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公开(公告)号：US10792228B2
公开(公告)日：2020-10-06
申请号：US15775040
申请日：2016-10-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Michael Jahns , Markus Mikulla , Robert F. Peez , Adrian S. Eckert , Rainer A. Guggenberger , Simone Raynoschek , Afshin Falsafi , Bradley D. Craig , Jimmie R. Baran, Jr. , Joel D. Oxman
Abstract: The invention relates to a kit of parts for preparing a glass ionomer composition for dental use, the kit of parts comprising a Powder Part P and a Liquid Part L, Powder Part P comprising: acid-reactive inorganic filler, Liquid Part L comprising: water, complexing agent, polyacid, either the Powder Part P or the Liquid Part L or the Powder Part P and the Liquid Part L comprising non-aggregated nano-sized particles based on silica or alumina, the composition obtained by combining the components of Powder Part P and Liquid Part L before hardening comprising the components in the following amounts: non-aggregated nano-sized particles: from 0.1 to 15 wt.-%, acid-reactive filler in an amount from 50 to 75 wt.-%, polyacid: 7 to 20 wt.-%, complexing agent: 0.5 to 3 wt.-%, water: 5 to 18 wt.-%, wt.-% with respect to the weight of the whole composition.
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2.发明申请公开(公告)号：US20190000723A1
公开(公告)日：2019-01-03
申请号：US15775040
申请日：2016-10-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Michael Jahns , Markus Mikulla , Robert F. Peez , Adrian S. Eckert , Rainer A. Guggenberger , Simone Raynoschek , Afshin Falsafi , Bradley D. Craig , Jimmie R. Baran, JR. , Joel D. Oxman
Abstract: The invention relates to a kit of parts for preparing a glass ionomer composition for dental use, the kit of parts comprising a Powder Part P and a Liquid Part L, Powder Part P comprising: acid-reactive inorganic filler, Liquid Part L comprising: water, complexing agent, polyacid, either the Powder Part P or the Liquid Part L or the Powder Part P and the Liquid Part L comprising non-aggregated nano-sized particles based on silica or alumina, the composition obtained by combining the components of Powder Part P and Liquid Part L before hardening comprising the components in the following amounts: non-aggregated nano-sized particles: from 0.1 to 15 wt.-%, acid-reactive filler in an amount from 50 to 75 wt.-%, polyacid: 7 to 20 wt.-%, complexing agent: 0.5 to 3 wt.-%, water: 5 to 18 wt.-%, wt.-% with respect to the weight of the whole composition.
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公开(公告)号：US20180215964A1
公开(公告)日：2018-08-02
申请号：US15745531
申请日：2016-07-20
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jan U. Wieneke , Susanne H. Rieder-Otterburg , Frank Kuester , Simone Raynoschek , Armin Kayser , Krishna B. Uibel
IPC: C09J11/04 , C09J9/00 , C09J133/08 , C08K3/38 , C08K7/00
CPC classification number: C09J11/04 , C08K3/38 , C08K7/00 , C08K2003/385 , C08K2201/001 , C08K2201/003 , C08K2201/005 , C08K2201/014 , C09J9/00 , C09J133/06 , C09J133/08
Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d50, wherein the third average agglomerate size d50 is lower than the first average agglomerate size d50 and is different from second average agglomerate size d50; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm3, when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.
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