公开(公告)号：US20240264369A1

公开(公告)日：2024-08-08

申请号：US18105704

申请日：2023-02-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/12 ,  H01L25/18

CPC classification number: G02B6/12004 ,  H01L25/18 ,  H01L24/02 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/02372 ,  H01L2224/02381 ,  H01L2224/06181 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/214 ,  H01L2224/32225

Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.

公开(公告)号：US20240345343A1

公开(公告)日：2024-10-17

申请号：US18135080

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4274 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4295 ,  G02B6/43

Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.

公开(公告)号：US20240345337A1

公开(公告)日：2024-10-17

申请号：US18135077

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tai-Hsiang LIU ,  Hung-Yi LIN ,  Wen Chieh YANG

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4249

Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.

公开(公告)号：US20240302589A1

公开(公告)日：2024-09-12

申请号：US18120346

申请日：2023-03-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/122

CPC classification number: G02B6/122

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.

公开(公告)号：US20210066264A1

公开(公告)日：2021-03-04

申请号：US16551180

申请日：2019-08-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung HUANG ,  Wen Chieh YANG

IPC: H01L25/16 ,  H01L23/13 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683

Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.