公开(公告)号：US20190177235A1

公开(公告)日：2019-06-13

申请号：US16323454

申请日：2017-07-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan C. Zimmer ,  Ursula Kayser ,  Krishna B. Uibel ,  Christoph Lesniak

IPC: C04B35/583 ,  C04B35/626

Abstract: Provided are materials for a formed body comprising hexagonal boron nitride and such formed bodies. Also provided are heat-treated formed body obtained by heat-treating the formed bodies. The invention further relates to processes for making the formed body and the heat-treated formed body.

公开(公告)号：US20190177234A1

公开(公告)日：2019-06-13

申请号：US16310230

申请日：2017-06-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Krishna B. Uibel ,  Jan C. Zimmer ,  Christoph Lesniak ,  Robert M. Schädel

IPC: C04B35/583 ,  C04B35/626

Abstract: Provided are formed bodies comprising hexagonal boron nitride wherein the formed body has a Brinell hardness of at least 2 HBW 2,5/2, and wherein the formed body is obtainable by a process at temperatures of at most 100° C., and wherein the Brinell hardness is measured according to DIN EN ISO 6506-1 (2013). Further provided are processes for making said formed body.

公开(公告)号：US20180215964A1

公开(公告)日：2018-08-02

申请号：US15745531

申请日：2016-07-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan U. Wieneke ,  Susanne H. Rieder-Otterburg ,  Frank Kuester ,  Simone Raynoschek ,  Armin Kayser ,  Krishna B. Uibel

IPC: C09J11/04 ,  C09J9/00 ,  C09J133/08 ,  C08K3/38 ,  C08K7/00

CPC classification number: C09J11/04 ,  C08K3/38 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C09J9/00 ,  C09J133/06 ,  C09J133/08

Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.