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    TEXTILE PRODUCT HAVING THINNED REGIONS
    11.
    发明申请
    TEXTILE PRODUCT HAVING THINNED REGIONS 审中-公开
    具有稀薄区域的纺织产品

    公开(公告)号：US20140255663A1

    公开(公告)日：2014-09-11

    申请号：US13794135

    申请日：2013-03-11

    Applicant: Apple Inc.

    Inventor： James C. Whitley ,  John J. Baker ,  Kathryn P. Crews ,  Yoji Hamada

    IPC: D06M10/00

    CPC classification number: D04H1/74 ,  D04H1/62 ,  Y10T428/2481

    Abstract: Embodiments described herein may take the form of a textile fabric, including: a first region defined by a first plurality of textile fibers; a second region adjacent the first region and being formed from a second plurality of textile fibers and a hot melt material adjacent the second plurality of textile fibers; wherein the first region is free of hot melt material. Other embodiments may take the form of a method for fabricating a textile product, including the operations of: applying heat to a textile having associated hot melt fibers, thereby melting the hot melt fibers; modifying a mechanical property of a portion of the textile by introducing a solvent to the textile; and stopping an action of the solvent on the textile when the mechanical property reaches a target.

    Abstract translation: 本文描述的实施例可以采取纺织织物的形式，包括：由第一多个纺织纤维限定的第一区域; 邻近所述第一区域并由第二多个纺织纤维和邻近所述第二多个纺织纤维的热熔体材料形成的第二区域; 其中所述第一区域不含热熔材料。 其它实施方案可以采用制造纺织品的方法的形式，包括以下操作：将热量施加到具有相关联的热熔纤维的织物上，从而熔化热熔纤维; 通过向织物引入溶剂来改变织物的一部分的机械性能; 并且当机械性能达到目标时停止溶剂在织物上的作用。

    Structured fabrics for electronic devices
    15.
    发明授权
    Structured fabrics for electronic devices 有权

    公开(公告)号：US10966332B2

    公开(公告)日：2021-03-30

    申请号：US15891533

    申请日：2018-02-08

    Applicant: Apple Inc.

    Inventor： Yohji Hamada ,  John J. Baker ,  Peter F. Coxeter ,  Benjamin M. Rappoport ,  Joseph B. Walker

    IPC: B32B3/26 ,  B32B5/02 ,  H05K5/03 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00

    Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.

    Handsfree beam pattern configuration
    16.
    发明授权
    Handsfree beam pattern configuration 有权

    公开(公告)号：US10251008B2

    公开(公告)日：2019-04-02

    申请号：US15037302

    申请日：2014-09-25

    Applicant: Apple Inc.

    Inventor： John J. Baker ,  Martin E. Johnson ,  Afrooz Family ,  Michael B. Howes ,  Craig M. Stanley ,  Brad G. Boozer

    IPC: H04S7/00 ,  G10L17/04 ,  G10L17/06 ,  H04R1/08 ,  H04R1/40

    Abstract: An audio system that adjusts one or more beam patterns emitted by one or more loudspeaker arrays based on the preferences of users/listeners is described. The audio system includes an audio receiver that contains a listener location estimator, a listener identifier, and a voice command processor. Inputs from the listener location estimator, the listener identifier, and the voice command processor are fed into an array processor. The array processor drives the one or more loudspeaker arrays to emit beam patterns into the listening area based on inputs from each of these devices. By examining the location, preferred usage settings, and voice commands from listeners, the generated beam patterns are customized to the explicit and implicit preferences of the listeners with minimal direct input. Other embodiments are also described.

    Electronic device with array of reworkable components
    19.
    发明授权
    Electronic device with array of reworkable components 有权

    公开(公告)号：US09629272B1

    公开(公告)日：2017-04-18

    申请号：US14720376

    申请日：2015-05-22

    Applicant: Apple Inc.

    Inventor： Phillip Michael Hobson ,  Nathan P. Bosscher ,  John J. Baker ,  Craig M. Stanley ,  Brad G. Boozer

    IPC: H05K7/14 ,  H01R11/11

    CPC classification number: G06F1/1658 ,  G06F1/183

    Abstract: An array of electrical components may be mounted in openings in an electronic device housing. Gaskets may be used to seal the electrical components to a housing wall. The housing wall may be planar or may have a cylindrical shape or other curved shape. The electrical components may be mounted to the housing wall using screws and nuts. Each nut may have a central member with opposing stops at the ends of the central member. An opening in each central member may receive a screw to allow the nut to rotate between an installation position and a locked position. The openings in the housing wall may have scalloped extensions that allow the nuts to clear the housing wall while the components are being inserted into the housing. Following installation, the nuts may be rotated into the locked positions.

    Connection structures for electrical components in an electronic device
    20.
    发明授权
    Connection structures for electrical components in an electronic device 有权
    电子设备中电气部件的连接结构

    公开(公告)号：US09496668B1

    公开(公告)日：2016-11-15

    申请号：US14720059

    申请日：2015-05-22

    Applicant: Apple Inc.

    Inventor： John J. Baker ,  Brad G. Boozer ,  Craig M. Stanley ,  Erik L. Wang ,  Nathan P. Bosscher ,  Phillip Michael Hobson ,  Stephen P. Zadesky

    IPC: H01R13/74 ,  H01R13/73 ,  H01R35/02 ,  H01R13/50 ,  H01R25/00 ,  H01R27/02 ,  H01R13/717 ,  H01R13/66

    CPC classification number: H01R35/02 ,  H01R12/91 ,  H01R13/50 ,  H01R13/665 ,  H01R13/6683 ,  H01R13/717 ,  H01R25/006 ,  H01R27/02

    Abstract: An electronic device may have a rigid support structure to which electrical components are mounted. The rigid support structure may be an electronic device housing structure such as a housing wall having openings that receive the electrical components. The electrical components may have electrical component connectors. A printed circuit board may be used to convey signals for the electrical components. Connectors may be mounted to the printed circuit board. Lateral shift accommodation structures may be formed between the electrical component connectors and the electrical components or in the vicinity of the connectors on the printed circuit to allow the connectors on the printed circuit to mate with the electrical component connectors of the rigidly mounted electrical components.

    Abstract translation: 电子设备可以具有刚性支撑结构，电气部件被安装到该刚性支撑结构上。 刚性支撑结构可以是电子设备壳体结构，例如具有容纳电气部件的开口的壳体壁。 电气部件可以具有电气部件连接器。 印刷电路板可用于传送电气部件的信号。 连接器可以安装到印刷电路板上。 可以在电气部件连接器和电气部件之间或印刷电路上的连接器附近形成侧向移动容纳结构，以允许印刷电路上的连接器与刚性安装的电气部件的电气部件连接器配合。

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