摘要:
Transistor characteristics may be adjusted on the basis of asymmetrically formed cavities in the drain and source areas so as to maintain a strain-inducing mechanism while at the same time providing the possibility of obtaining asymmetric configuration of the drain and source areas while avoiding highly complex implantation processes. For this purpose, the removal rate during a corresponding cavity etch process may be asymmetrically modified on the basis of a tilted ion implantation process.
摘要:
Transistor characteristics may be adjusted on the basis of asymmetrically formed cavities in the drain and source areas so as to maintain a strain-inducing mechanism while at the same time providing the possibility of obtaining asymmetric configuration of the drain and source areas while avoiding highly complex implantation processes. For this purpose, the removal rate during a corresponding cavity etch process may be asymmetrically modified on the basis of a tilted ion implantation process.
摘要:
In a transistor, a strain-inducing semiconductor alloy, such as silicon/germanium, silicon/carbon and the like, may be positioned very close to the channel region by providing gradually shaped cavities which may then be filled with the strain-inducing semiconductor alloy. For this purpose, two or more “disposable” spacer elements of different etch behavior may be used in order to define different lateral offsets at different depths of the corresponding cavities. Consequently, enhanced uniformity and, thus, reduced transistor variability may be accomplished, even for sophisticated semiconductor devices.
摘要:
The dopant profile of a transistor may be obtained on the basis of an in situ doped strain-inducing semiconductor alloy wherein a graded dopant concentration may be established along the height direction. Consequently, the semiconductor alloy may be positioned in close proximity to the channel region, thereby enhancing the overall strain-inducing efficiency, while not unduly compromising the finally obtained dopant profile. Furthermore, additional implant species may be incorporated prior to selectively growing the semiconductor alloy, thereby avoiding implantation-induced relaxation of the internal strain.
摘要:
The device degradation of integrated circuits may be compensated for by appropriately adapting the duty cycle of the clock signal. For this purpose, a correlation between the duty cycle and the overall performance characteristics of the integrated circuit may be established and may be used during the normal field operation of the device in order to modify the duty cycle. Hence, an efficient control strategy may be implemented since the duty cycle may be efficiently controlled, while at the same time a change of clock signal frequency and/or an increase of supply voltage may not be required.
摘要:
An integrated circuit device includes a degradable test structure, a first external interface pin and a second external interface pin, a first conductive path coupling a first node of the degradable test structure and the first external interface pin, and a second conductive path coupling a second node of the degradable test structure and the second external interface pin. Another integrated circuit device includes a non-volatile memory device, a counter comprising an input configured to receive a first clock signal and an output to provide a count value, and control logic configured to store the count value of the counter in the non-volatile memory, whereby the non-volatile memory is externally accessible.
摘要:
In a transistor, a strain-inducing semiconductor alloy, such as silicon/germanium, silicon/carbon and the like, may be positioned very close to the channel region by providing gradually shaped cavities which may then be filled with the strain-inducing semiconductor alloy. For this purpose, two or more “disposable” spacer elements of different etch behavior may be used in order to define different lateral offsets at different depths of the corresponding cavities. Consequently, enhanced uniformity and, thus, reduced transistor variability may be accomplished, even for sophisticated semiconductor devices.
摘要:
In a transistor, a strain-inducing semiconductor alloy, such as silicon/germanium, silicon/carbon and the like, may be positioned very close to the channel region by providing gradually shaped cavities which may then be filled with the strain-inducing semiconductor alloy. For this purpose, two or more “disposable” spacer elements of different etch behavior may be used in order to define different lateral offsets at different depths of the corresponding cavities. Consequently, enhanced uniformity and, thus, reduced transistor variability may be accomplished, even for sophisticated semiconductor devices.
摘要:
A silicon/germanium material and a silicon/carbon material may be provided in transistors of different conductivity type on the basis of an appropriate manufacturing regime without unduly contributing to overall process complexity. Furthermore, appropriate implantation species may be provided through exposed surface areas of the cavities prior to forming the corresponding strained semiconductor alloy, thereby additionally contributing to enhanced overall transistor performance. In other embodiments a silicon/carbon material may be formed in a P-channel transistor and an N-channel transistor, while the corresponding tensile strain component may be overcompensated for by means of a stress memorization technique in the P-channel transistor. Thus, the advantageous effects of the carbon species, such as enhancing overall dopant profile of P-channel transistors, may be combined with an efficient strain component while enhanced overall process uniformity may also be accomplished.
摘要:
An integrated circuit device includes a degradable test structure, a first external interface pin and a second external interface pin, a first conductive path coupling a first node of the degradable test structure and the first external interface pin, and a second conductive path coupling a second node of the degradable test structure and the second external interface pin. Another integrated circuit device includes a non-volatile memory device, a counter comprising an input configured to receive a first clock signal and an output to provide a count value, and control logic configured to store the count value of the counter in the non-volatile memory, whereby the non-volatile memory is externally accessible.