公开(公告)号：US10534990B2

公开(公告)日：2020-01-14

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US10089570B2

公开(公告)日：2018-10-02

申请号：US15641939

申请日：2017-07-05

Applicant: COMPOSECURE, LLC

Inventor： John Herslow ,  Michele Logan ,  David Finn

IPC: G06K19/06 ,  G06K19/077 ,  G01B7/06 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q7/00

Abstract: In a smart card having an antenna structure and a metal layer, an insulator layer is formed between the antenna structure and the metal layer to compensate for the attenuation due to the metal layer. The thickness of the insulator layer affects the capacitive coupling between the antenna structure and the metal layer and is selected to have a value which optimizes the transmission/reception of signals between the card and a card reader.

公开(公告)号：US12299514B2

公开(公告)日：2025-05-13

申请号：US17137515

申请日：2020-12-30

Applicant: Composecure LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  B32B3/04 ,  B32B3/08 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/00 ,  B32B9/02 ,  B32B9/04 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B15/20 ,  B32B21/00 ,  B32B21/04 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  B32B38/06 ,  B32B38/10 ,  B32B38/14 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/02 ,  C25D7/00 ,  C25D11/04 ,  C25D11/08 ,  C25D11/18 ,  C25D11/24 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  B32B27/18

Abstract: Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

公开(公告)号：US20240403592A1

公开(公告)日：2024-12-05

申请号：US18748191

申请日：2024-06-20

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  B32B3/04 ,  B32B3/08 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/00 ,  B32B9/02 ,  B32B9/04 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B15/20 ,  B32B21/00 ,  B32B21/04 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  B32B38/06 ,  B32B38/10 ,  B32B38/14 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/02 ,  C25D7/00 ,  C25D11/04 ,  C25D11/08 ,  C25D11/18 ,  C25D11/24 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02

Abstract: Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

公开(公告)号：US12151502B2

公开(公告)日：2024-11-26

申请号：US16594591

申请日：2019-10-07

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Luis J. DaSilva

IPC: B32B3/30 ,  B32B15/08 ,  B32B27/06 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B38/06 ,  B42D25/00 ,  B42D25/425 ,  B42D25/46 ,  B32B37/00 ,  B32B37/02 ,  B32B38/00 ,  B32B38/14 ,  B42D25/328 ,  B42D25/45

Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.

公开(公告)号：US10748049B2

公开(公告)日：2020-08-18

申请号：US16739211

申请日：2020-01-10

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.

公开(公告)号：US10395153B2

公开(公告)日：2019-08-27

申请号：US15637092

申请日：2017-06-29

Applicant: COMPOSECURE, LLC

Inventor： John Herslow

IPC: G06K19/02 ,  G06K19/077 ,  B32B37/00 ,  B32B37/18

Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

公开(公告)号：US10332846B2

公开(公告)日：2019-06-25

申请号：US15355018

申请日：2016-11-17

Applicant: COMPOSECURE, LLC

Inventor： John Herslow

IPC: B42D25/435 ,  H01L23/00 ,  B32B37/12 ,  B32B38/06 ,  G06K19/077 ,  H01L21/56 ,  B42D25/41 ,  B42D25/328 ,  B42D25/425 ,  B32B7/12 ,  B32B15/04 ,  G06K19/06 ,  H01L23/498 ,  B42D25/373 ,  B42D25/47 ,  B32B38/10 ,  B32B38/00

Abstract: Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at or in the center, or core layer of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be “lasered’ when the cards being processed are attached to, and part of, a large sheet of material, or after the sheets are die-cut into cards.

公开(公告)号：US10311346B2

公开(公告)日：2019-06-04

申请号：US14178436

申请日：2014-02-12

Applicant: COMPOSECURE, LLC

Inventor： John Herslow

IPC: G06K19/077 ,  G06K19/02 ,  B32B37/00 ,  B32B37/18 ,  G06K17/00

Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

公开(公告)号：US09898699B2

公开(公告)日：2018-02-20

申请号：US14977553

申请日：2015-12-21

Applicant: COMPOSECURE, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06F19/00 ,  G06K19/077 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q7/06 ,  G06K19/02

CPC classification number: G06K19/07773 ,  G06K19/02 ,  G06K19/07771 ,  H01Q1/2225 ,  H01Q1/526 ,  H01Q7/06

Abstract: Ferrite material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient ferrite material is utilized to track and conform to the antenna.