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107 条记录 (耗时 0.025 秒)

    System and method for heat dissipation
    14.
    发明申请
    System and method for heat dissipation 审中-公开
    散热系统及方法

    公开(公告)号：US20050219820A1

    公开(公告)日：2005-10-06

    申请号：US10816550

    申请日：2004-04-01

    申请人： Christian Belady ,  Eric Peterson ,  Brent Boudreaux ,  Shaun Harris ,  Roy Zeighami

    发明人： Christian Belady ,  Eric Peterson ,  Brent Boudreaux ,  Shaun Harris ,  Roy Zeighami

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201

    摘要： In one embodiment, a thermal dissipation system comprises a plurality of thermal members having surfaces adapted for transferring heat from heat generating elements, a heat sink, and a plurality of heat pipes, each of the heat pipes coupled between a respective one of the plurality of thermal members and the heat sink, wherein the plurality of heat pipes possess a sufficient amount of flexibility to enable each of the plurality of thermal members to be disposed over a range of positions relative to the heat sink.

    摘要翻译： 在一个实施例中，散热系统包括多个热构件，其具有适于从发热元件传递热量的表面，散热器和多个热管，每个热管耦合在多个 热构件和散热器，其中多个热管具有足够的灵活性，以使多个热构件中的每一个能够相对于散热器设置在一定范围内。

    Electrical connector
    16.
    发明申请
    Electrical connector 失效
    电连接器

    公开(公告)号：US20050026463A1

    公开(公告)日：2005-02-03

    申请号：US10632422

    申请日：2003-08-01

    申请人： Shaun Harris ,  Gary Williams ,  Paul Wirtzberger ,  Eric Peterson

    发明人： Shaun Harris ,  Gary Williams ,  Paul Wirtzberger ,  Eric Peterson

    IPC分类号： H01R12/16 ,  H01R13/26 ,  H01R12/00

    CPC分类号： H01R12/7088 ,  H01R12/721 ,  H01R13/26

    摘要： An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.

    摘要翻译： 用于电耦合两个部件（例如两个电路板）的电连接器组件包括联接到第一部件的插座和联接到第二部件的叶片。 插座包括至少布置在空间间隙的相对侧上的第一和第二导电接合构件。 刀片包括布置在绝缘体的相对侧上的至少第一和第二导电焊盘。 叶片具有与插座的空间间隙互补的宽度，使得当插入到空间间隙中时，叶片的第一导电垫与插座的第一导电接合构件形成电接触，并且叶片的第二导电垫与插座的第二导电 参与会员 刀片包括彼此偏置的第一和第二连接器机构，用于将第一和第二导电焊盘分别电耦合到第二部件。

    Communicating with an electronic module that is slidably mounted in a system
    17.
    发明申请
    Communicating with an electronic module that is slidably mounted in a system 有权
    与可滑动地安装在系统中的电子模块通信

    公开(公告)号：US20060158833A1

    公开(公告)日：2006-07-20

    申请号：US11039042

    申请日：2005-01-20

    申请人： Christian Belady ,  Eric Peterson

    发明人： Christian Belady ,  Eric Peterson

    IPC分类号： H05K5/00

    CPC分类号： H05K7/1492 ,  H05K7/1498

    摘要： A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.

    摘要翻译： 系统包括可滑动地安装在系统中的电子模块，包括安装在系统中的至少一个无线收发器的第一组件和包括至少一个无线收发器的第二组件，以与第一组件的无线收发器进行无线通信。 第二组件附接到电子模块，并且随着电子模块在系统中可滑动地移动，第一组件和第二组件的无线收发器继续通信。

    Enclosures with redundant fans in doors with interlocks
    18.
    发明申请
    Enclosures with redundant fans in doors with interlocks 有权
    带有冗余风扇的外壳带有联锁门

    公开(公告)号：US20060025065A1

    公开(公告)日：2006-02-02

    申请号：US10900862

    申请日：2004-07-27

    申请人： Christian Belady ,  Eric Peterson

    发明人： Christian Belady ,  Eric Peterson

    IPC分类号： H05K5/00

    CPC分类号： H05K5/0208

    摘要： An equipment rack including front and back doors is configured with fans for air cooling enclosed electronic devices in both doors. The fans in each door are sufficient, by themselves, to provide sufficient airflow to cool the electronic devices. The two doors include switches and magnetic interlocks configured such that when one door is opened, the magnetic interlock on the other door is activated preventing both door from being opened at the same time. This ensures that at least one door is always closed while the system is powered up, and since the fans in each door provide sufficient cooling for the equipment rack, the rack is always sufficiently cooled to prevent electronic device failure from overheating.

    摘要翻译： 包括前门和后门的设备机架配置有用于两个门的空气冷却封闭电子设备的风扇。 每个门中的风扇本身足以提供足够的气流来冷却电子设备。 这两个门包括开关和磁互锁，其构造使得当一个门打开时，另一个门上的磁互锁被启动，防止两个门同时打开。 这确保了在系统通电时至少有一个门总是关闭，并且由于每个门中的风扇为设备机架提供足够的冷却，所以机架总是被充分冷却以防止电子设备故障过热。

    Thermal dissipation device with thermal compound recesses
    19.
    发明申请
    Thermal dissipation device with thermal compound recesses 审中-公开
    具有热复合凹槽的散热装置

    公开(公告)号：US20060238984A1

    公开(公告)日：2006-10-26

    申请号：US11110404

    申请日：2005-04-20

    申请人： Christian Belady ,  Eric Peterson

    发明人： Christian Belady ,  Eric Peterson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments include apparatus, methods, and systems providing a thermal dissipation device with thermal compound recesses. In one embodiment, the thermal dissipation device includes a body with plural recesses formed in a planar surface of the body. The recesses are adapted to receive a thermal compound that conducts heat from an electronic heat generating component to the thermal dissipation device.

    摘要翻译： 实施例包括提供具有热复合凹槽的散热装置的装置，方法和系统。 在一个实施例中，散热装置包括具有形成在主体的平面表面中的多个凹部的主体。 凹部适于接收将热从电子发热部件传导到散热装置的热化合物。