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    Method for coating polymers on glass edges
    13.
    发明授权
    Method for coating polymers on glass edges 有权
    在玻璃边缘上涂覆聚合物的方法

    公开(公告)号：US08936838B2

    公开(公告)日：2015-01-20

    申请号：US13737412

    申请日：2013-01-09

    Applicant: Corning Incorporated

    Inventor： Kelvin Nguyen ,  Paul John Shustack

    IPC: C03C17/00 ,  B05C17/00

    CPC classification number: C03C17/001 ,  B05C17/00 ,  C03C17/007 ,  C03C2217/445 ,  C03C2217/475

    Abstract: The present disclosure is directed to a method for coating the edge of glass articles. The shaped edge of a glass article is inserted into the slot of a coating apparatus. The coating apparatus includes a vessel containing a UV curable coating material, an element connected to the vessel having the slot, wherein the slot is shaped to receive an edge of the glass article; and a coating pad having a coating surface shaped to conform to the shaped edge of the glass article, the pad having a network of interconnected openings therethrough, wherein the coating pad extends from the vessel and into the element so that the coating surface forms a bottom surface of the slot. An ultraviolet (UV) curable coating material is supplied to the coating pad and the shaped edge is contacted with the coating pad surface to transfer a selected thickness of the coating material from the coating pad to the shaped edge. The UV curable coating material is then cured on the shaped glass edge.

    Abstract translation: 本公开涉及一种用于涂覆玻璃制品的边缘的方法。 玻璃制品的成形边缘插入涂覆装置的槽中。 所述涂覆装置包括容纳紫外线固化涂层材料的容器，连接到具有所述狭槽的容器的元件，其中所述狭槽被成形为容纳所述玻璃制品的边缘; 以及涂层垫，其具有被成形为符合所述玻璃制品的成形边缘的涂层表面，所述垫具有穿过其中的互连开口的网络，其中所述涂覆垫从所述容器延伸并进入所述元件，使得所述涂层表面形成底部 槽的表面。 将紫外线（UV）固化涂层材料供应到涂覆垫，并且成形边缘与涂层表面接触，以将涂层材料的选定厚度从涂层转移到成形边缘。 然后将UV可固化涂层材料在成形的玻璃边缘上固化。

    Sacrificial Cover Layers for Laser Drilling Substrates and Methods Thereof
    14.
    发明申请
    Sacrificial Cover Layers for Laser Drilling Substrates and Methods Thereof 有权
    激光钻孔基板牺牲盖层及其方法

    公开(公告)号：US20140147623A1

    公开(公告)日：2014-05-29

    申请号：US14092536

    申请日：2013-11-27

    Applicant: CORNING INCORPORATED

    Inventor： Aric Bruce Shorey ,  Garrett Andrew Piech ,  Xinghua Li ,  John Christopher Thomas ,  John Tyler Keech ,  Jeffrey John Domey ,  Paul John Shustack

    IPC: B23K26/38 ,  C23F4/04

    CPC classification number: C23F4/04 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/102 ,  H05K3/0026 ,  Y10T428/24322

    Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

    Abstract translation: 一种用于通过钻孔在基板中形成多个精密孔的方法，包括将牺牲覆盖层固定到基板的表面，将激光束相对于基板定位在预定位置，并且对应于 多个精密孔，通过在预定位置重复地激励激光束在牺牲覆盖层中形成通孔，并将激光束脉冲到形成在牺牲覆盖层中的通孔中。 一种具有精密孔的工件，包括其中形成有精密孔的基板，其中每个精密孔的纵轴在基板的厚度方向上延伸，并且牺牲盖层可拆卸地固定到基板的表面，使得 牺牲覆盖层减少精密孔的不规则性。

    Glass articles with non-planar features and alkali-free glass elements
    17.
    发明授权
    Glass articles with non-planar features and alkali-free glass elements 有权

    公开(公告)号：US10483210B2

    公开(公告)日：2019-11-19

    申请号：US15523759

    申请日：2015-11-04

    Applicant: CORNING INCORPORATED

    Inventor： Timothy Michael Gross ,  Paul John Shustack ,  Wendell Porter Weeks

    IPC: H01L23/538 ,  H01L51/52 ,  H01L23/15 ,  H01L29/786 ,  H01L51/56 ,  B32B17/06 ,  C03C15/00 ,  C03C17/00 ,  C03C17/32 ,  H01L51/00

    Abstract: An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 μm to about 100 μm. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.

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