Abstract:
The present invention relates to semi-aromatic copolyamides having a high glass transition temperature and a high degree of crystallinity, to a polyamide molding compound containing said semi-aromatic copolyimide and to the use of the semi-aromatic copolyamides and of the polyamide molding compounds.
Abstract:
The present invention relates to a process for preparing an aliphatic or semiaromatic polyamide, in which a polyamide prepolymer is subjected to a solid state polymerization.
Abstract:
An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.
Abstract:
The present invention relates to a process for preparing an aliphatic or semiaromatic polyamide, in which a polyamide prepolymer is subjected to a solid state polymerization.
Abstract:
Described are oligoamides that improve the color protection properties of detergents and cleaning agents during their use for washing or cleaning colored textile fabrics. The oligoamides are rich in amino groups.