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公开(公告)号：US09954273B2
公开(公告)日：2018-04-24
申请号：US14676424
申请日：2015-04-01
Applicant: Apple Inc.
Inventor： Boon W. Shiu , Chun-Lung Chen , Erdinc Irci
Abstract: An electronic device may be provided with wireless circuitry that includes antennas. An antenna may be formed from metal traces on a dielectric antenna carrier. The antenna carrier may be formed by molding a layer of plastic onto the surface of a foam member. The foam member may have a low dielectric constant to enhance antenna performance and may be formed from a stiff closed cell plastic foam material. Heat and pressure may be used to attach the layer of plastic to the surface of the foam member without adhesive. A laser may be used to selectively expose portions of the plastic layer to laser light. The plastic layer may include additives that sensitize the plastic layer to light exposure. Electroplated metal traces for the antenna may be formed on the exposed portions of the plastic layer while leaving other portions of the plastic layer uncovered with metal.
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公开(公告)号：US20170222301A1
公开(公告)日：2017-08-03
申请号：US15414287
申请日：2017-01-24
Applicant: Apple Inc.
Inventor： Boon W. Shiu , Jobin Jacob , Jorge L. Rivera Espinoza , Kiavash Baratzadeh , Louie J. Sanguinetti , Ruben Caballero
Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas and first and second radio-frequency modules. The device may include a conductive housing having dielectric antenna windows. The first module may generate first millimeter wave signals in a first communications band. The antenna may transmit the first signals to external equipment through the dielectric window at a transmit power level. The antenna may receive control signals in the second communications band from the external equipment through the dielectric window. The first and second communications bands may include frequencies greater than 10 GHz. The second module may pass the received control signals to the first module to adjust the transmit power level of the first signals transmitted by the antenna. A duplexer may be interposed between the modules and the antenna for isolating the first and second communications bands.
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公开(公告)号：US09664555B2
公开(公告)日：2017-05-30
申请号：US13718850
申请日：2012-12-18
Applicant: Apple Inc.
Inventor： Boon W. Shiu , David Lin Lee , Michael DiVincent
CPC classification number: G01J1/0271 , G01J1/0425 , G01J1/0444 , G01J1/4204 , G01J1/4228 , H04M1/22
Abstract: Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.
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14.发明授权Methodology and apparatus for testing conductive adhesive within antenna assembly 有权用于测试天线组件内的导电胶的方法和装置公开(公告)号：US09404842B2
公开(公告)日：2016-08-02
申请号：US13968166
申请日：2013-08-15
Applicant: Apple Inc.
Inventor： Joshua G. Nickel , Chun-Lung Chen , Tseng-Mau Yang , Nicholas G. Merz , Robert W. Schlub , Boon W. Shiu , Erica J. Tong
Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.
Abstract translation: 用作电子设备内的导电结构之间桥接连接的导电材料的损坏可能导致射频（RF）和其他无线通信的缺陷。 提供了一种用于测试被测设备结构的测试系统。 被测器件结构可以包括衬底和衬底之间的导电材料。 测试系统可以包括用于增加被测装置结构上的拉伸或压缩应力以评估导电材料的弹性的测试夹具。 测试系统还可以包括用于发送RF测试信号并从被测设备结构接收测试数据的测试单元。 所接收的测试数据可以包括来自被测器件结构的散射参数测量，其可以用于确定被测器件结构是否满足期望的RF性能标准。
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公开(公告)号：US10547339B2
公开(公告)日：2020-01-28
申请号：US15414287
申请日：2017-01-24
Applicant: Apple Inc.
Inventor： Boon W. Shiu , Jobin Jacob , Jorge L. Rivera Espinoza , Kiavash Baratzadeh , Louie J. Sanguinetti , Ruben Caballero
IPC: H04B1/3888 , H01Q1/22 , H01Q1/24
Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas and first and second radio-frequency modules. The device may include a conductive housing having dielectric antenna windows. The first module may generate first millimeter wave signals in a first communications band. The antenna may transmit the first signals to external equipment through the dielectric window at a transmit power level. The antenna may receive control signals in the second communications band from the external equipment through the dielectric window. The first and second communications bands may include frequencies greater than 10 GHz. The second module may pass the received control signals to the first module to adjust the transmit power level of the first signals transmitted by the antenna. A duplexer may be interposed between the modules and the antenna for isolating the first and second communications bands.
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Patent Agency Ranking
公开(公告)号：US09865915B2
公开(公告)日：2018-01-09
申请号：US13780787
申请日：2013-02-28
Applicant: Apple Inc.
Inventor： Boon W. Shiu , Jerzy Guterman , Mattia Pascolini
Abstract: A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.
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17.发明申请公开(公告)号：US20160294045A1
公开(公告)日：2016-10-06
申请号：US14676424
申请日：2015-04-01
Applicant: Apple Inc.
Inventor： Boon W. Shiu , Chun-Lung Chen , Erdinc Irci
IPC: H01Q1/38
Abstract: An electronic device may be provided with wireless circuitry that includes antennas. An antenna may be formed from metal traces on a dielectric antenna carrier. The antenna carrier may be formed by molding a layer of plastic onto the surface of a foam member. The foam member may have a low dielectric constant to enhance antenna performance and may be formed from a stiff closed cell plastic foam material. Heat and pressure may be used to attach the layer of plastic to the surface of the foam member without adhesive. A laser may be used to selectively expose portions of the plastic layer to laser light. The plastic layer may include additives that sensitize the plastic layer to light exposure. Electroplated metal traces for the antenna may be formed on the exposed portions of the plastic layer while leaving other portions of the plastic layer uncovered with metal.
Abstract translation: 电子设备可以设置有包括天线的无线电路。 天线可以由介质天线载体上的金属迹线形成。 天线载体可以通过将塑料层模制到泡沫构件的表面上而形成。 泡沫构件可以具有低介电常数以增强天线性能，并且可以由刚性闭孔塑料泡沫材料形成。 可以使用热和压力将塑料层附着到泡沫构件的表面而不粘合。 可以使用激光来选择性地将塑料层的部分暴露于激光。 塑料层可以包括使塑料层对曝光敏感的添加剂。 可以在塑料层的暴露部分上形成用于天线的电镀金属迹线，同时使塑料层的其它部分未被金属覆盖。
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18.发明授权公开(公告)号：US09154972B2
公开(公告)日：2015-10-06
申请号：US13916090
申请日：2013-06-12
Applicant: Apple Inc.
Inventor： Jerzy Guterman , Joshua G. Nickel , Boon W. Shiu , Mattia Pascolini
IPC: H04W24/00
Abstract: A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements formed along its periphery. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The electronic device may be tested using a test system for detecting the presence of manufacturing/assembly defects. The test system may include an RF tester and a test fixture. The device under test (DUT) may be attached to the test fixture during testing. Multiple test probes arranged along the periphery of the DUT may be used to transmit and receive RF test signals for gathering scattering parameter measurements on the device under test. The scattering parameter measurements may then be compared to predetermined threshold values to determine whether the DUT contains any defects.
Abstract translation: 无线电子设备可以设置有天线结构。 天线结构可以由天线接地和沿其周边形成的天线谐振元件的阵列形成。 天线谐振元件可以由围绕天线接地的电介质支撑结构上的金属迹线形成。 可以使用用于检测制造/组装缺陷的存在的测试系统来测试电子设备。 测试系统可以包括RF测试器和测试夹具。 被测设备（DUT）可以在测试期间连接到测试夹具。 沿着DUT周边布置的多个测试探头可用于发送和接收RF测试信号，用于在被测器件上采集散射参数测量。 然后可以将散射参数测量与预定阈值进行比较，以确定DUT是否包含任何缺陷。
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19.发明申请公开(公告)号：US20140240195A1
公开(公告)日：2014-08-28
申请号：US13780787
申请日：2013-02-28
Applicant: APPLE INC.
Inventor： Boon W. Shiu , Jerzy Guteman , Mattia Pascolini
Abstract: A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.
Abstract translation: 无线电子设备可以设置有天线结构。 天线结构可以由天线接地和天线谐振元件阵列形成。 天线谐振元件可以使用焊料电连接到天线接地。 天线谐振元件可以由围绕天线接地的电介质支撑结构上的金属迹线形成。 天线接地可以形成为冲压的金属片，并且可以具有与天线谐振元件相邻的倾斜台阶。 为了在金属天线谐振元件迹线和天线地线的金属片之间形成焊接点，可以将激光施加到焊料附近的天线地板的金属片上。 也可以在焊膏附近设置单独的金属构件，并且可以使用激光加热以将塑料载体上的金属迹线结合。
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公开(公告)号：US20240186685A1
公开(公告)日：2024-06-06
申请号：US18436928
申请日：2024-02-08
Applicant: Apple Inc.
Inventor： Yi Jiang , Boon W. Shiu , Jason C. Sauers , Jia-Woei Chen , Killian J. Poore , Lijun Zhang
CPC classification number: H01Q1/273 , H01Q9/0421
Abstract: A head-mounted device may have a head-mounted housing that is configured to be worn on a head of a user. While the head-mounted device is being worn, left and right displays in optical modules in the head-mounted device may provide images to eye boxes located rearward of the head-mounted device. A forward-facing publicly viewable display on a front portion of the head-mounted device may be covered with a transparent housing portion forming a display cover layer. A dielectric member having a ring-shaped edge portion surrounding the publicly viewable display may be mounted under a corresponding edge portion of the display cover layer. A flexible printed circuit antenna with compound curvature may be laminated to the edge portion of the dielectric member.
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