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    Discrete optical unit on a substrate of an integrated photonics chip
    11.
    发明授权
    Discrete optical unit on a substrate of an integrated photonics chip 有权

    公开(公告)号：US11644618B2

    公开(公告)日：2023-05-09

    申请号：US17254810

    申请日：2019-06-21

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Lexie Nicole Schachne ,  Jason Pelc

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42

    CPC classification number: G02B6/12004 ,  G02B6/122 ,  G02B6/4244 ,  G02B2006/12104 ,  G02B2006/12138

    Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

    Systems and methods for forming thin bulk junction thermoelectric devices in package
    17.
    发明授权
    Systems and methods for forming thin bulk junction thermoelectric devices in package 有权

    公开(公告)号：US11502236B1

    公开(公告)日：2022-11-15

    申请号：US17214128

    申请日：2021-03-26

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Gregory L. Tice ,  Mario J. Costello ,  Reid A. Black ,  Vijay M. Iyer

    IPC: H01L35/32 ,  H01L35/16 ,  G05D23/19 ,  H01L35/34 ,  H01L35/18

    Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

    Integrated photonics device having integrated edge outcouplers
    18.
    发明授权
    Integrated photonics device having integrated edge outcouplers 有权

    公开(公告)号：US11226459B2

    公开(公告)日：2022-01-18

    申请号：US16969034

    申请日：2019-02-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Jason S. Pelc ,  Mario J. Costello

    IPC: G02B6/42 ,  G01N21/47 ,  G01N21/49

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Discrete Optical Unit on a Substrate of an Integrated Photonics Chip
    19.
    发明申请
    Discrete Optical Unit on a Substrate of an Integrated Photonics Chip 有权

    公开(公告)号：US20210263216A1

    公开(公告)日：2021-08-26

    申请号：US17254810

    申请日：2019-06-21

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Lexie Nicole Schachne ,  Jason Pelc

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/122

    Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

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