Abstract:
A random access memory array includes random access memory elements arranged in a rows and columns. The elements of each row have a word line and a write digit line and the elements of each column have a bit line and a write bit line. A first selection circuit/transistor for each row has a first source-drain path coupled in the write digit line and a gate terminal coupled to the word line. A second selection circuit/transistor for each column has a second source-drain path coupling in the write bit line and a gate terminal coupled to the bit line. A first write signal is applied to one word line to actuate the first selection circuit/transistor for the row corresponding to that one word line and cause a write current to flow through the first source-drain path of the actuated first selection circuit/transistor and the corresponding write digit line to write data into certain memory elements in that row. A second write signal is applied to one bit line to actuate the second selection circuit/transistor for the column corresponding to that one bit line and cause a write current to flow through the second source-drain path of the actuated second selection circuit/transistor and the corresponding write bit line to write data into at least one memory element in that column.
Abstract:
A switch arrangement for switching a node between three supply voltages based on two control signals. The switch arrangement includes three circuits for connecting an output node with one of three nodes, each of which is set to a different voltage. The switch arrangement is controlled by six control signals that establish mutually exclusive switching modes and avoid combinational currents. The switch arrangement is also designed to allow the use of MOS transistors having a low nominal voltage, with a value that is lower than the highest voltage to be switched. The switch arrangement is particularly adapted to supply power to non-volatile memory cells.
Abstract:
The semiconductor memory device includes an electrically erasable programmable non-volatile memory cell having a single layer of gate material and including a floating-gate transistor and a control gate. The source, drain and channel regions of the floating-gate transistor form the control gate. Moreover, the memory cell includes a dielectric zone lying between a first part of the layer of gate material and a first semiconductor active zone electrically isolated from a second active zone incorporating the control gate. This dielectric zone then forms a tunnel zone for transferring, during erasure of the cell, the charges stored in the floating gate to the first active zone.
Abstract:
The FAMOS memory location comprises a single floating gate (GR) overlapping an active surface of a semiconductor substrate according to at least two asymmetrical overlap profiles (PF1, PF2) so as to define at least two electrodes in the active region. Memory location programming means (MC, SW) are capable of selectively applying different predetermined sets of bias voltages to the electrodes so as to confer at least three programming logic levels on the memory location.
Abstract:
Described is an apparatus for memory write assist which consumes low power during write assist operation. The apparatus comprises: a power supply node; a device operable to adjust voltage on the power supply node; and a feedback unit coupled to the power supply node, the feedback unit to control the device in response to a voltage level of the voltage on the power supply node.
Abstract:
A device, and a corresponding method of implementation, for SRAM memory information storage are provided. The device is powered by a supply voltage and includes an array of base cells organized in base columns, and at least one mirror column of at least one mirror cell liable to simulate the behavior of the cells in a base column. The device further includes Emulation means, in a mirror column, of the most restricting cell in a base column, Means for varying a mirror power supply voltage for the mirror column, and Means for copying the mirror power supply voltage in the emulated base column.
Abstract:
A buffer circuit includes at least one part that is powered by a supply voltage by means of a first initialization transistor, and connected to the ground by means of a second initialization transistor. The circuit is capable of transferring, between an input and an output, an input signal including at least one rising edge and/or one falling edge. The circuit includes a first CMOS inverter, of which the input is connected to the input of the circuit, and of which the output is mounted in series with the input of a second CMOS inverter, with the output of the second CMOS inverter being connected to the output of the circuit. A circuit creates an overvoltage on one of the two inverters during operation.
Abstract:
An apparatus including a memory cell, a reference cell, a control unit, coupled to the memory cell and the reference cell, and configured to initiate write processes of the memory cell and the reference cell, and a detection unit, coupled to the reference cell, and configured to detect a write completion of the reference cell. Related methods are also disclosed.
Abstract:
A buffer circuit includes at least one part that is powered by a supply voltage by means of a first initialization transistor, and connected to the ground by means of a second initialization transistor. The circuit is capable of transferring, between an input and an output, an input signal including at least one rising edge and/or one falling edge. The circuit includes a first CMOS inverter, of which the input is connected to the input of the circuit, and of which the output is mounted in series with the input of a second CMOS inverter, with the output of the second CMOS inverter being connected to the output of the circuit. A circuit creates an overvoltage on one of the two inverters during operation.
Abstract:
The semiconductor memory device includes an electrically erasable programmable non-volatile memory cell having a single layer of gate material and including a floating-gate transistor and a control gate. The source, drain and channel regions of the floating-gate transistor form the control gate. Moreover, the memory cell includes a dielectric zone lying between a first part of the layer of gate material and a first semiconductor active zone electrically isolated from a second active zone incorporating the control gate. This dielectric zone then forms a tunnel zone for transferring, during erasure of the cell, the charges stored in the floating gate to the first active zone.