公开(公告)号：US20250012988A1

公开(公告)日：2025-01-09

申请号：US18347452

申请日：2023-07-05

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Sandeep RAZDAN

IPC: G02B6/42

Abstract: The present disclosure relates to an opto-electrical circuit and a method of forming an opto-electrical circuit. According to an embodiment, a circuit includes a photonic integrated circuit, an intermetal dielectric, an oxide layer, and a first electronic integrated circuit. The intermetal dielectric is coupled to the photonic integrated circuit. The oxide layer is coupled to the intermetal dielectric such that the intermetal dielectric is positioned between the photonic integrated circuit and the oxide layer. The first electronic integrated circuit is positioned within the oxide layer and coupled to the intermetal dielectric. A through oxide via extends through the oxide layer to the intermetal dielectric.

公开(公告)号：US20240337870A1

公开(公告)日：2024-10-10

申请号：US18297321

申请日：2023-04-07

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Ming Gai Stanley LO ,  Mark A. WEBSTER ,  Farnood KHALILZADEH REZAIE

IPC: G02F1/015

CPC classification number: G02F1/0154 ,  G02F2201/063 ,  G02F2202/20

Abstract: Embodiments herein describe a photonic platform having a chiplet with a Pockels effect electro-optic layer made of LN or BTO and a substrate. The chiplet is bonded to a photonic wafer which includes a waveguide. In this manner, a ridge waveguide formed by the Pockels effect electro-optic layer and the waveguide utilizes electro-optic effects to tune a signal.

公开(公告)号：US20240304512A1

公开(公告)日：2024-09-12

申请号：US18182072

申请日：2023-03-10

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD ,  Paul TON

IPC: H01L23/367 ,  G02B6/38 ,  H01L23/50

CPC classification number: H01L23/367 ,  G02B6/3897 ,  H01L23/50

Abstract: An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.

公开(公告)号：US20240248258A1

公开(公告)日：2024-07-25

申请号：US18157626

申请日：2023-01-20

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Donald J. ADAMS ,  Vipulkumar K. PATEL

IPC: G02B6/30

CPC classification number: G02B6/305

Abstract: An optical coupler and a method performed by the optical coupler are described. The optical coupler includes an interlayer dielectric, a waveguide disposed within the interlayer dielectric, and an epoxy disposed on the interlayer dielectric and in the first cavity such that the epoxy defines an upper surface and a bottom surface. The interlayer dielectric includes a first surface and a second surface coupled to the first surface. The first surface and the second surface define a first cavity in the interlayer dielectric. The waveguide emits an optical signal through the first surface. The bottom surface is positioned between the interlayer dielectric and the upper surface. The epoxy directs the optical signal from the first surface to the second surface. The second surface and the epoxy direct a first portion of the optical signal through the upper surface.

公开(公告)号：US20210231875A1

公开(公告)日：2021-07-29

申请号：US16751994

申请日：2020-01-24

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Vipulkumar K. PATEL ,  Matthew J. TRAVERSO ,  Mark A. WEBSTER

IPC: G02B6/293

Abstract: Aspects described herein include an optical waveguide emitter that includes a first optical waveguide and a second optical waveguide that are evanescently coupled and collectively configured to selectively propagate only a first mode of a plurality of optical modes. Each of the first optical waveguide and the second optical waveguide extend through an input waveguide section, a turning waveguide section, and an output waveguide section. One or more of the input waveguide section, the turning waveguide section, and the output waveguide section includes an optically active region. The optical waveguide emitter further includes a refractive index-increasing feature in the turning waveguide section.

公开(公告)号：US20200313390A1

公开(公告)日：2020-10-01

申请号：US16366756

申请日：2019-03-27

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Vipulkumar K. PATEL

IPC: H01S5/10 ,  H01S5/026 ,  H03F3/20

Abstract: A master oscillator power amplifier comprises a semiconductor laser formed on a substrate and configured to output an optical signal, and a semiconductor optical amplifier (SOA) formed on the substrate. The SOA comprises an optical waveguide having an optically active region, wherein the optical waveguide is configured to expand a mode size of the optical signal along at least two dimensions.

公开(公告)号：US20200301176A1

公开(公告)日：2020-09-24

申请号：US16356982

申请日：2019-03-18

Applicant: Cisco Technology, Inc.

Inventor： Xunyuan ZHANG ,  Vipulkumar K. PATEL ,  Prakash B. GOTHOSKAR ,  Ming Gai Stanley LO

IPC: G02F1/025

Abstract: Embodiments provide for an optical modulator, comprising: a lower guide, comprising: a lower hub, made of monocrystalline silicon; and a lower ridge, made of monocrystalline silicon that extends in a first direction from the lower hub; an upper guide, including: an upper hub; and an upper ridge, made of monocrystalline silicon that extends in a second direction, opposite of the first direction, from the upper hub and is aligned with the lower ridge; and a gate oxide layer separating the lower ridge from the upper ridge and defining a waveguide region with the lower guide and the upper guide.

公开(公告)号：US20200241202A1

公开(公告)日：2020-07-30

申请号：US16259998

申请日：2019-01-28

Applicant: Cisco Technology, Inc.

Inventor： Alexey V. VERT ,  Vipulkumar K. PATEL ,  Mark A. WEBSTER

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/12 ,  G02B6/30

Abstract: Embodiments disclosed herein generally relate to optical coupling between a highly-confined waveguide region and a low confined waveguide region in an optical device. The low confined waveguide region includes a trench in a substrate of the optical device in order to provide additional dielectric layer thickness for insulation between the substrate of the optical device and waveguides for light signals having a low optical mode. The low confined waveguide region is coupled to the highly-confined waveguide region via a waveguide overlap and in some embodiments via an intermediary coupling waveguide.

公开(公告)号：US20250015213A1

公开(公告)日：2025-01-09

申请号：US18346558

申请日：2023-07-03

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Xunyuan ZHANG

IPC: H01L31/0352 ,  H01L31/0232 ,  H01L31/105 ,  H01L31/18

Abstract: The present disclosure relates to a photodiode and method of forming the photodiode. The photodiode includes a doped layer and an absorption region positioned on the doped layer. The absorption region includes a base region contacting the doped layer, a first facet region positioned on the base region, and a second facet region positioned on the first facet region. The first facet region includes (i) a first tapered surface and a second tapered surface extending from the base region and (ii) a first step region and a second step region extending laterally from the first tapered surface and the second tapered surface, respectively. The second facet region includes a third tapered surface extending from the first step region and a fourth tapered surface extending from the second step region.

公开(公告)号：US20240264370A1

公开(公告)日：2024-08-08

申请号：US18165844

申请日：2023-02-07

Applicant: Cisco Technology, Inc.

Inventor： Aparna R. PRASAD ,  Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Arturo PACHON MUNOZ

IPC: G02B6/12 ,  G02B6/13

CPC classification number: G02B6/12004 ,  G02B6/13 ,  G02B2006/12061

Abstract: An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.