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公开(公告)号：US10519979B2
公开(公告)日：2019-12-31
申请号：US15851287
申请日：2017-12-21
Applicant: ASUSTek COMPUTER INC.
Inventor： Hsin-Chen Lin , Ing-Jer Chiou
Abstract: A centrifugal fan is disclosed. The centrifugal fan includes a housing; and a fan wheel, disposed in the housing, the fan wheel including: a fan hub; a plurality of inner fan blades, each of the inner fan blades includes a first contact surface and a second contact surface, the first contact surfaces are connected to the fan hub respectively; a plurality of connection structures, each of the connections structure includes a first side and a second side; and a plurality of outer fan blades, each of the outer fan blades includes a first end and a second end; wherein the second contact surfaces are connected to the first sides respectively, the first ends are connected to the second sides respectively.
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公开(公告)号：US10517190B2
公开(公告)日：2019-12-24
申请号：US15618166
申请日：2017-06-09
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen Lin , Ing-Jer Chiou
IPC: H05K7/20 , F04D19/00 , F04D25/08 , F04D27/00 , F04D29/32 , F04D29/52 , F04D29/64 , H05K7/18 , H05K7/14 , F04D29/40 , F04D29/42 , F04D29/28 , F04D17/16
Abstract: A fan module includes a first casing, a driving motor disposed in the first casing, a first rotor connected to the first driving motor, a second casing, a second rotor pivotally configured in the second casing, at least one guiding member and a shift apparatus connected to the first casing and the second casing, the first rotor includes a first rotating shaft and a plurality of first blades, the second rotor includes a second rotating shaft and a plurality of second blades, the guiding member is disposed on the first blade and the second blade. The whole height of the blade is adjusted by adjusting the distance between the two group blades, then the efficiency of the fan is improved effectively to optimize the noise level and the air flow.
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公开(公告)号：US20190265761A1
公开(公告)日：2019-08-29
申请号：US16411328
申请日：2019-05-14
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen Lin , Ing-Jer Chiou
Abstract: An electronic device is provided. The electronic device includes a casing and a moveable plate. The moveable plate disposed at the outside of the casing via the hinge. The moveable plate is selectively moved toward or away from the casing.
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公开(公告)号：US20180187693A1
公开(公告)日：2018-07-05
申请号：US15841499
申请日：2017-12-14
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen Lin , Ing-Jer Chiou
CPC classification number: F04D29/30 , F04D29/281 , F04D29/4226 , F04D29/667
Abstract: A centrifugal fan is provided. The centrifugal fan comprises a housing and an impeller. The housing includes an upper cover and a lower cover. The impeller is configured in the housing. The impeller includes a hub, a plurality of blades and an air guiding structure. The hub is pivoted on the lower cover and rotates around a rotation axis. The rotation axis extends in the axial direction. The blades are connected to a peripheral surface of the hub and configured between the upper cover and the lower cover. The air guiding structure is connected to the blades. An angle between the air guiding structure and the rotation axis increases along with a distance in the direction away from the hub.
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公开(公告)号：US09313915B2
公开(公告)日：2016-04-12
申请号：US14072758
申请日：2013-11-05
Applicant: ASUSTeK COMPUTER INC.
Inventor： Chia-Ching Niu , Ing-Jer Chiou , Cheng-Yu Wang
IPC: H02B1/00 , H02B1/56 , H05K7/20 , H05K1/00 , H01R13/46 , H05K5/00 , H01L23/34 , F28F7/00 , F28D15/00 , G06F1/20 , F28D15/02 , F04D29/40
CPC classification number: H05K7/20 , F04D29/40 , F28D15/02 , G06F1/20 , G06F1/203 , H05K7/20145 , H05K7/20445
Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.
Abstract translation: 电子装置包括上盖，与上盖结合的下盖和导热支柱。 由上盖和下盖形成容纳空间。 导热柱设置在容纳空间中并与上盖和下盖物理连接，以平衡上盖和下盖的温度。
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Patent Agency Ranking
公开(公告)号：US09210832B2
公开(公告)日：2015-12-08
申请号：US13953742
申请日：2013-07-30
Applicant: ASUSTeK COMPUTER INC.
Inventor： Kuang-Yu Chang , Ing-Jer Chiou
IPC: H05K7/20 , G06F1/20 , H01L23/427
CPC classification number: H05K7/2039 , G06F1/203 , H01L23/4275 , H01L2924/0002 , H05K7/20509 , H01L2924/00
Abstract: A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.
Abstract translation: 提供了应用于电子设备的热缓冲元件。 热缓冲元件包括吸热材料和多个金属颗粒。 吸热材料相对于电子设备的热源设置。 金属颗粒分布在吸热材料中。 本发明解决了电子产品散热不均匀的问题，使得用户感觉更舒适。
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公开(公告)号：US20250040078A1
公开(公告)日：2025-01-30
申请号：US18479115
申请日：2023-10-02
Applicant: ASUSTeK COMPUTER INC.
Inventor： Ing-Jer Chiou
Abstract: A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.
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公开(公告)号：US12055157B1
公开(公告)日：2024-08-06
申请号：US18333325
申请日：2023-06-12
Applicant: ASUSTEK COMPUTER INC.
Inventor： Hsin Chen Lin , Ing-Jer Chiou
CPC classification number: F04D29/281 , F04D17/08 , F04D29/4226
Abstract: A centrifugal fan includes upper and lower covers, a fan frame, and a fan blade module. The fan frame is located between the lower and upper covers. The fan frame, and the lower and upper covers form a space. The fan blade module disposed in the space includes a hub, a connecting ring, inner and outer ring blades. The connecting ring surrounding the hub forms an inner ring region and an outer ring region around the hub and has a ring height and a ring width greater than the ring height. The inner ring blades are connected to the hub and the connecting ring, and circularly arranged in the inner ring region. The outer ring blades are connected to the connecting ring, and circularly arranged in the outer ring region. A quantity of the outer ring blades is greater than a quantity of the inner ring blades.
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公开(公告)号：US11859633B2
公开(公告)日：2024-01-02
申请号：US17859797
申请日：2022-07-07
Applicant: ASUSTEK COMPUTER INC.
Inventor： Hsin Chen Lin , Ing-Jer Chiou
CPC classification number: F04D29/281 , F04D29/30 , F04D29/441
Abstract: Provided is a centrifugal fan. The centrifugal fan includes an air inlet, a shaft, and a plurality of blades. The blades are arranged around the shaft. Each of the blades includes an air guiding portion on a side of the blade facing the air inlet. The air guiding portion includes a first curve and a second curve. An air inflow channel is formed between the first curve and the second curve of two adjacent air guiding portions respectively. A width of the air inflow channel is expanded in a direction away from the air inlet according to an expanding ratio.
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公开(公告)号：US11859627B2
公开(公告)日：2024-01-02
申请号：US17079568
申请日：2020-10-26
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen Lin , Ing-Jer Chiou
IPC: F04D27/00
CPC classification number: F04D27/004 , F05D2270/02 , F05D2270/303 , F05D2270/313 , F05D2270/708
Abstract: A fan control system includes a fan, a first temperature sensor, a calculating unit, a logic controller, and a memory unit. The first temperature sensor continuously senses temperatures of a device during a time period, in order to obtain a plurality of sampled temperatures. The calculating unit selects N1 latest sampled temperatures and N2 latest sampled temperatures from the sampled temperatures, and calculates a first average temperature according to the N1 sampled temperatures and a second average temperature according to the N2 sampled temperatures. N1 and N2 are positive integers. The logic controller is configured to select one of the first average temperature and the second average temperature to output as a compensation temperature. The memory unit is configured to store an operating table, and configured to output a rotational speed control signal to the fan corresponding to the operating table according to the compensation temperature.
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