Abstract:
An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Abstract:
A finger biometric sensing device may include an array of finger biometric sensing pixel electrodes and a gain stage coupled to the array of finger biometric sensing pixel electrodes. The finger biometric sensing device may also include error compensation circuitry that may include a memory capable of storing error compensation data. The error correction circuitry may also include a digital-to-analog converter (DAC) cooperating with the memory and coupled to the gain stage and capable of compensating for at least one error based upon the stored error compensation data.
Abstract:
An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Abstract:
An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Abstract:
An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Abstract:
An electronic device may include finger biometric sensing pixels and a processor capable of cooperating with the finger biometric sensing pixels to generate a series of finger images at a progressively slower capture rate as a finger settling increases over time from initial placement of a user's finger adjacent the finger biometric sensing pixels. The processor may also be capable of cooperating with the finger biometric sensing pixels to determine a quality factor for each image in the series thereof, and select at least one image from the series thereof for matching and based upon the quality factor.
Abstract:
A finger biometric sensor may include first and second integrated circuit (IC) dies arranged in a stacked relation. The first IC die may include a first semiconductor substrate and an array of finger biometric sensing pixels thereon, and the second IC die may include a second semiconductor substrate and processing circuitry thereon coupled to the array of finger biometric sensing pixels. The first and second IC dies may each have respective first and second non-rectangular shapes, such as circular shapes that are coextensive.
Abstract:
A finger biometric sensing device may include drive circuitry capable of generating a drive signal and an array of finger biometric sensing pixel electrodes cooperating with the drive circuitry and capable of generating a detected signal based upon placement of a finger adjacent the array of finger biometric sensing pixel electrodes. The detected signal may include a relatively large drive signal component and a relatively small sense signal component superimposed thereon. The finger biometric sensing device may also include a gain stage coupled to the array of finger biometric sensing pixel electrodes, and drive signal nulling circuitry coupled to the gain stage capable of reducing the relatively large drive signal component from the detected signal.
Abstract:
A finger biometric sensor may include first and second integrated circuit (IC) dies arranged in a stacked relation. The first IC die may include a first semiconductor substrate and an array of finger biometric sensing pixels thereon, and the second IC die may include a second semiconductor substrate and processing circuitry thereon coupled to the array of finger biometric sensing pixels. The first and second IC dies may each have respective first and second non-rectangular shapes, such as circular shapes that are coextensive.