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公开(公告)号：US20190208648A1
公开(公告)日：2019-07-04
申请号：US16297439
申请日：2019-03-08
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
CPC classification number: H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US10264685B2
公开(公告)日：2019-04-16
申请号：US15888658
申请日：2018-02-05
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US20180160551A1
公开(公告)日：2018-06-07
申请号：US15888658
申请日：2018-02-05
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
CPC classification number: H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US09985345B2
公开(公告)日：2018-05-29
申请号：US14971791
申请日：2015-12-16
Applicant: Apple Inc.
Inventor： Francesco Ferretti , Joseph B. Marcinkowski , Collin D. Chan , Tom H. Engbersen
CPC classification number: H01Q1/42 , H04M1/0202
Abstract: Unitary structures having conductive portions electrically separated by non-conductive portions are described. In some embodiments, the non-conductive portions are made of metal oxide. In some embodiments, the method involves an oxidizing process adapted to convert an entire thickness at a selected portion of a metal substrate to a metal oxide, thereby creating metal portions that are electrically isolated from one another. In some embodiments, the thickness of the metal substrate is reduced at certain regions prior to oxidizing in order to provide a sufficiently thin metal for complete oxidization through the entire thickness. In some embodiments, the oxidizing process involves a plasma electrolytic oxidation process. In some embodiments, the plasma is concentrated at certain regions of the substrate for preferential oxidation. Applications for the substrate include enclosures and electrical components for electronic devices that use radio frequency communication.
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15.发明授权公开(公告)号：US09611562B2
公开(公告)日：2017-04-04
申请号：US14277528
申请日：2014-05-14
Applicant: Apple Inc.
CPC classification number: C25D11/022 , B23K20/122 , C23C24/04 , C25D11/04
Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic join between various parts.
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Patent Agency Ranking
公开(公告)号：US10897825B2
公开(公告)日：2021-01-19
申请号：US16820513
申请日：2020-03-16
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US10280516B2
公开(公告)日：2019-05-07
申请号：US14280462
申请日：2014-05-16
Applicant: Apple Inc.
Inventor： Collin D. Chan , Matthew W. Crowley , Jude Mary Runge
Abstract: The described embodiments relate to methods and apparatus for increasing rigidity of a metal housing while maintaining or reducing a wall thickness of the metal housing. More particularly a method for embedding a stiffener layer within an aluminum substrate is discussed. In one exemplary embodiment the stiffener layer can be a carbon fiber sheet applied to an inside surface of an unfinished housing and then subsequently covered by depositing a layer of aluminum over the carbon fiber in a solid-state deposition process. The deposited aluminum can adhere to the unfinished housing around or through the carbon fiber layer to bond with the unfinished housing. Deposition parameters can be controlled to prevent damage to the carbon fiber sheet.
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公开(公告)号：US09907191B2
公开(公告)日：2018-02-27
申请号：US15280465
申请日：2016-09-29
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
CPC classification number: H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US09629271B1
公开(公告)日：2017-04-18
申请号：US14499142
申请日：2014-09-27
Applicant: Apple Inc.
Inventor： Simon R. Lancaster-Larocque , Sarah J. Montplaisir , Collin D. Chan
CPC classification number: B24C1/08 , B23K26/355 , B23K26/362 , B24C1/06
Abstract: A method for manufacturing an enclosure for an electronic device using laser texturing to create a first surface having different surface characteristics than a second surface adjacent to the first surface.
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公开(公告)号：US09561576B2
公开(公告)日：2017-02-07
申请号：US14185074
申请日：2014-02-20
Applicant: Apple Inc.
Inventor： Simon Regis Louis Lancaster-Larocque , Collin D. Chan
IPC: B24B37/02 , B24B37/005 , B24B5/04
CPC classification number: B24B37/02 , B24B5/042 , B24B5/045 , B24B5/047 , B24B37/005
Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
Abstract translation: 所描述的实施例一般涉及研磨操作和相关系统和装置。 描述了研磨台的各种实施例，用于将研磨操作应用于工件的非平面表面。 例如，描述了允许将研磨操作应用于圆柱形工件的弯曲外表面部分的方法和装置。 通过在研磨操作期间旋转工件来进行工件的非平面外表面的研磨。
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