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    Heat dissipation case and methods for navigating heat from an electronic device
    11.
    发明授权
    Heat dissipation case and methods for navigating heat from an electronic device 有权

    公开(公告)号：US10377000B2

    公开(公告)日：2019-08-13

    申请号：US14836894

    申请日：2015-08-26

    Applicant: Apple Inc.

    Inventor： Edward L. Siahaan ,  Siddhartha Hegde ,  Dhaval N. Shah

    IPC: F28F7/00 ,  G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  B23P15/26 ,  H04M1/02 ,  G06F1/20 ,  H05K7/20

    Abstract: An accessory device suitable for use with an electronic device is disclosed and may be designed to provide a protective cover and dissipate heat from the device. Regarding the latter, the accessory device may include a thermally conductive layer disposed in the accessory device. The thermally conductive layer may extend from a first end of the accessory device proximate to a heat-generating component in the electronic device, to a second end away from the heat-generating component. The thermally conductive layer is designed to navigate heat away from the heat-generating component to the second end where the heat escapes the accessory device. The second end may include one or more openings to facilitate heat transfer from the accessory device. In other embodiments, the accessory device includes a phase change material that absorbs heat and changes to a liquid, then passes the heat to another location in the accessory device.

    Modules for increasing useable space on circuit boards
    13.
    发明授权
    Modules for increasing useable space on circuit boards 有权
    用于增加电路板上可用空间的模块

    公开(公告)号：US09549464B2

    公开(公告)日：2017-01-17

    申请号：US14015938

    申请日：2013-08-30

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K1/11

    CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

    Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

    Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

    Electronic Device Having Components With Stress Visualization Features
    14.
    发明申请
    Electronic Device Having Components With Stress Visualization Features 有权
    具有应力可视化特征的元件的电子器件

    公开(公告)号：US20150300961A1

    公开(公告)日：2015-10-22

    申请号：US14254501

    申请日：2014-04-16

    Applicant: Apple Inc.

    Inventor： Dhaval N. Shah ,  Joseph C. Poole

    IPC: G01N21/88

    CPC classification number: G01N21/8803 ,  G01M5/0041 ,  G01M5/005 ,  G01M5/0091 ,  G01M11/081 ,  G01N21/45 ,  G01N21/8851 ,  G01N2033/0095

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 可以使用这些电子器件结构上的涂层来形成应力感测结构。 应力感测结构可以具有在焊盘之间延伸的条形连接件，或者可以由橡皮布膜形成。 应力感测涂层可以由透明薄膜形成。 透明薄膜可以用单色光照亮，而摄像机捕获所得光学干涉图案的视频图像。 可以在测试期间捕获视频图像，其中设备结构暴露于来自设备和外部对象之间的冲击的压力。 应力感测涂层也可以由暴露于应力时产生裂纹的材料层形成。 应力传感结构可用于评估测试过程中的应力，并在正常使用设备期间监测应力。

    Electronic Device With Mapping Circuitry
    15.
    发明申请
    Electronic Device With Mapping Circuitry 有权
    具有映射电路的电子设备

    公开(公告)号：US20140357316A1

    公开(公告)日：2014-12-04

    申请号：US13904838

    申请日：2013-05-29

    Applicant: Apple Inc.

    Inventor： Vivek Katiyar ,  Andrzej T. Baranski ,  Dhaval N. Shah ,  Stephen Brian Lynch

    IPC: G01B21/16 ,  H04W4/02

    CPC classification number: H04W4/026 ,  G01C3/08 ,  G01C15/002

    Abstract: An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object.

    Abstract translation: 电子设备可以设置有电子部件，例如用于测量设备的周围环境中的物体的距离，面积，体积或其他属性的映射电路。 映射电路可以包括激光传感器和设备位置检测电路。 该装置可以包括配置成使用激光传感器和装置位置检测电路来收集激光采样数据和装置位置数据的处理电路。 可以在将激光产生的激光束指向激光传感器中的一个或多个采样点的表面（例如墙壁的表面）上的同时收集激光采样数据和设备位置数据。 通过使用设备位置检测电路跟踪设备位置和方向，可以在从相对于对象的任何位置收集激光采样数据的同时映射对象。

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