Display with Low Reflectivity Alignment Structures
    12.
    发明申请
    Display with Low Reflectivity Alignment Structures 有权
    低反射率对准结构的显示

    公开(公告)号:US20160103349A1

    公开(公告)日:2016-04-14

    申请号:US14512677

    申请日:2014-10-13

    Applicant: Apple Inc.

    CPC classification number: G02F1/133512 G02F1/1309 G02F1/13452 G02F1/13458

    Abstract: A display may have a liquid crystal layer sandwiched between a thin-film transistor layer and a color filter layer. An upper polarizer may be placed on top of the thin-film transistor layer. A lower polarizer may be placed under the color filter layer. Components may be bonded to bond pads on the inner surface of the thin-film transistor layer using anisotropic conductive film. Bond quality may be assessed by probing probe pads that are coupled to the bond pads or by visually inspecting the bond pads through the thin-film transistor layer. Opaque masking material in the inactive area may be provided with openings to accommodate the bond pads. Additional opaque masking material may be placed on the underside of the upper polarizer and on the upper surface of the thin-film transistor layer to block the openings from view following visual inspection.

    Abstract translation: 显示器可以具有夹在薄膜晶体管层和滤色器层之间的液晶层。 上偏振器可以放置在薄膜晶体管层的顶部。 下偏振器可以放置在滤色器层下方。 可以使用各向异性导电膜将部件结合到薄膜晶体管层的内表面上的接合焊盘。 可以通过探测耦合到接合焊盘的探针焊盘或通过目视检查通过薄膜晶体管层的焊盘来评估焊盘质量。 在不活动区域中的不透明掩模材料可以设置有开口以容纳接合焊盘。 附加的不透明掩模材料可以放置在上偏振器的下侧和薄膜晶体管层的上表面上,以在视觉检查之后阻挡开口。

    Display with low reflectivity alignment structures
    16.
    发明授权
    Display with low reflectivity alignment structures 有权
    显示低反射率对准结构

    公开(公告)号:US09494818B2

    公开(公告)日:2016-11-15

    申请号:US14512677

    申请日:2014-10-13

    Applicant: Apple Inc.

    CPC classification number: G02F1/133512 G02F1/1309 G02F1/13452 G02F1/13458

    Abstract: A display may have a liquid crystal layer sandwiched between a thin-film transistor layer and a color filter layer. An upper polarizer may be placed on top of the thin-film transistor layer. A lower polarizer may be placed under the color filter layer. Components may be bonded to bond pads on the inner surface of the thin-film transistor layer using anisotropic conductive film. Bond quality may be assessed by probing probe pads that are coupled to the bond pads or by visually inspecting the bond pads through the thin-film transistor layer. Opaque masking material in the inactive area may be provided with openings to accommodate the bond pads. Additional opaque masking material may be placed on the underside of the upper polarizer and on the upper surface of the thin-film transistor layer to block the openings from view following visual inspection.

    Abstract translation: 显示器可以具有夹在薄膜晶体管层和滤色器层之间的液晶层。 上偏振器可以放置在薄膜晶体管层的顶部。 下偏振器可以放置在滤色器层下方。 可以使用各向异性导电膜将部件结合到薄膜晶体管层的内表面上的接合焊盘。 可以通过探测耦合到接合焊盘的探针焊盘或通过目视检查通过薄膜晶体管层的焊盘来评估焊盘质量。 在不活动区域中的不透明掩模材料可以设置有开口以容纳接合焊盘。 附加的不透明掩模材料可以放置在上偏振器的下侧和薄膜晶体管层的上表面上,以在视觉检查之后阻挡开口。

    Electronic Device With Light-Emitting Diode Array
    17.
    发明申请
    Electronic Device With Light-Emitting Diode Array 有权
    具有发光二极管阵列的电子装置

    公开(公告)号:US20150167951A1

    公开(公告)日:2015-06-18

    申请号:US14132346

    申请日:2013-12-18

    Applicant: Apple Inc.

    Abstract: Electronic devices may be provided with displays. A display may have a light guide plate. Backlight for the display may be launched into the light guide plate from an array of light-emitting diodes. The light-emitting diodes may be mounted on a metal core printed circuit board having a dielectric layer and a metal layer. The metal core printed circuit board may have an elongated shape that extends along the surface of a metal structure. A weld may be formed along a seam between the metal layer of the metal core printed circuit board and the metal structure. The metal structure may be an electronic device housing, a display chassis member, a heat spreader, a heat pipe, or other structures in an electronic device.

    Abstract translation: 电子设备可以设置有显示器。 显示器可以具有导光板。 用于显示器的背光可以从发光二极管阵列发射到导光板中。 发光二极管可以安装在具有电介质层和金属层的金属芯印刷电路板上。 金属芯印刷电路板可以具有沿着金属结构的表面延伸的细长形状。 可以沿着金属芯印刷电路板的金属层和金属结构之间的接缝形成焊缝。 金属结构可以是电子设备壳体,显示器底座构件,散热器,热管或电子设备中的其他结构。

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