公开(公告)号：US20180358291A1

公开(公告)日：2018-12-13

申请号：US15618085

申请日：2017-06-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua CHEN ,  Sheng-Chi HSIEH ,  Cheng-Yuan KUNG

IPC: H01L23/498 ,  H05K1/16 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H05K1/162

Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.

公开(公告)号：US20180247904A1

公开(公告)日：2018-08-30

申请号：US15442492

申请日：2017-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Chi HSIEH ,  Hung-Yi LIN ,  Cheng-Yuan KUNG ,  Pao-Nan LEE ,  Chien-Hua CHEN

IPC: H01L23/66 ,  H03H1/00 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/645 ,  H01L2223/6616 ,  H01L2223/6672 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0523 ,  H03H9/0557 ,  H03H9/1014 ,  H03H9/1071

Abstract: The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.