-
公开(公告)号：US07849905B2
公开(公告)日：2010-12-14
申请号：US11633499
申请日：2006-12-04
IPC分类号： B29C63/00 , B29C65/00 , B32B37/00 , B32B41/00 , B32B38/04 , B65C9/40 , G05G15/00 , B31F1/28 , B26D5/00
CPC分类号： H01L21/67225 , H01L21/67092 , H01L21/68764 , Y10S156/93 , Y10S156/941 , Y10T156/107 , Y10T156/108 , Y10T156/1111 , Y10T156/1944
摘要： A stripping apparatus has a simplified structure for stripping a supporting plate from a layered structure, occupies less space, and strips a supporting plate in a shorter period of time. The stripping apparatus comprises a transfer robot, a cassette, a stripping device and a cleaning device which surround the transfer robot. The stripping device comprises a chucking plate for attracting and retaining a layered structure, and a stripping plate for stripping the supporting plate from the layered structure. The chucking plate is constructed so as to be rotated by 180° within a vertical plane, elevated and lowered in a vertical direction in a state of retaining the layered structure.
摘要翻译： 剥离装置具有用于从分层结构剥离支撑板的简化结构，占用更少的空间，并且在更短的时间段内剥离支撑板。 剥离装置包括传送机器人，盒，剥离装置和围绕传送机器人的清洁装置。 剥离装置包括用于吸引和保持层状结构的夹持板，以及用于从分层结构剥离支撑板的剥离板。 夹持板被构造成在保持层状结构的状态下在垂直平面内旋转180°，在垂直方向上升高和降低。
-
公开(公告)号：US20100024853A1
公开(公告)日：2010-02-04
申请号：US12448916
申请日：2008-01-11
IPC分类号： B08B3/12
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit comprises: a supply part for supplying a support plate surface with a liquid solvent; a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region; and a vibration unit for vibrating the liquid solvent.
摘要翻译： 为了提供液体溶剂抵接单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵接单元包括：用于向支撑板表面供应液体的供应部分 溶剂; 用于将供应的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分; 以及用于振动液体溶剂的振动单元。
-
公开(公告)号：US20070128832A1
公开(公告)日：2007-06-07
申请号：US11607401
申请日：2006-12-01
CPC分类号： B24B37/30 , H01L21/67132 , H01L21/6835 , H01L21/6838
摘要： A method for attaching a supporting plate which makes it possible to prevent the groove pattern of the supporting plate from being transferred to the substrate, and to prevent non-uniformity from occurring when the surface of the substrate is ground. One surface of the supporting plate is attached to the substrate with an adhesive, and the opposite surface of the supporting plate to which a transfer preventing sheet is attached is mounted and fixed by attraction onto the top surface of an attracting head, and the top surface (no circuit is formed) of the semiconductor wafer is ground by a grinder in this state.
摘要翻译： 一种用于安装支撑板的方法，其使得可以防止支撑板的凹槽图案被转移到基板，并且当基板的表面被研磨时防止发生不均匀。 支撑板的一个表面用粘合剂附接到基底，并且附着有防转移片的支撑板的相对表面通过吸引安装并固定到吸引头的顶表面上，并且顶表面 在该状态下，通过研磨机研磨半导体晶片的无电路（无电路形成）。
-
公开(公告)号：US20070125751A1
公开(公告)日：2007-06-07
申请号：US11633499
申请日：2006-12-04
CPC分类号： H01L21/67225 , H01L21/67092 , H01L21/68764 , Y10S156/93 , Y10S156/941 , Y10T156/107 , Y10T156/108 , Y10T156/1111 , Y10T156/1944
摘要： A stripping apparatus has a simplified structure for stripping a supporting plate from a layered structure, occupies less space, and strips a supporting plate in a shorter period of time. The stripping apparatus comprises a transfer robot, a cassette, a stripping device and a cleaning device which surround the transfer robot. The stripping device comprises a chucking plate for attracting and retaining a layered structure, and a stripping plate for stripping the supporting plate from the layered structure. The chucking plate is constructed so as to be rotated by 180° within a vertical plane, elevated and lowered in a vertical direction in a state of retaining the layered structure.
摘要翻译： 剥离装置具有用于从分层结构剥离支撑板的简化结构，占用更少的空间，并且在更短的时间段内剥离支撑板。 剥离装置包括传送机器人，盒，剥离装置和围绕传送机器人的清洁装置。 剥离装置包括用于吸引和保持层状结构的夹持板，以及用于从分层结构剥离支撑板的剥离板。 夹持板被构造成在保持层状结构的状态下在垂直平面内旋转180°，在垂直方向上升高和降低。
-
公开(公告)号：US08148457B2
公开(公告)日：2012-04-03
申请号：US12514633
申请日：2007-09-26
IPC分类号： C08L31/00
CPC分类号： C09J153/00 , C08F212/08 , C08F220/06 , C08F220/18 , C08F290/046 , C08F2220/301 , C09J7/381 , C09J133/10 , C09J133/12 , C09J135/06 , C09J2205/114 , C09J2433/00 , C09J2453/00 , Y10T428/2852 , Y10T428/2891
摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。
-
16.发明授权Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate 有权支撑板的安装装置和安装装置以及支撑板的安装方法公开(公告)号：US08136564B2
公开(公告)日：2012-03-20
申请号：US11633604
申请日：2006-12-04
IPC分类号： B32B37/10
CPC分类号： B32B38/1841 , B32B37/0046 , B32B2038/1891 , B32B2309/68 , B32B2457/14 , H01L21/68 , H01L21/68742 , Y10T156/17
摘要： An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.
摘要翻译： 一种连接装置，其能够在基板和支撑板的直径基本相同的情况下准确地进行对准，包括用于在其上安装半导体晶片的安装板，用于将支撑板按压到半导体晶片上的按压板，以及 一对对准构件。 一对对准构件被布置成在水平方向上自由地前后移动，并且用于支撑支撑板的周边的下表面的叶片和用于在支撑板叠置在半导体上的状态下执行定位的推动构件 晶片设置在对准构件的顶端。
-
公开(公告)号：US20090288780A1
公开(公告)日：2009-11-26
申请号：US12448499
申请日：2007-11-26
IPC分类号： B32B37/12
CPC分类号： H01L21/02002 , H01L21/67132 , H01L21/68757 , Y10T29/49998 , Y10T156/1062 , Y10T156/1798
摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.
摘要翻译： 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。
-
公开(公告)号：US08449691B2
公开(公告)日：2013-05-28
申请号：US12448916
申请日：2008-01-11
IPC分类号： B08B3/00
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.
摘要翻译： 为了提供液体溶剂抵靠单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵靠单元包括用于向支撑板表面供给液体溶剂的供应部件 ，用于将所提供的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分和用于使液体溶剂振动的振动单元。
-
公开(公告)号：US07999052B2
公开(公告)日：2011-08-16
申请号：US12377473
申请日：2007-08-01
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F220/10
CPC分类号： C08L53/00 , C08F293/00 , C08F293/005 , C08L2666/02 , C09J7/10 , C09J7/387 , C09J153/00 , C09J2453/00 , Y10T428/31721
摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.
摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且还可以在进行高温处理之后容易地进行粘合剂组合物的剥离 粘合剂组成。
-
20.发明申请ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 有权胶粘组合物，胶粘剂和组合物的生产方法公开(公告)号：US20100227996A1
公开(公告)日：2010-09-09
申请号：US12377473
申请日：2007-08-01
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F220/10
CPC分类号： C08L53/00 , C08F293/00 , C08F293/005 , C08L2666/02 , C09J7/10 , C09J7/387 , C09J153/00 , C09J2453/00 , Y10T428/31721
摘要： An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition.
摘要翻译： 根据本发明的粘合剂组合物是其主要成分是通过单体组合物共聚获得的聚合物，该单体组合物含有苯乙烯，具有环状结构的（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯，其具有 链结构。 因此，具有苯乙烯嵌段链段的聚合物可以改善耐热性，在高温环境下的粘合强度，耐碱性和在粘合剂组合物的高温过程中的剥离容易性。 因此，提供了一种粘合剂组合物，其具有高耐热性，在高温环境中的粘合强度和耐碱性，并且进一步可以在对高温工艺进行后容易地进行粘合剂组合物的剥离 粘合剂组成。
-
-
-
-
-
-
-
-
-
搜索结果
52 条记录 (耗时 0.02 秒)