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公开(公告)号:US20240334806A1
公开(公告)日:2024-10-03
申请号:US18743348
申请日:2024-06-14
Applicant: CORNING INCORPORATED
Inventor: Huayun Deng , Mingqian He , Xin Li , Yang Li , Weijun Niu , Arthur Lawrence Wallace , Hongxiang Wang
CPC classification number: H10K85/113 , C08G61/126 , H10K85/151 , C08G2261/124 , C08G2261/1412 , C08G2261/18 , C08G2261/228 , C08G2261/3223 , C08G2261/3241 , C08G2261/3243 , C08G2261/92 , H10K10/466 , H10K10/484
Abstract: A cross-bred organic semiconductor (OSC) polymer, includes a diketopyrrolopyrrole (DPP)-fused thiophene polymeric material, such that: the DPP-fused thiophene polymeric material comprises a first linear alkyl-substituted DPP portion and a second branched alkyl-substituted DPP portion, the cross-bred OSC polymer comprises a repeat unit having both the first linear alkyl-substituted DPP portion and the second branched alkyl-substituted DPP portion, and the fused thiophene is beta-substituted.
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公开(公告)号:US20210074930A1
公开(公告)日:2021-03-11
申请号:US17012736
申请日:2020-09-04
Applicant: Corning Incorporated , Liaoning Shihua University
Inventor: Mingqian He , Yang Li , Jing Sun , Hongxiang Wang , Mong-dong Zhou
IPC: H01L51/00 , C09K11/06 , C07D495/22 , C08G61/12
Abstract: A method for forming organic semiconducting materials, including: providing a mixture having: a tetrathienoacene (FT4)-based monomer, and one of a thiophene-containing compound or an alkene-containing compound; and reacting the FT4-based monomer with the thiophene-containing compound or the alkene-containing compound in a one-step direct arylation reaction mechanism to form a final FT4-based organic semiconducting compound.
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公开(公告)号:US20240367420A1
公开(公告)日:2024-11-07
申请号:US18290835
申请日:2022-07-11
Applicant: Corning Incorporated
Inventor: Kiyomi DeLige Fahy , Jenny Kim , Lingke Li , Yang Li , Kevin Robert McCarthy , Hongxiang Wang , Arlin Lee Weikel
Abstract: Laminates can comprise a substrate and a film. The film can comprise a film thickness from about 5 micrometers to about 400 micrometers and a tri-block copolymer comprising a first block positioned between two second blocks. The first block can be grafted with a first functional group. The first block can comprise a first glass transition temperature of about 0° C. or less. The two second blocks can each comprise a glass transition temperature of about 50° C. or more. A combined weight of the two second blocks can be from about 10 wt % to about 50 wt % of the tri-block copolymer. The film can comprise a refractive index from about 1.48 to about 1.55. Methods of forming a laminate can comprise disposing a film over a substrate. Methods can further comprise heating the film and the substrate to a first temperature and then a second temperature.
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14.
公开(公告)号:US20220119591A1
公开(公告)日:2022-04-21
申请号:US17495970
申请日:2021-10-07
Applicant: Corning Incorporated
Inventor: Mingqian He , Xin Li , Yang Li , Hongxiang Wang
Abstract: A method, includes: reacting at least one donor group with at least one protected acceptor group to form a plurality of protecting group-containing OSC polymers; removing the protecting group from the plurality of protecting group-containing OSC polymers to form H-bonding sites; and fusing the H-bonding sites of a first OSC polymer backbone with H-bonding sites of a second OSC polymer backbone to form π-π interactions between conjugated OSC polymers.
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公开(公告)号:US20210384433A1
公开(公告)日:2021-12-09
申请号:US17283359
申请日:2019-10-07
Applicant: Corning Incorporated
Inventor: Mingqian He , Jenny Kim , Xin Li , Yang Li , Hongxiang Wang
Abstract: A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.
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16.
公开(公告)号:US20210367153A1
公开(公告)日:2021-11-25
申请号:US17034552
申请日:2020-09-28
Applicant: CORNING INCORPORATED
Inventor: Mingqian He , Xin Li , Yang Li , Hongxiang Wang
Abstract: A polymer blend, including at least one organic semiconductor (OSC) polymer and at least one photosensitizer, such that the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, wherein the fused thiophene is beta-substituted.
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公开(公告)号:US20210341838A1
公开(公告)日:2021-11-04
申请号:US17283418
申请日:2019-10-09
Applicant: Corning Incorporated
Inventor: Huayun Deng , Mingqian He , Jenny Kim , Xin Li , Yang Li , Weijun Niu , Arthur Lawrence Wallace , Hongxiang Wang
Abstract: A polymer blend includes at least one organic semiconductor (OSC) polymer, at least one crosslinker, and at least one photoinitiator, such that the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene being beta-substituted, and such that the crosslinker includes at least one of: acrylates, epoxides, oxetanes, alkenes, alkynes, azides, thiols, allyloxysilanes, phenols, anhydrides, amines, cyanate esters, isocyanate esters, silyl hydrides, cinnamates, coumarins, fluorosulfates, silyl ethers, or a combination thereof.
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