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公开(公告)号:US10974987B2
公开(公告)日:2021-04-13
申请号:US16351007
申请日:2019-03-12
申请人: AGC Inc.
IPC分类号: C03C3/089 , C03C3/091 , C03B25/08 , C03B19/14 , C03C4/16 , H05K1/03 , C03B17/02 , C03B17/06 , H05K1/02 , C03C3/06 , C03C3/087 , C03C3/118 , C03C13/04
摘要: The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
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公开(公告)号:US20190161387A1
公开(公告)日:2019-05-30
申请号:US16264722
申请日:2019-02-01
申请人: AGC INC.
发明人: Shuhei Nomura , Kazutaka Ono
IPC分类号: C03C3/091 , C03C4/20 , H01L27/12 , H01L29/786 , H01L21/762
摘要: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα50/100| of a difference between an average coefficient of thermal expansion α50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα100/200| of a difference between an average coefficient of thermal expansion α100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα200/300| of a difference between an average coefficient of thermal expansion α200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.
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公开(公告)号:US12071373B2
公开(公告)日:2024-08-27
申请号:US17022264
申请日:2020-09-16
申请人: AGC Inc.
发明人: Shuhei Nomura , Kazutaka Ono
CPC分类号: C03C4/16 , C03C3/091 , H01Q1/36 , C03C2204/00
摘要: The present invention relates to a substrate having a dielectric loss tangent (A) as measured at 20° C. and 10 GHz of 0.1 or less, a dielectric loss tangent (B) as measured at 20° C. and 35 GHz of 0.1 or less, and a ratio [a dielectric loss tangent (C) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the dielectric loss tangent (A)] of 0.90-1.10, or a substrate having a relative permittivity (a) as measured at 20° C. and 10 GHz of 4 or more and 10 or less, a relative permittivity (b) as measured at 20° C. and 35 GHz of 4 or more and 10 or less, and a ratio [a relative permittivity (c) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the relative permittivity (a)] of 0.993-1.007.
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公开(公告)号:US11708294B2
公开(公告)日:2023-07-25
申请号:US16720979
申请日:2019-12-19
申请人: AGC Inc.
IPC分类号: C03C3/089 , C03C4/16 , H05K1/03 , C03C3/091 , H05K1/02 , C03B25/08 , C03C3/06 , C03B19/14 , C03C3/087 , C03B17/02 , C03B17/06 , C03C3/118 , C03C13/04
CPC分类号: C03C3/089 , C03C3/091 , C03C4/16 , H05K1/024 , H05K1/03 , C03B17/02 , C03B17/064 , C03B19/14 , C03B25/08 , C03C3/06 , C03C3/087 , C03C3/118 , C03C13/046 , C03C2204/08 , C03C2217/253
摘要: A glass substrate for a high-frequency device, which contains SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of alkaline earth metal oxides in the range of 0.1-13% in terms of mole percent on the basis of oxides, wherein at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
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公开(公告)号:US11594811B2
公开(公告)日:2023-02-28
申请号:US17550080
申请日:2021-12-14
申请人: AGC Inc.
发明人: Shuhei Nomura , Kazutaka Ono
摘要: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
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公开(公告)号:US11554983B2
公开(公告)日:2023-01-17
申请号:US16264722
申请日:2019-02-01
申请人: AGC INC.
发明人: Shuhei Nomura , Kazutaka Ono
IPC分类号: C03C3/091 , C03C4/20 , H01L21/02 , H01L27/12 , H01L29/786 , G02F1/1333 , H01L21/762 , H01L29/66
摘要: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα50/100| of a difference between an average coefficient of thermal expansion α50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα100/200| of a difference between an average coefficient of thermal expansion α100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα200/300| of a difference between an average coefficient of thermal expansion α200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.
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公开(公告)号:US11247933B2
公开(公告)日:2022-02-15
申请号:US16264734
申请日:2019-02-01
申请人: AGC INC.
发明人: Shuhei Nomura , Kazutaka Ono
摘要: An alkali-free glass substrate which is a glass substrate includes, as represented by molar percentage based on oxides, 0.1% to 10% of ZnO. The alkali-free glass substrate has an average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 2.70 ppm/° C. to 3.20 ppm/° C., an average coefficient of thermal expansion α200/300 at 200 to 300° C. of from 3.45 ppm/° C. to 3.95 ppm/° C., and a value α200/300/α50/100 obtained by dividing the average coefficient of thermal expansion α200/300 at 200 to 300° C. by the average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 1.20 to 1.30.
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公开(公告)号:US11114356B2
公开(公告)日:2021-09-07
申请号:US16555702
申请日:2019-08-29
申请人: AGC Inc.
发明人: Yu Hanawa , Shigeki Sawamura , Shuhei Nomura , Kazutaka Ono , Nobuhiko Takeshita , Keisuke Hanashima
IPC分类号: B32B15/04 , H01L23/15 , C03C27/04 , C03C3/085 , C03C3/087 , C03C3/091 , C03C3/093 , C03C17/22 , H01L23/13
摘要: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
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公开(公告)号:US10683233B2
公开(公告)日:2020-06-16
申请号:US15667191
申请日:2017-08-02
申请人: AGC Inc.
发明人: Shuhei Nomura , Kazutaka Ono , Yoshiharu Ooi , Hiroki Hotaka
IPC分类号: B32B15/04 , B32B17/06 , C03C4/08 , C03C3/085 , C03C3/087 , C03B25/02 , C03C27/00 , B32B9/04 , B32B7/12 , C03C3/091 , C03B17/06 , C03C3/093 , C03C17/25 , G02B5/20 , G02B5/22
摘要: A light selective transmission type glass 10 according to the present invention includes: a glass substrate 12; and a light selective transmission layer 11 provided on at least one main surface of the glass substrate 12. The glass substrate 12 has an average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 2.70 ppm/° C. to 3.20 ppm/° C., an average thermal expansion coefficient α200/300 at 200° C. to 300° C. of 3.45 ppm/° C. to 3.95 ppm/° C., a value α200/300/α50/100 obtained by dividing the average thermal expansion coefficient α200/300 at 200° C. to 300° C. by the average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 1.20 to 1.30, and a content of an alkali metal oxide being 0% to 0.1%.
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公开(公告)号:US10515864B2
公开(公告)日:2019-12-24
申请号:US15822859
申请日:2017-11-27
申请人: AGC Inc.
发明人: Yu Hanawa , Shigeki Sawamura , Shuhei Nomura , Kazutaka Ono , Nobuhiko Takeshita , Keisuke Hanashima
摘要: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
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