公开(公告)号：US11161279B2

公开(公告)日：2021-11-02

申请号：US16509413

申请日：2019-07-11

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki Takahashi

IPC: B05D1/14 ,  B29C35/08 ,  B29K105/04 ,  B32B27/12 ,  B32B5/18 ,  B32B5/24 ,  B32B7/06 ,  B32B7/12 ,  B32B5/02 ,  B32B38/00

Abstract: A shaped object production method includes a first preparation step (S30) of preparing a molding sheet that includes a base, a thermally expansive layer laminated on a first main surface of the base, the thermally expansive layer including a thermally expandable material, and a brushed layer laminated on a surface of the thermally expansive layer on a side that is opposite to the base, the brushed layer including fiber; a first heat conversion layer laminating step (S40) of laminating a heat conversion layer that converts electromagnetic waves into heat onto a surface of the molding sheet on a side that is opposite to the brushed layer; and a first unevenness forming step (S50) of forming an unevenness on the surface of the thermally expansive layer on the side that is opposite to the base by irradiating the heat conversion layer with electromagnetic waves, thereby causing the thermally expandable material to expand.

公开(公告)号：US11130262B2

公开(公告)日：2021-09-28

申请号：US16436808

申请日：2019-06-10

Applicant: Casio Computer Co., Ltd.

Inventor： Hideki Takahashi

IPC: B29C35/08 ,  H01H13/704 ,  B29K101/12 ,  H01H13/88

Abstract: A resin sheet production method includes a preparation step of preparing a resin molding sheet including a base and a thermally expansive layer that is formed on one main surface of the base, the thermally expansive layer including a thermally expandable material; a heat conversion layer forming step of forming a heat conversion layer that converts electromagnetic waves to heat on at least one of the first main surface of the resin molding sheet or a second main surface on a side opposite to the first main surface; a pre-heating step of heating the resin molding sheet on which the heat conversion layer is formed to a temperature that is lower than an expansion starting temperature at which the thermally expandable material starts to expand; and a main heating step of irradiating the heat conversion layer of the resin molding sheet that is heated in the pre-heating step with the electromagnetic waves to cause the heat conversion layer to distend, thereby causing the base to deform and forming a shaped object on the resin molding sheet.

公开(公告)号：US10994454B2

公开(公告)日：2021-05-04

申请号：US16018342

申请日：2018-06-26

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Yoshimune Motoyanagi ,  Yuji Horiuchi ,  Satoshi Mitsui ,  Hideki Takahashi

IPC: B29C44/34 ,  B29C44/60 ,  B29C35/08 ,  B29C59/18 ,  B29C35/02 ,  B29C44/24 ,  B29K75/00 ,  B29K105/04

Abstract: A thermally expandable sheet includes: a thermally expansive layer formed on a one surface of a base; a first ink receiving layer that is provided on the thermally expansive layer for receiving ink; a film provided on the first ink receiving layer; and a second ink receiving layer that is provided on the film for receiving ink; wherein the first ink receiving layer is formed of a material that provides a texture a different from a texture of the second ink receiving layer.

公开(公告)号：US20180272781A1

公开(公告)日：2018-09-27

申请号：US15934371

申请日：2018-03-23

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki Takahashi ,  Yuji Horiuchi ,  Yoshimune Motoyanagi ,  Satoshi Mitsui

IPC: B41M5/46 ,  B41M5/41

CPC classification number: B41M5/465 ,  B41J11/002 ,  B41M3/00 ,  B41M3/06 ,  B41M3/16 ,  B41M5/26 ,  B41M5/41 ,  B41M7/009 ,  C09D11/037 ,  C09D11/322 ,  C09D11/38 ,  C23C16/0209

Abstract: An ink is used for forming a photothermal conversion layer used for causing expansion of at least a portion of a thermal expansion layer of a thermal expansion sheet. The ink includes (i) an inorganic infrared absorbing agent having a higher absorptivity in at least one region of an infrared light spectrum than in a visible light spectrum, and (ii) a base that is transparent to visible light.