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公开(公告)号：US12050494B2
公开(公告)日：2024-07-30
申请号：US18131983
申请日：2023-04-07
Applicant: APPLE INC.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , F21V8/00 , G06F1/18 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/40 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US11650634B2
公开(公告)日：2023-05-16
申请号：US17649661
申请日：2022-02-01
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , G06F1/20 , G06F1/18 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/001 , G02B6/0008 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/2039 , H05K7/2049 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20190235587A1
公开(公告)日：2019-08-01
申请号：US16377155
申请日：2019-04-06
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: G06F1/18 , G06F1/20 , H05K5/03 , H05K7/20 , H01L23/40 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09946315B2
公开(公告)日：2018-04-17
申请号：US15637981
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09207729B2
公开(公告)日：2015-12-08
申请号：US14297580
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: G06F1/20 , H05K7/20 , G06F1/18 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , G06F3/00 , H05K1/02 , G06F1/00 , H05K5/00
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Abstract translation: 描述了一种用于圆柱形紧凑计算系统的内部部件和外部接口装置，其包括至少具有三角形形状的结构散热器，该散热器设置在由圆柱形壳体限定的圆柱形容积内。 具有大致三角形状的计算引擎被描述为具有包括图形处理单元（GPU）板，中央处理单元（CPU）板，输入/输出（I / O）接口板，互连板和 电源单元（PSU）。
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Patent Agency Ranking
公开(公告)号：US10254805B2
公开(公告)日：2019-04-09
申请号：US15964973
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US10248171B2
公开(公告)日：2019-04-02
申请号：US15965272
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , H05K7/20 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/40 , H05K1/02 , H05K5/03
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US10073499B2
公开(公告)日：2018-09-11
申请号：US15614354
申请日：2017-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , G06F1/18 , G06F3/00 , H05K7/20 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , H05K1/02 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09974206B2
公开(公告)日：2018-05-15
申请号：US15263222
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US09964999B2
公开(公告)日：2018-05-08
申请号：US15637940
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K7/00 , G06F1/18 , G06F1/20 , G06F3/00 , F21V8/00 , H05K7/20 , H05K1/02 , H05K5/03 , G08B21/18 , G08B5/36
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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