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    PACKAGING METHOD, DISPLAY PANEL AND DISPLAY APPARATUS
    11.
    发明申请
    PACKAGING METHOD, DISPLAY PANEL AND DISPLAY APPARATUS 审中-公开
    包装方法，显示面板和显示装置

    公开(公告)号：US20160372696A1

    公开(公告)日：2016-12-22

    申请号：US14906028

    申请日：2015-08-19

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Rui Hong ,  Dan Wang ,  Zhengyin Xu

    IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

    CPC classification number: H01L51/524 ,  H01L27/32 ,  H01L51/0024 ,  H01L51/52 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/558

    Abstract: A packaging method, a display panel and a display apparatus. The packaging method comprises steps of: forming a frit layer in a packaging area of a first substrate; forming at least a metal thin film and/or at least a silicon thin film on the frit layer formed on the first substrate, and forming at least a metal thin film and/or at least a silicon thin film in a packaging area of a second substrate, wherein one of the outermost thin film formed on the frit layer and the outermost thin film formed is a metal thin film, and the other is a silicon thin film; and vacuum laminating the first substrate and the second substrate, without the use of a laser to irradiate the frit layer during the packaging.

    Abstract translation: 包装方法，显示面板和显示装置。 包装方法包括以下步骤：在第一基板的包装区域中形成玻璃料层; 在形成在第一基板上的玻璃料层上至少形成金属薄膜和/或至少硅薄膜，并且在第二基板的至少一个包装区域中形成至少金属薄膜和/或至少硅薄膜 基板，其中形成在所述玻璃料层上的最外薄膜和形成的最外薄膜之一是金属薄膜，另一个是硅薄膜; 并且在包装期间不使用激光来照射玻璃料层，并且真空层压第一基板和第二基板。

    Packaging device and packaging method
    13.
    发明授权
    Packaging device and packaging method 有权

    公开(公告)号：US09673356B2

    公开(公告)日：2017-06-06

    申请号：US14892414

    申请日：2015-04-16

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Xinwei Gao ,  Dan Wang ,  Rui Hong ,  Chao Kong

    IPC: H01L33/48 ,  H01L21/67 ,  H01L51/52

    CPC classification number: H01L33/483 ,  H01L21/67126 ,  H01L51/5246 ,  H01L51/56 ,  H01L2933/0033

    Abstract: The present invention discloses a packaging device and a packaging method and relates to a field of manufacturing technique of a display panel. The packaging device is used to package a display panel, the display panel comprising a first substrate and a second substrate that are arranged opposed to each other and are able to be packaged by a sealing material, the packaging device comprising a first adsorption part and a second adsorption part that are able to attract each other through a magnetic force, one of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the first substrate, and the other of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the second substrate.

    METHOD FOR PREPARING DESICCANT LAYER, OLED DISPLAY PANEL AND METHOD FOR PACKAGING THE SAME
    14.
    发明申请
    METHOD FOR PREPARING DESICCANT LAYER, OLED DISPLAY PANEL AND METHOD FOR PACKAGING THE SAME 审中-公开
    制备耐热层的方法，OLED显示面板及其包装方法

    公开(公告)号：US20140110685A1

    公开(公告)日：2014-04-24

    申请号：US14055069

    申请日：2013-10-16

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Rui Hong ,  Joo Hyeon Lee ,  Dong Hwan Kim

    IPC: H01L51/56 ,  H01L51/52 ,  H01L27/32

    CPC classification number: H01L27/32 ,  C23C14/042 ,  C23C14/082 ,  H01L51/524 ,  H01L51/5259

    Abstract: A method for packaging an organic light emitting diode display panel, comprising providing a desiccant layer on a package cover plate. The desiccant layer is capable of effectively absorbing water and oxygen permeating, edges of the package cover plate and a substrate are hermetically coupled, and the desiccant layer and a device on the substrate are enclosed in a packaging cavity. This method can improve the packaging efficiency of the organic light emitting diode display panel and reduces production costs.

    Abstract translation: 一种用于封装有机发光二极管显示面板的方法，包括在封装盖板上提供干燥剂层。 干燥剂层能够有效地吸收渗透的水分和氧气，封装盖板和基板的边缘被气密地耦合，并且干燥剂层和基板上的装置封装在包装腔中。 该方法可以提高有机发光二极管显示面板的封装效率，降低生产成本。

    Thin film encapsulation structure and method for manufacturing the same
    16.
    发明授权
    Thin film encapsulation structure and method for manufacturing the same 有权

    公开(公告)号：US11765926B2

    公开(公告)日：2023-09-19

    申请号：US16331294

    申请日：2018-09-12

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Rui Hong ,  Can Zhang

    IPC: H10K50/844 ,  H10K71/00

    CPC classification number: H10K50/844 ,  H10K71/00

    Abstract: Embodiments of the present disclosure provide a thin film encapsulation structure and a method for manufacturing the same. The thin film encapsulation structure includes a laminated layer for encapsulating a member to be encapsulated located on a substrate, the laminated layer including an organic layer and an inorganic layer alternately stacked, wherein an outermost layer of the laminated layer is the inorganic layer, the organic layer having an inner surface facing the member, an outer surface opposite to the inner surface, and an end surface located between the inner and outer surface and extending over a region, at a periphery of the member, of the substrate, a restriction layer, for positioning the organic layer, located between the end surface of the organic layer and a surface of the substrate, wherein the organic layer has one of hydrophilicity and hydrophobicity and the restriction layer has the other of hydrophilicity and hydrophobicity.

    DISPLAY SUBSTRATE, DISPLAY DEVICE, AND DETECTION METHOD FOR DISPLAY SUBSTRATE
    17.
    发明申请
    DISPLAY SUBSTRATE, DISPLAY DEVICE, AND DETECTION METHOD FOR DISPLAY SUBSTRATE 有权

    公开(公告)号：US20230046867A1

    公开(公告)日：2023-02-16

    申请号：US17788922

    申请日：2021-09-01

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Tao Wang ,  Tao Sun ,  Chengjie Qin ,  Ziyu Zhang ,  Rui Hong ,  Youwei Wang

    IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52

    Abstract: The embodiments of the present disclosure provide a display substrate, a display device, and a detection method for the display substrate. The display substrate includes: a base substrate including a display region and a peripheral region located on at least one side of the display region; a crack stopper located in the peripheral region and configured to prevent a crack from propagating toward the display region; an encapsulation structure disposed on the base substrate and covering the display region; and a crack detection structure disposed on the base substrate, wherein the crack detection structure is located on a side of the crack stopper facing the display region, an orthographic projection of the crack detection structure on the base substrate falls within an orthographic projection of the encapsulation structure on the base substrate, and the crack detection structure is configured to detect whether a crack exists in the encapsulation structure.

    Encapsulation structure and encapsulation method of electroluminescent device, display panel
    18.
    发明授权
    Encapsulation structure and encapsulation method of electroluminescent device, display panel 有权

    公开(公告)号：US11264592B2

    公开(公告)日：2022-03-01

    申请号：US16475714

    申请日：2019-01-10

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Dan Wang ,  Rui Hong ,  Lei Chen

    IPC: H01L51/52 ,  H01L51/56

    Abstract: An encapsulation structure of an organic electroluminescent device includes a substrate, a first inorganic sealing layer and an organic sealing layer. The first inorganic sealing layer is stacked on the substrate, and the organic sealing layer is stacked on a side of the first inorganic sealing layer that is away from the substrate. The organic sealing layer includes a UV light absorbing material and/or a UV resistant polymer material. An encapsulation method of the encapsulation structure of an organic electroluminescent device and a display panel including the encapsulation structure are further provided.

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