Abstract:
A high efficiency electro-optic dendrimer based technology for nanophotonic integrated circuit devices is presented. In particular, a high power terahertz (THz) source is implemented using an electro-optic dendrimer via electro-optic rectification. Electro-optic rectification provides inherent power scalability, because, pump-THz conversion is not limited either by emission saturation or by heat dissipation. Low dielectric loss and high electro-optic coefficient of dendrimer along with a waveguide structure provides higher output power and tunable THz power generation. A dendrimer fiber array is also disclosed by means of which the input/output signals are connected to multiple components and devices.
Abstract:
A high efficiency electro-optic dendrimer based technology for nanophotonic integrated circuit devices is presented. In particular, a high power terahertz (THz) source is implemented using an electro-optic dendrimer via electro-optic rectification. Electro-optic rectification provides inherent power scalability, because, pump-THz conversion is not limited either by emission saturation or by heat dissipation. Low dielectric loss and high electro-optic coefficient of dendrimer along with a waveguide structure provides higher output power and tunable THz power generation. A dendrimer fiber array is also disclosed by means of which the input/output signals are connected to multiple components and devices.
Abstract:
The present invention discloses a photonic waveguide that is based on natural index contrast (NIC) principle and also discloses fabrication details thereof. Such waveguide forms the basis of a class of chip-scale micro- and nano-photonic integrated circuits (PICs). The NIC method utilizes the built-in refractive index difference between two layers of dielectric thin films of two materials, created from nano-materials that are designed for optical waveguide applications. This new class of waveguides simplifies the PIC fabrication process significantly. Based on the NIC based waveguides, which by design possess multiple photonic functionalities, PICs can be fabricated for a number of photonic applications such as arrayed waveguide grating (AWG), reflective arrayed waveguide grating (RAWG), interleaver, interferometer, and electro-optic sensor. Additionally, several other PICs can also be fabricated via tiers of integration, such as triple-phase integration where multiple optical functionalities are monolithically integrated on a chip.
Abstract:
An oximetry probe assembly includes fluid seal assembly taking the form of a manually actuated plunger which moves relative to a barrel having a seal placed therein. Depression of the plunger causes the seal to be deformed so as to permit insertion of an oximetry probe through the seal and advancement towards a central venous catheter. When the plunger is released, the seal is compressed against the barrel and the sheath of the oximetry probe to thereby form a fluid-tight seal. The plunger and barrel are preferably configured as a one-handed grasping assembly whereby the user may hold the plunger and barrel with one hand, press the plunger with the thumb, and advance the oximetry probe through the fluid seal assembly with the other hand.
Abstract:
A terahertz scanning reflectometer is described herein. A high sensitivity terahertz scanning reflectometer is used to measure dynamic surface deformation and delamination characteristics in real-time. A number of crucial parameters can be extracted from the reflectance measurements such as dynamic deformation, propagation velocity, and final relaxation position. A terahertz reflectometer and spectrometer are used to determine the permeation kinetics and concentration profile of active ingredients in stratum corneum.
Abstract:
A terahertz scanning reflectometer is described herein. A high sensitivity terahertz scanning reflectometer is used to measure dynamic surface deformation and delamination characteristics in real-time. A number of crucial parameters can be extracted from the reflectance measurements such as dynamic deformation, propagation velocity, and final relaxation position. A terahertz reflectometer and spectrometer are used to determine the permeation kinetics and concentration profile of active ingredients in stratum corneum.
Abstract:
A high efficiency electro-optic dendrimer based technology for nanophotonic integrated circuit devices is presented. In particular, an electro-optic waveguide dendrimer for electro-optic sensor applications is implemented. A terahertz system for detecting and imaging objects is implemented using electro-optic dendrimer based terahertz emitters and probing sensors.
Abstract:
A class of nanophotonic integrated circuit (nPIC) has been disclosed that is a platform technology for fiberoptic communication and computing, that is fabricated from waveguides that are based on natural index contrast (NIC) principle. A multifunctional nPIC and its fabrication details have been described. The nPIC is also known as an “optical processor”. A novel nanomaterial “dendrimer” is highlighted as the key ingredient that enables the fabrication of the nPICs and its multifunctionality from the same basic process. Other nanomaterials such as spin-on glass, nano-silica sol, and a combination of any of these materials can also be used via the natural index contrast method. Several preferred embodiments of the nPIC are described.
Abstract:
This invention discloses a “reflective arrayed waveguide grating,” (RAWG) for demultiplexing a multiplexed optical signal into its component wavelengths and for multiplexing n optical signals into a multiplexed signal. The present invention found that a single slab can be used for coupling the signal in and for focusing the signal out of the array of waveguide that functions as a grating; and a single external fiber array interface containing plurality of fibers can be used for both inputting the signal in and for outputting the signal from the RAWG. Advantageously, this method reduces the chip size and on-chip insertion loss by eliminating a slab and using 50% shorter waveguides in the array allowing significant savings of the silicon real estate. The smaller chip size increases the reliability of the device significantly and almost doubles the yield of chips per wafer. Additionally, used as a building block, these chips can enable further functionality enhancement via tiers of monolithic triple-phase integration.