公开(公告)号：US20150001068A1

公开(公告)日：2015-01-01

申请号：US14488907

申请日：2014-09-17

Applicant: CANON ANELVA CORPORATION

Inventor： Koji TSUNEKAWA

IPC: H01J37/34

CPC classification number: C23C14/14 ,  C23C14/067 ,  C23C14/081 ,  C23C14/34 ,  C23C14/3407 ,  C23C14/345 ,  C23C14/3464 ,  C23C14/505 ,  C23C14/568 ,  C23C14/5806 ,  C23C14/5853 ,  C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  H01F41/18 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3411 ,  H01J37/3417 ,  H01L21/67207 ,  H01L43/08 ,  H01L43/12

Abstract: The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.

Abstract translation: 本发明提供一种制造装置，即使在一层多层薄膜包含多层相同膜型的情况下，也能够实现所谓的顺序基板转印，并能提高生产量。 根据本发明的实施例的制造装置包括转移室，每个包括一个溅射阴极的三个溅射沉积室，每个包括两个或更多个溅射阴极的两个溅射沉积室，以及用于进行溅射以外的处理的处理室， 并且三个溅射沉积室，两个溅射沉积室和处理室布置在传送室周围，使得每个溅射沉积室能够使用传送室执行传送和接收基板。

公开(公告)号：US20130277207A1

公开(公告)日：2013-10-24

申请号：US13919067

申请日：2013-06-17

Applicant: CANON ANELVA CORPORATION

Inventor： Koji TSUNEKAWA

IPC: C23C14/34

CPC classification number: C23C14/14 ,  C23C14/067 ,  C23C14/081 ,  C23C14/34 ,  C23C14/3407 ,  C23C14/345 ,  C23C14/3464 ,  C23C14/505 ,  C23C14/568 ,  C23C14/5806 ,  C23C14/5853 ,  C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  H01F41/18 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3411 ,  H01J37/3417 ,  H01L21/67207 ,  H01L43/08 ,  H01L43/12

Abstract: The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.