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    Connector bracket
    15.
    发明授权
    Connector bracket 有权
    连接器支架

    公开(公告)号：US09099856B2

    公开(公告)日：2015-08-04

    申请号：US14318345

    申请日：2014-06-27

    Applicant: APPLE INC.

    Inventor： Erik A. Uttermann ,  John Raff ,  Piotr S. Trzaskos

    IPC: H05K5/00 ,  H02G15/007 ,  H01R13/516 ,  H01R13/74

    CPC classification number: H02G15/007 ,  H01R13/516 ,  H01R13/74

    Abstract: Brackets may be mated with or coupled to an opening of an electronic device enclosure or housing for receiving plug connectors to reinforce the receptacle connector and/or device housing and potentially reduce damage/breakage. For example, a bracket can have a front face with a curvature. A back face of the bracket can include a first opening that communicates with a cavity. The cavity can be defined at least in part by upper and lower opposing inner surfaces, the lower inner surface including a portion that extends parallel to a portion of the bracket front face. The bracket can also include a hollow protrusion extending from the bracket front face in a front direction. The hollow protrusion can include an opening that communicates with the opening of the back face and extends through the hollow protrusion. Methods for manufacturing the connector bracket are also provided.

    Abstract translation: 托架可以与电子设备外壳或外壳的开口配合或联接，用于接收插头连接器以加强插座连接器和/或设备外壳并且潜在地减少损坏/破损。 例如，支架可以具有曲率的前表面。 支架的后表面可以包括与空腔连通的第一开口。 空腔可以至少部分地由上下相对的内表面限定，下内表面包括平行于支架前表面的一部分延伸的部分。 支架还可以包括从支架前面沿正面方向延伸的中空突起。 中空突起可以包括与后表面的开口连通且延伸穿过中空突起的开口。 还提供了制造连接器支架的方法。

    Electronic devices with flexible displays and cover layers with grooves
    16.
    发明授权
    Electronic devices with flexible displays and cover layers with grooves 有权

    公开(公告)号：US11825680B2

    公开(公告)日：2023-11-21

    申请号：US17095639

    申请日：2020-11-11

    Applicant: Apple Inc.

    Inventor： Jiang Ai ,  Erik A. Uttermann ,  Soyoung Kim

    IPC: H10K50/84 ,  H10K102/00

    CPC classification number: H10K50/841 ,  H10K2102/311

    Abstract: An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. To facilitate bending about the bend axis, the display may have layers such as a display cover layer with grooves or other recesses. The recesses form a flexible portion in the display layer. The display layer may be formed from glass or other materials that are transparent. Elastomeric material, fluids, and other materials may be placed in the recesses in the display layer. The material in the display layer may have an index of refraction that is matched to the index of refraction of the display layer. A hinge may be formed between rigid planar layers that are separated by a gap. Flexible layers that lie flush with opposing surfaces of the rigid planar layers may be used to span the gap.

    Electronic devices with flexible displays
    17.
    发明授权
    Electronic devices with flexible displays 有权

    公开(公告)号：US10600989B1

    公开(公告)日：2020-03-24

    申请号：US16019431

    申请日：2018-06-26

    Applicant: Apple Inc.

    Inventor： Jiang Ai ,  Erik A. Uttermann ,  Soyoung Kim

    IPC: H01L51/52

    Abstract: An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. To facilitate bending about the bend axis, the display may have layers such as a display cover layer with grooves or other recesses. The recesses form a flexible portion in the display layer. The display layer may be formed from glass or other materials that are transparent. Elastomeric material, fluids, and other materials may be placed in the recesses in the display layer. The material in the display layer may have an index of refraction that is matched to the index of refraction of the display layer. A hinge may be formed between rigid planar layers that are separated by a gap. Flexible layers that lie flush with opposing surfaces of the rigid planar layers may be used to span the gap.

    Induction activated thermal bonding
    20.
    发明授权
    Induction activated thermal bonding 有权
    感应激活热粘合

    公开(公告)号：US09338832B2

    公开(公告)日：2016-05-10

    申请号：US13889225

    申请日：2013-05-07

    Applicant: Apple Inc.

    Inventor： Derek W. Wright ,  Erik A. Uttermann ,  Stephen R. McClure

    IPC: H05B6/10 ,  H05B6/14

    CPC classification number: H05B6/105 ,  H05B6/14

    Abstract: The described embodiment relates generally to the field of inductive heating. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a radio-frequency (RF) receiver structure are disclosed for the purpose of completing an inductive bonding process without causing harm to adjacent electrical components.

    Abstract translation: 所描述的实施例大体上涉及感应加热领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了一种用于成形射频（RF）接收机结构的方法，用于完成感应接合过程而不会对相邻的电气部件造成伤害。

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