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    Overpass grounding spring and integrated component protection
    11.
    发明授权
    Overpass grounding spring and integrated component protection 有权
    立交接地弹簧和集成元件保护

    公开(公告)号：US09445491B2

    公开(公告)日：2016-09-13

    申请号：US14231372

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： Gregory N. Stephens ,  Matthew D. Hill ,  Scott A. Myers

    IPC: H01R4/66 ,  H05K1/02 ,  H01R12/57 ,  H01R4/64

    CPC classification number: H05K1/0215 ,  H01R4/64 ,  H01R12/57 ,  H01R2201/06 ,  H05K2201/10265 ,  Y10T29/4913

    Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

    Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件，例如接地弹簧，以及为部件提供机械保护。 更具体地，公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中，接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

    Electronic devices with dielectric resonator antennas
    13.
    发明授权
    Electronic devices with dielectric resonator antennas 有权

    公开(公告)号：US11728569B2

    公开(公告)日：2023-08-15

    申请号：US17111131

    申请日：2020-12-03

    Applicant: Apple Inc.

    Inventor： Bilgehan Avser ,  Harish Rajagopalan ,  Simone Paulotto ,  Jennifer M. Edwards ,  Hao Xu ,  Rodney A. Gomez Angulo ,  Matthew D. Hill ,  Mattia Pascolini

    IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q21/00

    CPC classification number: H01Q9/0485 ,  H01Q1/243 ,  H01Q21/0075

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

    HANDHELD ELECTRONIC DEVICE
    14.
    发明公开
    HANDHELD ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230224389A1

    公开(公告)日：2023-07-13

    申请号：US17903935

    申请日：2022-09-06

    Applicant: Apple Inc.

    Inventor： Matthew D. Hill ,  David A. Hurrell ,  Nicholas D. Rath ,  Tyler B. Cater ,  James A. Bertin ,  Sawyer I. Cohen

    IPC: H04M1/02 ,  H04N5/225 ,  H04N5/247

    CPC classification number: H04M1/0264 ,  H04N5/2254 ,  H04N5/247 ,  H04N5/2252 ,  H04M2201/38

    Abstract: A mobile phone may include a display, an enclosure enclosing the display and including a front cover positioned over the display and defining a front exterior surface, and a rear cover defining a rear exterior surface and a raised sensor array region along the rear exterior surface. The raised sensor array region may define a first hole and a second hole. The second hole may be defined by a first opening along an interior surface of the rear cover and having a first opening size and a second opening along the rear exterior surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may further include a first camera having a first lens assembly extending into the first hole, and a second camera having a second lens assembly extending into the second hole.

    Coupling structures for electronic device housings
    17.
    发明授权
    Coupling structures for electronic device housings 有权

    公开(公告)号：US11581629B2

    公开(公告)日：2023-02-14

    申请号：US17555920

    申请日：2021-12-20

    Applicant: Apple Inc.

    Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

    IPC: G06F1/16 ,  H01Q1/24 ,  H04M1/02 ,  B29C45/14 ,  B29L31/34 ,  B29C37/00

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Housing features of an electronic device
    19.
    发明授权
    Housing features of an electronic device 有权

    公开(公告)号：US11070655B2

    公开(公告)日：2021-07-20

    申请号：US16740668

    申请日：2020-01-13

    Applicant: Apple Inc.

    Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

    IPC: H04B1/38 ,  H04M1/02 ,  H04M1/23

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    HOUSING FEATURES OF AN ELECTRONIC DEVICE
    20.
    发明申请
    HOUSING FEATURES OF AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200153950A1

    公开(公告)日：2020-05-14

    申请号：US16740668

    申请日：2020-01-13

    Applicant: Apple Inc.

    Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

    IPC: H04M1/02

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

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