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公开(公告)号：US20200239727A1
公开(公告)日：2020-07-30
申请号：US16672916
申请日：2019-11-04
Applicant: DAICEL CORPORATION
Inventor： Yuichi SAKANISHI
IPC: C09D163/00 , C09D5/08 , C08G65/26 , H01L21/306
Abstract: Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer.The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below; R1O—(C3H6O2)n—H (1) where R1 denotes a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may have a hydroxyl group, or a group represented by R2CO, where the R2 denotes a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit shown in the parentheses, and is from 2 to 60.
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公开(公告)号：US20170158619A1
公开(公告)日：2017-06-08
申请号：US15310146
申请日：2015-05-01
Applicant: DAICEL CORPORATION , YAMAGUCHI UNIVERSITY
Inventor： Yuichi SAKANISHI , Takashi SAEKI , Mami ITOH
IPC: C07C233/58 , A61K8/37 , A61Q19/00 , A61K8/42
CPC classification number: C07C233/58 , A61K8/37 , A61K8/42 , A61K2800/48 , A61K2800/52 , A61Q19/007 , C07C2101/14 , C07C2601/14 , C09K8/035
Abstract: The present invention provides a compound that thickens or gels a fluid organic substance to a desired viscosity or homogeneously stabilizes a composition containing a fluid organic substance, a thickening/stabilizing agent containing the compound, a thickened/stabilized composition containing the thickening/stabilizing agent and a fluid organic substance, and a method for producing a thickened/stabilized composition.The compound of the present invention is represented by the following formula (1). In the formula, R1 and R2 are different from each other and represent an aliphatic hydrocarbon group having not less than 4 carbon atoms, and n represents an integer of 1 to 3. The thickening/stabilizing agent of the present invention contains the compound.
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Patent Agency Ranking
13.发明公开公开(公告)号：US20230190592A1
公开(公告)日：2023-06-22
申请号：US17926426
申请日：2021-05-14
Applicant: DAICEL CORPORATION
Inventor： Yuta SAKAMOTO , Yuichi SAKANISHI , Keiko KOBAYASHI , Masaya OMURA
CPC classification number: A61K8/062 , A61K8/731 , A23D7/0053 , A61K2800/412
Abstract: Provided are an emulsifiable preparation that has little influence on the environment or the human body, that is excellent in long-term storage stability, and that imparts a pleasant touch feeling to the skin, and an aqueous cosmetic that contains the emulsifiable preparation, a food or beverage that contains the emulsifiable preparation, and a pharmaceutical composition that contains the emulsifiable preparation. The emulsifiable preparation includes: one or more aqueous components selected from the group consisting of water and alcohol; an oily component; and microparticles of a polymer compound, in which the microparticles contain cellulose acetate as the polymer compound, and the microparticles has an average particle size of 2 to 10 μm. The aqueous cosmetic contains the emulsifiable preparation. The food or beverage contains the emulsifiable preparation. The pharmaceutical composition contains the emulsifiable preparation.
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公开(公告)号：US20230174892A1
公开(公告)日：2023-06-08
申请号：US17924489
申请日：2021-04-21
Applicant: DAICEL CORPORATION
Inventor： Yuichi SAKANISHI
CPC classification number: C11D1/40 , C11D1/62 , C11D3/2065 , C11D11/0047
Abstract: A detergent composition and a polishing composition are provided. The detergent composition facilitates sufficient removal of polishing agents, metal microparticles, and anticorrosives in cleaning of a semiconductor substrate and long-term maintenance of flatness of a metal wiring surface after cleaning and achieves excellent quality stability for a long period of time; and the polishing composition facilitates suppression of scratching on a polished object such as a semiconductor substrate, and reduction of filter clogging. A detergent composition containing an alkanol hydroxylamine compound represented by General Formula (1) and having a pH of 10 to 13, and a chemical-mechanical polishing composition containing the detergent composition and a polishing agent. In Formula (1), Ra1 and Ra2 are the same or different and each represents a hydrogen atom or an alkyl group having from 1 to 10 carbons and having from 1 to 3 hydroxyl groups, with proviso that Ra1 and Ra2 are not simultaneously hydrogen atoms, and a total number of hydroxyl groups present in Ra1 and Ra2 is not 0.
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公开(公告)号：US20210130749A1
公开(公告)日：2021-05-06
申请号：US16478436
申请日：2017-12-28
Applicant: DAICEL CORPORATION
Inventor： Yuichi SAKANISHI
Abstract: To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities.
The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B):
Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3). Ra1O—(C3H6O2)n—H (a-1) Ra2O—(Ra3O)n′—H (a-2) (Ra4)3-s—N—[(Ra5O)n″—H]s (a-3)-
公开(公告)号：US20190300495A1
公开(公告)日：2019-10-03
申请号：US16308105
申请日：2017-04-21
Applicant: DAICEL CORPORATION
Inventor： Yuichi SAKANISHI
IPC: C07D311/20 , C11D1/72 , B01F17/00
Abstract: A nonionic surfactant that is environmentally friendly, has excellent surface active power (emulsifying power and solubilizing power), and is capable of stably maintaining the excellent surface active power for a long time is provided. A nonionic surfactant of the present invention contains polyglycerol monoether represented by the formula (1), wherein a ring Z represents a condensed ring of an aromatic hydrocarbon ring having 6 to 14 carbon atoms and a 3 to 6-membered heterocycle containing an oxygen atom as a heteroatom; R1 is a substituent bonded to the ring Z and represents an aliphatic hydrocarbon group having 14 to 25 carbon atoms; the ring Z optionally has one or more substituents other than R1; and n is an average number of monomers of glycerol and represents 2 to 20.
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公开(公告)号：US20180230401A1
公开(公告)日：2018-08-16
申请号：US15866126
申请日：2018-01-09
Applicant: DAICEL CORPORATION
Inventor： Yuichi SAKANISHI , Dingding LIU
CPC classification number: C11D1/82 , C11D1/008 , C11D1/04 , C11D1/12 , C11D1/62 , C11D1/86 , C11D3/042 , C11D3/162 , C11D3/18 , C11D3/245 , C11D3/373 , C11D3/3742 , C11D3/43 , C11D11/0023 , C11D11/0041
Abstract: Provided are: a novel compound that has excellent activity of dissolving a silicone compound and thereby solubilizing the silicone compound in an organic solvent; and a cleaner that contains the compound and can completely and rapidly remove the silicone compound deposited/remained on a mold and/or a molded article obtained using the mold. The novel compound is represented by Formula (1). The silicone-dissolvative cleaner contains (A) a silicone surfactant represented by Formula (1); and (B) an organic solvent. Formula (1) is expressed as follows: wherein “A” represents an ionic group selected from the group consisting of a sulfonic ion, a carboxylic ion, and a quaternary ammonium cation; and B represents a counter-ion to “A” and is selected from an alkali metal ion and a halide ion.
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