract translation: 一种制造半导体器件的方法，所述方法包括在衬底的表面上生长包括第一半导体材料的第一半导体结构，其中生长第一半导体结构包括在第二半导体结构的第二半导体结构上形成包含第一半导体材料的半导体粒子 半导体器件。 该方法还包括在第一半导体结构上形成第二半导体材料的保护层，其中形成保护层包括在半导体颗粒上形成保护层。 该方法还包括去除保护层的一部分，其中去除保护层的部分包括完全去除半导体颗粒和半导体颗粒上的保护层。

公开(公告)号：US20120319475A1

公开(公告)日：2012-12-20

申请号：US13164342

申请日：2011-06-20

Applicant: YU-HUNG CHENG

Inventor： YU-HUNG CHENG

IPC: H02J5/00 ,  H02J9/06

CPC classification number: H02J7/0027 ,  H02J7/0013 ,  H02J7/0044 ,  Y10T307/313 ,  Y10T307/625

Abstract: A connection base is disclosed. The connection base includes a first connection port, a second connection port, a charging unit, a first electric power conversion unit, and a second electric power conversion unit. The first electric power conversion unit is for converting an input voltage to a first output voltage, and for transmitting the first output voltage to the charging unit. The charging unit is for receiving the first output voltage and outputting a charging voltage, in order to charge the electric power bank device which is detachably connected to the first connection port. The second electric power conversion unit is for receiving and converting a second output voltage of the electric power bank device to a supply voltage, and sending the supply voltage to the inverter which is detachably connected to the second connection port.

Abstract translation: 公开了连接基座。 连接基座包括第一连接端口，第二连接端口，充电单元，第一电力转换单元和第二电力转换单元。 第一电力转换单元用于将输入电压转换为第一输出电压，并将第一输出电压发送到充电单元。 充电单元用于接收第一输出电压并输出充电电压，以便对可拆卸地连接到第一连接端口的电力库装置进行充电。 第二电力转换单元用于接收并将电力储存装置的第二输出电压转换为电源电压，并将电源电压发送到可拆卸地连接到第二连接端口的逆变器。

公开(公告)号：US20120168821A1

公开(公告)日：2012-07-05

申请号：US12984877

申请日：2011-01-05

Applicant: Yu-Hung CHENG ,  Chii-Horng LI ,  Tze-Liang LEE

Inventor： Yu-Hung CHENG ,  Chii-Horng LI ,  Tze-Liang LEE

IPC: H01L29/38 ,  H01L21/336

CPC classification number: H01L29/66636 ,  H01L21/0243 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823481 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823878 ,  H01L29/78 ,  H01L29/7848

Abstract: A semiconductor device having a substrate including a major surface, a gate stack comprising a sidewall over the substrate and a spacer over the substrate adjoining the sidewall of the gate stack. The spacer having a bottom surface having an outer point that is the point on the bottom surface farthest from the gate stack. An isolation structure in the substrate on one side of the gate stack has an outer edge closest to the spacer. A strained material below the major surface of the substrate disposed between the spacer and the isolation structure having an upper portion and a lower portion separated by a transition plane at an acute angle to the major surface of the substrate.

Abstract translation: 一种具有包括主表面的衬底的半导体器件，包括在衬底上的侧壁的栅极堆叠以及与栅极堆叠的侧壁相邻的衬底上的间隔物。 该间隔件具有底表面，该外表面是位于最远离该栅极叠层的底表面上的点。 在栅极堆叠的一侧上的衬底中的隔离结构具有最靠近间隔物的外边缘。 位于衬垫的主表面之下的应变材料设置在间隔件和隔离结构之间，该上表面和隔离结构具有与衬底的主表面成锐角的过渡面分开的上部和下部。

公开(公告)号：US20110287611A1

公开(公告)日：2011-11-24

申请号：US13030850

申请日：2011-02-18

Applicant: Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee ,  Yi-Hung Lin

Inventor： Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee ,  Yi-Hung Lin

IPC: H01L21/20

CPC classification number: H01L29/66636 ,  H01L21/02532 ,  H01L21/02573 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/02639 ,  H01L29/0847 ,  H01L29/7848

Abstract: A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate in a wafer; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. The step of performing the selective epitaxial growth includes performing a first growth stage with a first growth-to-etching (E/G) ratio of process gases used in the first growth stage; and performing a second growth stage with a second E/G ratio of process gases used in the second growth stage different from the first E/G ratio.

Abstract translation: 一种用于形成半导体结构的方法包括在晶片上的半导体衬底上形成栅叠层; 在所述半导体衬底中形成凹槽并邻近所述栅叠层; 以及进行选择性外延生长以在所述凹部中生长半导体材料以形成外延区域。 执行选择性外延生长的步骤包括以第一生长阶段中使用的工艺气体的第一生长蚀刻（E / G）比率进行第一生长阶段; 以及在与第一E / G比不同的第二生长阶段中使用的处理气体的第二E / G比进行第二生长阶段。

公开(公告)号：US09263339B2

公开(公告)日：2016-02-16

申请号：US12784344

申请日：2010-05-20

Applicant: Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee

Inventor： Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee

IPC: H01L21/336 ,  H01L21/8234 ,  H01L21/3065 ,  H01L27/11 ,  H01L29/78 ,  H01L21/02

CPC classification number: H01L29/66636 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/3065 ,  H01L21/823412 ,  H01L21/823425 ,  H01L27/1116 ,  H01L29/7848

Abstract: A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. After the step of performing the selective epitaxial growth, a selective etch-back is performed to the epitaxy region. The selective etch-back is performed using process gases comprising a first gas for growing the semiconductor material, and a second gas for etching the epitaxy region.

Abstract translation: 一种用于形成半导体结构的方法包括在半导体衬底上形成栅叠层; 在所述半导体衬底中形成凹槽并邻近所述栅叠层; 以及进行选择性外延生长以在所述凹部中生长半导体材料以形成外延区域。 在执行选择性外延生长的步骤之后，对外延区进行选择性回蚀。 使用包括用于生长半导体材料的第一气体的处理气体和用于蚀刻外延区域的第二气体来执行选择性回蚀。

公开(公告)号：US20130252392A1

公开(公告)日：2013-09-26

申请号：US13427628

申请日：2012-03-22

Applicant: Yu-Hung Cheng ,  Wu-Ping Huang ,  Chii-Horng Li ,  Tze-Liang Lee

Inventor： Yu-Hung Cheng ,  Wu-Ping Huang ,  Chii-Horng Li ,  Tze-Liang Lee

IPC: H01L21/336

CPC classification number: H01L21/02057 ,  H01L21/02381 ,  H01L21/0243 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/02661 ,  H01L21/3065 ,  H01L21/823412 ,  H01L21/823425 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/66636 ,  H01L29/7848

Abstract: A method includes etching a semiconductor substrate to form a recess, wherein the recess extends from a top surface of the semiconductor substrate into the semiconductor substrate. An enhanced cleaning is then performed to etch exposed portions of the semiconductor substrate. The exposed portions are in the recess. The enhanced cleaning is performed using process gases including hydrochloride (HCl) and germane (GeH4). After the enhanced cleaning, an epitaxy is performed to grow a semiconductor region in the recess.

Abstract translation: 一种方法包括蚀刻半导体衬底以形成凹部，其中凹部从半导体衬底的顶表面延伸到半导体衬底中。 然后进行增强的清洁以蚀刻半导体衬底的暴露部分。 露出的部分在凹槽中。 使用包括盐酸盐（HCl）和锗烷（GeH4）在内的工艺气体进行增强清洗。 在增强清洁之后，进行外延以在凹槽中生长半导体区域。

公开(公告)号：US20130122675A1

公开(公告)日：2013-05-16

申请号：US13736453

申请日：2013-01-08

Applicant: Yu-Hung CHENG ,  Jhi-Cherng LU ,  Ming-Hua YU ,  Chii-Horng LI ,  Tze-Liang LEE

Inventor： Yu-Hung CHENG ,  Jhi-Cherng LU ,  Ming-Hua YU ,  Chii-Horng LI ,  Tze-Liang LEE

IPC: H01L21/20 ,  H01L29/66

CPC classification number: H01L21/20 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/3065 ,  H01L21/823412 ,  H01L21/823425 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/66477 ,  H01L29/7848

Abstract: A method for fabricating a semiconductor device, the method including growing a first semiconductor structure comprising a first semiconductor material on a surface of a substrate, wherein growing the first semiconductor structure includes forming a semiconductor particle comprising the first semiconductor material on a second semiconductor structure of the semiconductor device. The method further includes forming a protection layer of a second semiconductor material on the first semiconductor structure, wherein forming the protection layer includes forming the protection layer on the semiconductor particle. The method further includes removing a portion of the protection layer, wherein removing the portion of the protection layer includes fully removing the protection layer on the semiconductor particle and the semiconductor particle.

Abstract translation: 一种制造半导体器件的方法，所述方法包括在衬底的表面上生长包括第一半导体材料的第一半导体结构，其中生长第一半导体结构包括在第二半导体结构的第二半导体结构上形成包含第一半导体材料的半导体粒子 半导体器件。 该方法还包括在第一半导体结构上形成第二半导体材料的保护层，其中形成保护层包括在半导体颗粒上形成保护层。 该方法还包括去除保护层的一部分，其中去除保护层的部分包括完全去除半导体颗粒和半导体颗粒上的保护层。

公开(公告)号：US20120032531A1

公开(公告)日：2012-02-09

申请号：US12849910

申请日：2010-08-04

Applicant: Yu-Hung CHENG

Inventor： Yu-Hung CHENG

IPC: H02J7/00

CPC classification number: H02J7/0011 ,  H04R1/028 ,  H04R2205/021

Abstract: A power bank apparatus with speaker combines the function of power bank and the function of speaker. The power bank apparatus not only charges the portable electronic apparatuses but also supplies power to the internal speaker. The voice or music of the portable electronic apparatus is amplified by the speaker of the power bank apparatus to improve the quality of the voice or music.

Abstract translation: 带扬声器的电源设备结合了电源的功能和扬声器的功能。 动力储存装置不仅对便携式电子装置进行充电，而且向内部扬声器供电。 便携式电子设备的语音或音乐由电力银行设备的扬声器放大，以提高语音或音乐的质量。

公开(公告)号：US20110287600A1

公开(公告)日：2011-11-24

申请号：US12784344

申请日：2010-05-20

Applicant: Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee

Inventor： Yu-Hung Cheng ,  Chii-Horng Li ,  Tze-Liang Lee

IPC: H01L21/336 ,  H01L21/20

CPC classification number: H01L29/66636 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/3065 ,  H01L21/823412 ,  H01L21/823425 ,  H01L27/1116 ,  H01L29/7848

Abstract: A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. After the step of performing the selective epitaxial growth, a selective etch-back is performed to the epitaxy region. The selective etch-back is performed using process gases comprising a first gas for growing the semiconductor material, and a second gas for etching the epitaxy region.

Abstract translation: 一种用于形成半导体结构的方法包括在半导体衬底上形成栅叠层; 在所述半导体衬底中形成凹槽并邻近所述栅叠层; 以及进行选择性外延生长以在所述凹部中生长半导体材料以形成外延区域。 在执行选择性外延生长的步骤之后，对外延区进行选择性回蚀。 使用包括用于生长半导体材料的第一气体的处理气体和用于蚀刻外延区域的第二气体来执行选择性回蚀。