公开(公告)号：US20180355223A1

公开(公告)日：2018-12-13

申请号：US16061045

申请日：2016-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan U. Wieneke ,  Susanne H. Rieder-Otterburg ,  Armin Kayser ,  Krishna B. Uibel ,  Martin Engler ,  Robert M. Schaedel ,  Takujiro Yamabe

IPC: C09J11/04 ,  C09J7/38 ,  C09J9/00 ,  C09K5/14

CPC classification number: C09J11/04 ,  C08F220/18 ,  C08K3/38 ,  C08K2003/385 ,  C09J7/385 ,  C09J9/00 ,  C09J133/08 ,  C09J2203/33 ,  C09J2205/102 ,  C09J2400/12 ,  C09J2433/00 ,  C09K5/14 ,  C08F2220/1858 ,  C08F220/06

Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii. (optionally), free hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 50 micrometer; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.

公开(公告)号：US20220219357A1

公开(公告)日：2022-07-14

申请号：US17608541

申请日：2020-04-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Bernd Ruisinger ,  Armin Kayser ,  Mark W. Muggli ,  Michael C. Dadalas ,  Robert Veenendaal ,  Johanna Zimmermann-Ptacek

IPC: B29C43/44 ,  C08J5/18 ,  B29C43/00 ,  B29C43/02 ,  B29D7/01 ,  C08J3/20 ,  C08K3/38 ,  C08K7/00 ,  H05K1/03

Abstract: The present disclosure relates to a film usable for roll-to-roll processing of flexible electronic devices, the film comprising a composite material comprising a polymer and hexagonal boron nitride particles, wherein the hexagonal boron nitride particles comprise platelet-shaped hexagonal boron nitride particles. The present disclosure further relates to a process for producing said film, and to the use of said film.

公开(公告)号：US20180194922A1

公开(公告)日：2018-07-12

申请号：US15751575

申请日：2016-07-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ryan E. Marx ,  Jay R. Lomeda ,  Wendy L. Thompson ,  Gezahegn D. Damte ,  Kent S. Tarbutton ,  Armin Kayser

IPC: C08K3/34 ,  C08K3/14 ,  C08K9/06 ,  C08L75/02 ,  C08L75/08 ,  C01B32/956

CPC classification number: C08K3/34 ,  B82Y30/00 ,  C01B32/956 ,  C01P2004/64 ,  C08K3/14 ,  C08K9/06 ,  C08L75/02 ,  C08L75/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L75/00

Abstract: Polyurethane/urea nanocomposites, precursors thereof, and methods of their manufacture and use are provided, the nanocomposites comprising: a) a polyurethane/urea polymer matrix, and b) surface modified silicon carbide nanoparticles dispersed within and covalently bound to a polyurethane/urea polymer comprising the polyurethane/urea polymer matrix. In some embodiments, the surface modified silicon carbide nanoparticle comprises a silicon carbide core and a linking group covalently bound to the surface of the silicon carbide core and covalently bound to the polyurethane/urea polymer. In some embodiments, the linking group is a moiety according to Formula where the urethane group of the linking group is covalently bound to the polyurethane/urea polymer; and where each open valence of the silicon atom of the linking group is bound to a hydroxyl group (—OH) or is covalently bound to the surface of the silicon carbide core through an oxygen atom.

公开(公告)号：US20160122682A1

公开(公告)日：2016-05-05

申请号：US14778668

申请日：2014-03-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Armin Kayser ,  Ursula Kayser ,  Florian Grimm

IPC: C10M169/04 ,  C10M107/38 ,  F16J15/34 ,  C10M125/02 ,  C10M125/26 ,  C10M107/32 ,  C10M107/46

CPC classification number: C10M169/04 ,  C08K3/013 ,  C10M107/32 ,  C10M107/38 ,  C10M107/46 ,  C10M125/02 ,  C10M125/26 ,  F16J15/3496

Abstract: The invention relates to a polymer sliding material, capable of running dry and comprising a polymer matrix material and fillers, wherein the fillers comprise reinforcing particles, hard material particles and lubricant particles.The invention furthermore relates to a mechanical seal, comprising a rotating sealing ring and a stationary counter ring, wherein the sealing ring and/or the counter ring encompass the polymer sliding material, which is capable of running dry.Furthermore, the invention relates to the use of such polymer materials, which are capable of running dry, for dry-running applications, especially as a material for displacement elements in wet-running and dry-running pumps.

Abstract translation: 本发明涉及一种聚合物滑动材料，其能够干燥并且包含聚合物基体材料和填料，其中填料包括增强颗粒，硬质材料颗粒和润滑剂颗粒。 本发明还涉及一种机械密封件，其包括旋转的密封环和固定的计数器环，其中所述密封环和/或所述对置环包含能够干燥的所述聚合物滑动材料。 此外，本发明涉及这样的能够干燥运行的聚合物材料用于干式运行的应用，特别是作为用于湿式运行和干式运行的泵中的位移元件的材料。

公开(公告)号：US20160122502A1

公开(公告)日：2016-05-05

申请号：US14895102

申请日：2014-06-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Krishna Uibel ,  Armin Kayser ,  Johanna Zimmermann

IPC: C08K3/38

CPC classification number: C08K3/38 ,  C08K9/02 ,  C08K2003/385

Abstract: The invention relates to a component part produced by thermoplastic processing, having a wall thickness of at most 3 mm on at least one part of the component part, wherein the component part comprises a thermoplastically processable polymer material and a thermally conductive filler, wherein the filler comprises boron nitride agglomerates. The invention furthermore relates to a polymer/boron nitride compound for producing such a component part. The invention furthermore relates to the use of such a component part for heat dissipation from component parts or assemblies to be cooled.

Abstract translation: 本发明涉及通过热塑性加工制造的部件，其在部件的至少一部分上具有至多3mm的壁厚，其中所述部件包括热塑性加工聚合物材料和导热填料，其中所述填料 包括氮化硼附聚物。 本发明还涉及用于制造这种组分部分的聚合物/氮化硼化合物。 本发明还涉及这样的部件用于要冷却的部件或组件的散热的用途。

公开(公告)号：US20180215964A1

公开(公告)日：2018-08-02

申请号：US15745531

申请日：2016-07-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan U. Wieneke ,  Susanne H. Rieder-Otterburg ,  Frank Kuester ,  Simone Raynoschek ,  Armin Kayser ,  Krishna B. Uibel

IPC: C09J11/04 ,  C09J9/00 ,  C09J133/08 ,  C08K3/38 ,  C08K7/00

CPC classification number: C09J11/04 ,  C08K3/38 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C09J9/00 ,  C09J133/06 ,  C09J133/08

Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.