公开(公告)号：US20220084972A1

公开(公告)日：2022-03-17

申请号：US17534358

申请日：2021-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20210167016A1

公开(公告)日：2021-06-03

申请号：US16702213

申请日：2019-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20210134751A1

公开(公告)日：2021-05-06

申请号：US16673699

申请日：2019-11-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20250098378A1

公开(公告)日：2025-03-20

申请号：US18369107

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pei-Jung YANG ,  Jr-Wei LIN ,  Mei-Ju LU ,  Chi-Han CHEN

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16

Abstract: A method for manufacturing an optoelectronic structure and a package structure are provided. The method includes providing a substrate and a light source module and a photonic component over the substrate; and adjusting a lens structure to a unit specific position related to the substrate to couple an optical signal from the light source module to the photonic component.

公开(公告)号：US20240345343A1

公开(公告)日：2024-10-17

申请号：US18135080

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4274 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4295 ,  G02B6/43

Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.

公开(公告)号：US20240302589A1

公开(公告)日：2024-09-12

申请号：US18120346

申请日：2023-03-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/122

CPC classification number: G02B6/122

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.

公开(公告)号：US20230120036A1

公开(公告)日：2023-04-20

申请号：US17506462

申请日：2021-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.

公开(公告)号：US20220196934A1

公开(公告)日：2022-06-23

申请号：US17127666

申请日：2020-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Sin-Yuan MU ,  Mei-Ju LU

IPC: G02B6/42

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.

公开(公告)号：US20220181264A1

公开(公告)日：2022-06-09

申请号：US17677962

申请日：2022-02-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L21/768 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20170254956A1

公开(公告)日：2017-09-07

申请号：US15057936

申请日：2016-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Lun WANG ,  Yi-Min CHIN ,  Mei-Ju LU ,  Jia-Hao ZHANG

IPC: G02B6/26 ,  G02B6/34 ,  G02B6/42

CPC classification number: G02B6/262 ,  G02B6/34 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4214

Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.