摘要:
The present invention provides a terminal, comprising a creating unit, configured to create a key operating layer and a content display layer on a screen of the terminal, wherein the key operating layer is positioned above the content display layer; an acquiring unit, configured to acquire function menus corresponding to at least one application program interface in the terminal; a registering unit, configured to register the function menus to the key operating layer; a key setting unit, configured to generate virtual keys for the corresponding function menus according to the application program interface displayed on the screen of the terminal; a content display unit, configured to display the application program interface in the content display layer; and a control unit, configured to control the application program interface according to a virtual key selection command received by the key operating layer. This invention further provides a terminal control method.
摘要:
A 3D AF camera module includes first and second imaging units, a storage unit, a color separation unit, a main processor unit, an image processing unit, first and second driving units, and an image combining unit. The first and second imaging units each capture an image of a scene from different angles. The color separation unit separates the images into red, green and blue colors. The main processor unit calculates MTF values of the images and determines a shooting mode of the 3D AF camera module. The image processing unit processes the images according to the MTF values to compensate for blurring of the images caused by being out of focus. The first and second driving units drive the first and second imaging units to points of optimum focuses according to MTF values. The image combining unit combines the images into a single 3D image.
摘要:
In a method for simulating a measuring process of a workpiece, one or more virtual probes of a workpiece measuring machine are created. A vector of each of the virtual probes is calculated, and an appropriate vector for each of measuring points of a workpiece is acquired for a computerized drawing of the workpiece. The angle between the vector of each of the measuring points and the vector of each of the virtual probes is calculated. A virtual probe is determined for each measuring point according to the calculated angles. The measuring points are sorted according to the virtual probe of each measuring point, and the measuring programs of the sorted measuring points that relate to the same virtual probe are combined. The combined measuring programs are executed to determine whether the actual probe would collide with the workpiece.
摘要:
In a method for establishing a safety plane in coordinate measurements, the method meshes a 3D model of a workpiece and a probe by triangles, and calculates a maximum bounding box of the probe. The method further obtains a moving path of the maximum bounding box after moving the maximum bounding box from a first measuring point to a second, and obtains a maximum space box of the moving path. If the maximum space box has one or more intersections with the workpiece, the method calculates a distance between vertices of each of the triangles falling within the maximum space box and a bottom face of the maximum space box, and obtains a point in the bottom face of the maximum space box that has a maximum distance from the triangles. By correcting a plane containing the point, the safety plane is obtained.
摘要:
A heat exchanging system is provided for conditioning indoor temperature of a building. The heat exchanging system includes a magnetic refrigerator, an indoor heat exchanger and an outdoor heat exchanger. The indoor heat exchanger is thermally connected to the magnetic refrigerator. The outdoor heat exchanger is thermally connected to the magnetic refrigerator. The outdoor heat exchanger includes a geothermal heat exchanging unit, wherein the geothermal heat exchanging unit is embedded under the ground of a building.
摘要:
A method for modeling a transistor includes providing a transistor model having at least a source node, a drain node, and a gate node, simulating operation of a device using the transistor model in a computing apparatus, and generating an offset voltage at the gate node depending on a magnitude of a current passing through the device.
摘要:
A semiconductor device is disclosed. The semiconductor device includes: a substrate; a metal-oxide semiconductor (MOS) transistor disposed in the substrate; and a shallow trench isolation (STI) disposed in the substrate and around the MOS transistor, in which the STI comprises a stress material.
摘要:
A high voltage semiconductor device includes a substrate, an insulating layer positioned on the substrate, and a silicon layer positioned on the insulating layer. The silicon layer further includes at least a first doped strip, two terminal doped regions formed respectively at two opposite ends of the silicon layer and electrically connected to the first doped strip, and a plurality of second doped strips. The first doped strip and the terminal doped regions include a first conductivity type, the second doped strips include a second conductivity type, and the first conductivity type and the second conductivity type are complementary. The first doped strip and the second doped strips are alternately arranged.
摘要:
In a method for extracting data of a product, an electronic design document related to the product and point cloud created using actual measurements of the product are received. The point cloud includes points of the product. The method aligns the curved surface of the product with the corresponding portion of the point cloud using a best-fit method, creates a maximum space box for a feature element of the product, and deletes points that are not within the maximum space box. According to an average distance between two neighboring points of the point cloud, the maximum space box can be divided into many small space boxes. Using the small space boxes, the points are filtered to form a feature element.
摘要:
A heat dissipation device of electronic apparatus, which is applicable to an electronic apparatus with a heat source for dissipating heat. The heat dissipation device includes: at least one electroconductive heat conduction plate assembly having a contact face in contact with a grounding surface and a heat conduction face facing the heat source; and a heat spreader with an area smaller than that of the heat conduction plate assembly. The heat spreader is able to transversely conduct heat. The heat spreader is attached to the heat conduction plate assembly. The heat spreader has a proximal-to-heat-source section proximal to the heat source and a distal-from-heat-source section extending in a direction away from the heat source. The heat conduction plate assembly and the heat spreader cooperate with each other to conduct and spread the heat of the heat source in different directions.