POLYMER SLIDING MATERIAL WITH DRY-RUN CAPABILITY AND SLIDE RING SEAL WITH DRY-RUN CAPABILITY
    4.
    发明申请
    POLYMER SLIDING MATERIAL WITH DRY-RUN CAPABILITY AND SLIDE RING SEAL WITH DRY-RUN CAPABILITY 审中-公开
    具有干运行能力的聚合物滑动材料和具有干式能力的滑环密封

    公开(公告)号:US20160122682A1

    公开(公告)日:2016-05-05

    申请号:US14778668

    申请日:2014-03-21

    Abstract: The invention relates to a polymer sliding material, capable of running dry and comprising a polymer matrix material and fillers, wherein the fillers comprise reinforcing particles, hard material particles and lubricant particles.The invention furthermore relates to a mechanical seal, comprising a rotating sealing ring and a stationary counter ring, wherein the sealing ring and/or the counter ring encompass the polymer sliding material, which is capable of running dry.Furthermore, the invention relates to the use of such polymer materials, which are capable of running dry, for dry-running applications, especially as a material for displacement elements in wet-running and dry-running pumps.

    Abstract translation: 本发明涉及一种聚合物滑动材料,其能够干燥并且包含聚合物基体材料和填料,其中填料包括增强颗粒,硬质材料颗粒和润滑剂颗粒。 本发明还涉及一种机械密封件,其包括旋转的密封环和固定的计数器环,其中所述密封环和/或所述对置环包含能够干燥的所述聚合物滑动材料。 此外,本发明涉及这样的能够干燥运行的聚合物材料用于干式运行的应用,特别是作为用于湿式运行和干式运行的泵中的位移元件的材料。

    COMPONENT PARTS PRODUCED BY THERMOPLASTIC PROCESSING OF POLYMER/BORON NITRIDE COMPOUNDS, POLYMER/BORON NITRIDE COMPOUNDS FOR PRODUCING SUCH COMPONENT PARTS AND USE THEREOF
    5.
    发明申请
    COMPONENT PARTS PRODUCED BY THERMOPLASTIC PROCESSING OF POLYMER/BORON NITRIDE COMPOUNDS, POLYMER/BORON NITRIDE COMPOUNDS FOR PRODUCING SUCH COMPONENT PARTS AND USE THEREOF 审中-公开
    通过聚合物/硼酸盐化合物的热塑性加工生产的组分部件,用于生产这些组分部件的聚合物/硼酸盐化合物及其用途

    公开(公告)号:US20160122502A1

    公开(公告)日:2016-05-05

    申请号:US14895102

    申请日:2014-06-18

    CPC classification number: C08K3/38 C08K9/02 C08K2003/385

    Abstract: The invention relates to a component part produced by thermoplastic processing, having a wall thickness of at most 3 mm on at least one part of the component part, wherein the component part comprises a thermoplastically processable polymer material and a thermally conductive filler, wherein the filler comprises boron nitride agglomerates. The invention furthermore relates to a polymer/boron nitride compound for producing such a component part. The invention furthermore relates to the use of such a component part for heat dissipation from component parts or assemblies to be cooled.

    Abstract translation: 本发明涉及通过热塑性加工制造的部件,其在部件的至少一部分上具有至多3mm的壁厚,其中所述部件包括热塑性加工聚合物材料和导热填料,其中所述填料 包括氮化硼附聚物。 本发明还涉及用于制造这种组分部分的聚合物/氮化硼化合物。 本发明还涉及这样的部件用于要冷却的部件或组件的散热的用途。

    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE

    公开(公告)号:US20180215964A1

    公开(公告)日:2018-08-02

    申请号:US15745531

    申请日:2016-07-20

    Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.

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