Metal smart card with dual interface capability

    公开(公告)号:US10289944B2

    公开(公告)日:2019-05-14

    申请号:US15742813

    申请日:2015-07-08

    Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

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