HEAT-AGING RESISTANT POLYAMIDE MOLDING COMPOSITIONS

    公开(公告)号:US20230129664A1

    公开(公告)日:2023-04-27

    申请号:US17906925

    申请日:2021-03-23

    申请人: BASF SE

    摘要: Described herein is a thermoplastic molding composition, including 30 to 99.8 wt % of at least one thermoplastic polyamide as component A; 0.001 to 5 wt % of at least one polyethylenimine homo-or copolymer as component B; 0.1 to 2.0 wt % of at least one condensation product of secondary aryl amines and aliphatic aldehydes, aliphatic ketones, or mixtures thereof, or a combination of at least one secondary aryl amine and the at least one condensation product as component C; 0 to 3 wt % of at least one lubricant as component D; 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and 0 to 25 wt % of further additives as component F, where a total of wt % of components A to F is 100 wt %, which is free from copper.

    Nylon Terpolymers
    3.
    发明申请

    公开(公告)号:US20220325103A1

    公开(公告)日:2022-10-13

    申请号:US17835258

    申请日:2022-06-08

    摘要: A terpolymer composition is described that contains a statistical amount of 50-98 wt % of a first repeating AA-BB comonomer unit; 1-25 wt % of a second repeating AA-BB comonomer unit; and 1-25 wt % of a repeating lactam comonomer unit or 1-25 wt % of a third repeating AA-BB comonomer unit, where the terpolymer composition exhibits a high melting point similar to that of PA66 while also exhibiting a significantly reduced crystallization rate and crystallization temperature.

    Polyamide particles, production process therefor, resin composition, and molded article

    公开(公告)号:US11142613B2

    公开(公告)日:2021-10-12

    申请号:US16313286

    申请日:2017-04-10

    摘要: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 μm and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 μm. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).

    FOAM MATERIAL PARTICLES BASED ON LONG-CHAIN POLYAMIDES

    公开(公告)号:US20210269614A1

    公开(公告)日:2021-09-02

    申请号:US17260841

    申请日:2019-07-11

    申请人: BASF SE

    摘要: Foam particles that have a bulk density below 300 kg/m3 and are based on polyamides, including 85% to 100% by weight of at least one copolyamide obtainable by polymerizing the following components: (A) 15% to 84% by weight of at least one lactam, (B) 16% to 85% by weight of a monomer mixture (M) including the following components: (B1) at least one C32-C40 dimer acid and (B2) at least one C4-C12 diamine, wherein the monomer mixture (M) includes in the range from 45 to 55 mol % of component (B1) and in the range from 45 to 55 mol % of component (B2), based on the total molar amount of the monomer mixture (M), and the sum total of the components of (A) and (B) is 100% by weight, and processes for production thereof.