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公开(公告)号:US11251067B2
公开(公告)日:2022-02-15
申请号:US16396181
申请日:2019-04-26
Applicant: Applied Materials, Inc.
Inventor: Brian T. West , Miroslav Gelo , Yan Rozenzon , Roger M. Johnson , Mark Covington , Soundarrajan Jembulingam , Simon Nicholas Binns , Vivek Vinit
Abstract: Implementations described herein provide a pedestal lift assembly for a plasma processing chamber and a method for using the same. The pedestal lift assembly has a platen configured to couple a shaft of a pedestal disposed in the plasma processing chamber. An absolute linear encoder is coupled to a fixed frame wherein the absolute linear encoder is configured to detect incremental movement of the platen. A lift rod is attached to the platen. A motor rotor encoder brake module (MRBEM) is coupled to the fixed frame and moveably coupled to the lift rod, the motor encoder brake module configured to move the lift rod in a first direction and a second direction, wherein the movement of the lift rod results in the platen traveling vertically relative to the fixed frame.
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公开(公告)号:US11114285B2
公开(公告)日:2021-09-07
申请号:US15487324
申请日:2017-04-13
Applicant: Applied Materials, Inc.
Inventor: Michael S. Cox , Brian T. West , Roger M. Johnson , Yan Rozenzon , Dinkesh Somanna , Dustin W. Ho
Abstract: Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes an exhaust cooling apparatus located downstream of a plasma source. The exhaust cooling apparatus includes at least one cooling plate a device for introducing turbulence to the exhaust flowing within the exhaust cooling apparatus. The device may be a plurality of fins, a cylinder with a curved top portion, or a diffuser with angled blades. The turbulent flow of the exhaust within the exhaust cooling apparatus causes particles to drop out of the exhaust, minimizing particles forming in equipment downstream of the exhaust cooling apparatus.
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公开(公告)号:US20190385824A1
公开(公告)日:2019-12-19
申请号:US16555509
申请日:2019-08-29
Applicant: Applied Materials, Inc.
Inventor: Yan Rozenzon , Kyle Tantiwong , Imad Yousif , Vladimir Knyazik , Bojenna Keating , Samer Banna
IPC: H01J37/32 , C23C16/455
Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.
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公开(公告)号:US20180269038A1
公开(公告)日:2018-09-20
申请号:US15989019
申请日:2018-05-24
Applicant: Applied Materials, Inc.
Inventor: Yan Rozenzon , Kyle Tantiwong , Imad Yousif , Vladimir Knyazik , Bojenna Keating , Samer Banna
IPC: H01J37/32 , C23C16/455
CPC classification number: H01J37/32449 , C23C16/45561 , C23C16/45563 , C23C16/45578 , H01J37/3244
Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.
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公开(公告)号:US10008368B2
公开(公告)日:2018-06-26
申请号:US14762219
申请日:2014-02-03
Applicant: APPLIED MATERIALS, INC.
Inventor: Yan Rozenzon , Kyle Tantiwong , Imad Yousif , Vladimir Knyazik , Bojenna Keating , Samer Banna
IPC: H01J37/32 , C23C16/455
CPC classification number: H01J37/32449 , C23C16/45561 , C23C16/45563 , C23C16/45578 , H01J37/3244
Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.
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