Abstract:
The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii. (optionally), free hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 50 micrometer; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.
Abstract:
The present disclosure relates to a film usable for roll-to-roll processing of flexible electronic devices, the film comprising a composite material comprising a polymer and hexagonal boron nitride particles, wherein the hexagonal boron nitride particles comprise platelet-shaped hexagonal boron nitride particles. The present disclosure further relates to a process for producing said film, and to the use of said film.
Abstract:
Polyurethane/urea nanocomposites, precursors thereof, and methods of their manufacture and use are provided, the nanocomposites comprising: a) a polyurethane/urea polymer matrix, and b) surface modified silicon carbide nanoparticles dispersed within and covalently bound to a polyurethane/urea polymer comprising the polyurethane/urea polymer matrix. In some embodiments, the surface modified silicon carbide nanoparticle comprises a silicon carbide core and a linking group covalently bound to the surface of the silicon carbide core and covalently bound to the polyurethane/urea polymer. In some embodiments, the linking group is a moiety according to Formula where the urethane group of the linking group is covalently bound to the polyurethane/urea polymer; and where each open valence of the silicon atom of the linking group is bound to a hydroxyl group (—OH) or is covalently bound to the surface of the silicon carbide core through an oxygen atom.
Abstract:
The invention relates to a polymer sliding material, capable of running dry and comprising a polymer matrix material and fillers, wherein the fillers comprise reinforcing particles, hard material particles and lubricant particles.The invention furthermore relates to a mechanical seal, comprising a rotating sealing ring and a stationary counter ring, wherein the sealing ring and/or the counter ring encompass the polymer sliding material, which is capable of running dry.Furthermore, the invention relates to the use of such polymer materials, which are capable of running dry, for dry-running applications, especially as a material for displacement elements in wet-running and dry-running pumps.
Abstract:
The invention relates to a component part produced by thermoplastic processing, having a wall thickness of at most 3 mm on at least one part of the component part, wherein the component part comprises a thermoplastically processable polymer material and a thermally conductive filler, wherein the filler comprises boron nitride agglomerates. The invention furthermore relates to a polymer/boron nitride compound for producing such a component part. The invention furthermore relates to the use of such a component part for heat dissipation from component parts or assemblies to be cooled.
Abstract:
The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.