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公开(公告)号:US11469123B2
公开(公告)日:2022-10-11
申请号:US16994413
申请日:2020-08-14
Applicant: APPLIED MATERIALS, INC.
Inventor: Nicholas Michael Bergantz , Jeffrey Hudgens , Doug McAllister , Helder Lee
IPC: H01L21/67 , H01L21/673
Abstract: A method for detecting positions of replacement parts, wafers, or empty carriers for a replacement part stored at a replacement parts storage container is provided. A container is received at a at a load port of a factory interface of an electronics processing system. The container is configured to store replacement parts for a process chamber of the electronics processing system. A robot arm is moved according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions of one or more replacement parts in the container. Regions of the container that do not contain replacement parts are determined. The robot arm is moved according to a second mapping pattern to identify, within the regions of the container that do not contain replacement parts, using the detection system, a position in the container of at least one of a wafer or an empty carrier for a replacement part. A mapping of positions of the one or more replacement parts and of positions of at least one of the empty carrier or the wafer in the container is recorded in a storage medium.
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12.
公开(公告)号:US11413767B2
公开(公告)日:2022-08-16
申请号:US16666963
申请日:2019-10-29
Applicant: Applied Materials, Inc.
Inventor: Preetham Kariyaiah Shivanna , Jeffrey Hudgens , Paul Zachary Wirth
Abstract: A system includes a light emitter attached to a destination chamber, the light emitter to emit a collimated light beam across an entrance to the destination chamber. The system includes an end effector attached to a distal end of an arm of a robot. The system includes a two-dimensional (2D) area sensor disposed on the end effector at a location that coincides with the collimated light beam while the end effector reaches within the destination chamber. The 2D area sensor is to detect a location of the collimated light beam incident on a surface of the 2D area sensor and transmit, to a controller coupled to the robot, sensing data including the location.
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公开(公告)号:US20210217650A1
公开(公告)日:2021-07-15
申请号:US17216439
申请日:2021-03-29
Applicant: Applied Materials, Inc.
Inventor: Leon Volfovski , Andreas Schmid , Denis Martin Koosau , Nicholas Michael Kopec , Steven Babayan , Douglas R. McAllister , Helder Lee , Jeffrey Hudgens , Damon K. Cox
IPC: H01L21/687 , H01L21/68 , H01L21/683
Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.
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公开(公告)号:US20230058606A1
公开(公告)日:2023-02-23
申请号:US18045119
申请日:2022-10-07
Applicant: APPLIED MATERIALS, INC.
Inventor: Nicholas Michael Bergantz , Jeffrey Hudgens , Doug McAllister , Helder Lee
IPC: H01L21/67 , H01L21/673
Abstract: A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.
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公开(公告)号:US20220324100A1
公开(公告)日:2022-10-13
申请号:US17850296
申请日:2022-06-27
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Kopec , Lyle Kosinski , Matvey Farber , Jeffrey Hudgens
IPC: B25J9/16 , H01L21/67 , H01L21/00 , H01L21/673 , B25J21/00
Abstract: An autoteach system includes an autoteach pin that is a scannable feature having a fixed position within the autoteach system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system. The autoteach pin includes a first portion including a cylindrical sidewall. The robot arm is to use the first portion to locate the fixed position within the autoteach system. The autoteach portion further includes a second portion including planar sidewalls that are configured to enable calibration of robot arm error.
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公开(公告)号:US20240071796A1
公开(公告)日:2024-02-29
申请号:US18243433
申请日:2023-09-07
Applicant: Applied Materials, Inc.
Inventor: Alex Berger , Jeffrey Hudgens , Eric Englhardt
IPC: H01L21/677 , B25J11/00 , B65G54/02
CPC classification number: H01L21/67709 , B25J11/0095 , B65G54/02
Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.
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公开(公告)号:US20210358788A1
公开(公告)日:2021-11-18
申请号:US17370802
申请日:2021-07-08
Applicant: Applied Materials, Inc.
Inventor: Alex Berger , Jeffrey Hudgens , Eric Englhardt
IPC: H01L21/677 , B65G54/02 , B25J11/00
Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.
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公开(公告)号:US10964584B2
公开(公告)日:2021-03-30
申请号:US16417369
申请日:2019-05-20
Applicant: Applied Materials, Inc.
Inventor: Leon Volfovski , Andreas Schmid , Denis Martin Koosau , Nicholas Michael Kopec , Steven Babayan , Douglas R. McAllister , Helder Lee , Jeffrey Hudgens , Damon K. Cox
IPC: H01L21/68 , H01L21/687 , H01L21/683 , H01L21/677
Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.
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公开(公告)号:US20240304478A1
公开(公告)日:2024-09-12
申请号:US18666686
申请日:2024-05-16
Applicant: APPLIED MATERIALS, INC.
Inventor: Nicholas Michael Bergantz , Jeffrey Hudgens , Doug McAllister , Helder Lee
IPC: H01L21/67 , H01L21/673
CPC classification number: H01L21/67265 , H01L21/67356
Abstract: A system includes a factory interface, a load port connected to the factory interface, and a system controller. The system controller is to, responsive to detecting that a container is received at the load port, determine a type of parts for storage at the container. One or more mapping patterns associated with the determined type of parts is identified. A detection system of robot arm(s) of the factory interface is moved according to the identified mapping pattern(s) to detect one or more parts stored by the container. A mapping of the container is determined based on the movement of the robot arm(s). The mapping indicates regions of the container that stores detected parts and a position of each of the detected parts. Based on the mapping, the robot arm(s) either remove a detected part form the container or place an additional part in the container.
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公开(公告)号:US12076863B2
公开(公告)日:2024-09-03
申请号:US17850296
申请日:2022-06-27
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Kopec , Lyle Kosinski , Matvey Farber , Jeffrey Hudgens
IPC: H01L21/67 , B25J9/16 , B25J21/00 , H01L21/00 , H01L21/673
CPC classification number: B25J9/163 , B25J9/1653 , B25J21/005 , H01L21/00 , H01L21/67 , H01L21/6735 , G05B2219/45031
Abstract: An autoteach system includes an autoteach pin that is a scannable feature having a fixed position within the autoteach system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system. The autoteach pin includes a first portion including a cylindrical sidewall. The robot arm is to use the first portion to locate the fixed position within the autoteach system. The autoteach portion further includes a second portion including planar sidewalls that are configured to enable calibration of robot arm error.
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