Systems and methods for distributing power in a Power-to-the-Edge system architecture

    公开(公告)号:US11251695B2

    公开(公告)日:2022-02-15

    申请号:US16642406

    申请日:2018-09-07

    Abstract: Systems and methods for distributing power in a power-to-the-edge system architecture are provided. In one embodiment, a system comprises an intelligent power switch configured to couple to a power supply, wherein the intelligent power switch outputs a first differential voltage output; and a plurality of intelligent remote nodes each comprising a management microcontroller (MCU) and a DC-to-DC converter. The intelligent remote nodes each receive the differential voltage output, and are communicatively coupled to a data network. The intelligent power switch comprises a processor executing an intelligent start-up control and switching function and an electrical fault detection function. The intelligent power switch outputs the differential voltage at a first voltage level while the electrical fault detection function monitors the differential voltage output. Based on results of monitoring at the first voltage level, the intelligent power switch switches the output to a second voltage level higher than the first voltage level.

    Telecommunications enclosure with separate heat sink assembly

    公开(公告)号:US11026349B2

    公开(公告)日:2021-06-01

    申请号:US16614845

    申请日:2018-05-18

    Abstract: Disclosed herein is a telecommunications enclosure. The telecommunications enclosure includes a housing defining an interior and including at least one cable port. The telecommunications enclosure also includes a printed circuit board in the interior of the housing and heat generating components on the printed circuit board. The telecommunications enclosure further includes a heat sink assembly in the interior of the housing. The heat sink assembly includes a thermally conductive plate mounted to transfer heat to the housing; and heat sink components extending from a first face of the thermally conductive plate. Each heat sink component corresponds to and is in alignment with one of the heat generating components. The heat sink assembly is a separate component from the housing.

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