公开(公告)号：US20200040014A1

公开(公告)日：2020-02-06

申请号：US16492448

申请日：2018-03-02

Applicant: DAICEL CORPORATION ,  YAMAGUCHI UNIVERSITY

Inventor： Yuichi SAKANISHI ,  Takashi SAEKI ,  Aya KAIDE

IPC: C07F7/08

Abstract: The present invention provides a compound that thickens or gels a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing a fluid organic substance. The compound of the present invention is a compound represented by Formula (1) below: wherein, R1 represents a monovalent aliphatic hydrocarbon group having 4 or more carbons; R2 represents a divalent aliphatic hydrocarbon group having from 1 to 12 carbons; R3 represents a monovalent aliphatic hydrocarbon group having from 1 to 12 carbons; m represents an integer from 0 to 10; and n represents an integer from 1 to 4; in a case where n is 1 or 2, (4−n) R1s may be the same or different; and in a case where n is from 2 to 4, n R2s, n R3s, and n m's each may be the same or different.

公开(公告)号：US20170137373A1

公开(公告)日：2017-05-18

申请号：US15323627

申请日：2015-07-07

Applicant: DAICEL CORPORATION ,  YAMAGUCHI UNIVERSITY

Inventor： Yuichi SAKANISHI ,  Takashi SAEKI ,  Mami ITOH

IPC: C07C235/84 ,  A23L29/20 ,  A61K8/42 ,  C09D7/00 ,  C07C235/82 ,  A61K47/18

CPC classification number: C07C235/84 ,  A23L29/20 ,  A23V2002/00 ,  A61K8/42 ,  A61K47/16 ,  A61K47/18 ,  A61K2800/10 ,  A61K2800/48 ,  C07C233/65 ,  C07C235/82 ,  C09D7/43

Abstract: Provided is a compound that thickens and/or gelatinizes a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing the fluid organic substance. Also provided are: a thickening/stabilizing agent including the compound, a thickened/stabilized composition including the thickening/stabilizing agent and a fluid organic substance, and a method for producing the composition. The compound according to the present invention is represented by Formula (1): (R2—HNOC)4-n—R1—(CONH—R3)n  (1) where R1 is a group resulting from removing four hydrogen atoms from the structural formula of an aromatic hydrocarbon or cyclohexane; R2 is, independently in each occurrence, an aliphatic hydrocarbon group containing 1 to 4 carbon atoms; R3 is, independently in each occurrence, an aliphatic hydrocarbon group containing 6 or more carbon atoms; and n is an integer of 1 to 3.

公开(公告)号：US20180195030A1

公开(公告)日：2018-07-12

申请号：US15866830

申请日：2018-01-10

Applicant: DAICEL CORPORATION

Inventor： Yuichi SAKANISHI

IPC: C11D11/00 ,  C11D1/00 ,  C11D3/43 ,  G03F7/42

CPC classification number: C11D11/0047 ,  C11D1/008 ,  C11D1/72 ,  C11D3/2068 ,  C11D3/43 ,  C11D7/263 ,  G03F7/425 ,  G03F7/426 ,  H01L21/31133

Abstract: Problem to be SolvedTo provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist.SolutionThe composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A).Component (A): a polyglycerol derivative represented by the following formula (a): RaO—(C3H5O2Ra)n—Ra  (a) wherein n represents the number of the repeating units, and is an integer of 2 to 60; and Ra identically or differently represents a hydrogen atom, a C1-18 hydrocarbon group or a C2-24 acyl group, provided that at least two of the (n+2) number of Ra are C1-18 hydrocarbon groups and/or C2-24 acyl groups.

公开(公告)号：US20160009619A1

公开(公告)日：2016-01-14

申请号：US14377792

申请日：2013-02-04

Applicant: DAICEL CORPORATION

Inventor： Tetsuya MAEHARA ,  Yuichi SAKANISHI ,  Daisuke ABURANO ,  Kyuhei KITAO

IPC: C07C43/15 ,  C07C43/13 ,  A61Q19/10 ,  A61K8/34 ,  A61Q1/14 ,  C07C43/11 ,  A61K8/33

CPC classification number: C07C43/15 ,  A61K8/33 ,  A61K8/34 ,  A61K8/345 ,  A61K2800/10 ,  A61Q1/14 ,  A61Q19/00 ,  A61Q19/10 ,  C07C43/11 ,  C07C43/13 ,  C07C43/135 ,  C07C43/178 ,  C08G65/34 ,  C08G65/48

Abstract: Provided are: a novel polyglycerol di-(alkyl/alkenyl) ether that is useful as a highly hydrophilic gemini surfactant; and a cosmetic composition containing the polyglycerol di-(alkyl/alkenyl) ether. The polyglycerol di-(alkyl/alkenyl) ether is represented by Formula (1), where R1 and R2 are identical or different and are independently a straight- or branched-chain alkyl group or a straight- or branched-chain alkenyl group, where the alkyl group may have one or more hydroxyl groups; and n indicates a number of glycerol units and is an integer of 2 or more. Formula (1) is expressed as follows:

Abstract translation: 提供：可用作高亲水性双子表面活性剂的新型聚甘油二（烷基/烯基）醚; 和含有聚甘油二（烷基/烯基）醚的化妆品组合物。 聚甘油二（烷基/烯基）醚由式（1）表示，其中R 1和R 2相同或不同，并且独立地为直链或支链烷基或直链或支链烯基，其中 烷基可以具有一个或多个羟基; n表示甘油单元数，为2以上的整数。 公式（1）表示如下：

公开(公告)号：US20150376119A1

公开(公告)日：2015-12-31

申请号：US14761817

申请日：2014-02-04

Applicant: DAICEL CORPORATION ,  YAMAGUCHI UNIVERSITY

Inventor： Yuichi SAKANISHI ,  Takashi SAEKI ,  Yusuke NARUSAKA ,  Mami ITOH

IPC: C07C235/84 ,  A61K8/42 ,  C09D7/00 ,  A61K47/18 ,  A23L1/05

CPC classification number: C07C235/84 ,  A23L29/20 ,  A23V2002/00 ,  A61K8/42 ,  A61K9/06 ,  A61K47/18 ,  A61K47/44 ,  A61K2800/10 ,  A61K2800/48 ,  A61Q19/00 ,  C08K5/20 ,  C09D7/43 ,  C09K3/00

Abstract: Provided is a compound which thickens or gels a fluid organic material to a desired viscosity, or which uniformly stabilizes the formulation of a composition containing the fluid organic material.The compound according to the present invention is represented by Formula (1): R1—(CONH—R2)n   (1) where R1 represents an n-valent aromatic hydrocarbon group containing two or more benzene rings; R2 represents an aliphatic hydrocarbon group containing 6 or more carbon atoms; and n represents an integer of 4 or more. The group R1 is preferably a group corresponding to an aromatic hydrocarbon selected from the group consisting of benzophenone, biphenyl, and naphthalene, except for removing hydrogen atoms in a number of n from the aromatic hydrocarbon. A thickening/stabilizing agent according to the present invention includes the compound.

Abstract translation: 提供了将流体有机材料变稠或凝胶化成所需粘度或均匀稳定含有流体有机材料的组合物的制剂的化合物。 根据本发明的化合物由式（1）表示：R1-（CONH-R2）n（1）其中R1表示含有两个或更多个苯环的n价芳族烃基; R2表示含有6个或更多个碳原子的脂族烃基; n表示4以上的整数。 除了从芳香族烃中除去n个以外的氢原子以外，基团R 1优选为对应于选自二苯甲酮，联苯和萘的芳烃的基团。 根据本发明的增稠/稳定剂包括该化合物。

公开(公告)号：US20200216385A1

公开(公告)日：2020-07-09

申请号：US16327283

申请日：2017-07-20

Applicant: DAICEL CORPORATION ,  YAMAGUCHI UNIVERSITY

Inventor： Yuichi SAKANISHI ,  Takashi SAEKI ,  Aya KAIDE

IPC: C07C233/65 ,  A61K8/42 ,  A61K47/18

Abstract: Provided is a thickening/stabilizing agent that thickens, gelatinizes, and/or stabilizes a fluid organic substance to a desired viscosity. The thickening/stabilizing agent according to the present invention contains a compound (1) represented by Formula (i) and a compound (2) represented by Formula (ii), in a mole ratio of the compound (1) to the compound (2) of 95:5 to 25:75. The four R1s in Formula (i) represent, identically in each occurrence, a C12-C18 aliphatic hydrocarbon group; and the four R2s in Formula (ii) represent, identically in each occurrence, an C4-C10 aliphatic hydrocarbon group. Formulae (i) and (ii) are expressed as follows:

公开(公告)号：US20180231890A1

公开(公告)日：2018-08-16

申请号：US15893079

申请日：2018-02-09

Applicant: DAICEL CORPORATION

Inventor： Yuichi SAKANISHI

IPC: G03F7/16 ,  H01L21/308 ,  G03F7/039 ,  G03F7/32 ,  G03F7/40 ,  H01L21/304

CPC classification number: G03F7/168 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/162 ,  G03F7/32 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0273 ,  H01L21/304 ,  H01L21/3081 ,  H01L21/3086

Abstract: Problem to be SolvedProvided is an agent for resist hydrophilization treatment that can hydrophilize a surface of a resist coating rapidly and stably while inhibiting deterioration of the resist coating.SolutionAn agent for resist hydrophilization treatment of the present invention comprises at least following components (A) and (B): component (A): a polyglycerol or a derivative thereof represented by following formula (a): RaO—(C3H6O2)n—H  (a) wherein Ra represents a hydrogen atom, a hydrocarbon group having 1 to 18 carbon atoms optionally having a hydroxyl group, or an acyl group having 2 to 24 carbon atoms; and n represents an average polymerization degree of glycerol units shown in the parentheses, and is an integer from 2 to 60; component (B): water.

公开(公告)号：US20170320814A1

公开(公告)日：2017-11-09

申请号：US15528403

申请日：2015-11-10

Applicant: DAICEL CORPORATION ,  YAMAGUCHI UNIVERSITY

Inventor： Yuichi SAKANISHI ,  Takashi SAEKI ,  Mami ITOH

IPC: C07C235/74 ,  A61K47/18 ,  C09D7/00 ,  A23L29/20 ,  A61Q19/00 ,  A61K8/42

CPC classification number: C07C235/74 ,  A23L29/20 ,  A23V2002/00 ,  A61K8/42 ,  A61K47/18 ,  A61K2800/10 ,  A61K2800/48 ,  A61Q19/00 ,  C09D7/43 ,  C09K3/00

Abstract: Provided are: a compound, a thickening/stabilizing agent including the compound, a thickened/stabilized composition including the thickening/stabilizing agent and a fluid organic substance, and a method for producing the thickened/stabilized composition, where the compound effectively thickens the fluid organic substance to a desired viscosity and effectively uniformly stabilizes the formulation of the composition containing the fluid organic substance via thickening of the fluid organic substance. The thickening/stabilizing agent according to the present invention includes a compound represented by Formula (1): (R2—HNOC)4-n—R1—(CONH—R3)n  (1) where R1 is a group resulting from removing four hydrogen atoms from the structural formula of butane; R2 and R3 are different from each other and are aliphatic hydrocarbon groups each containing 4 or more carbon atoms; and n is an integer of 1 to 3.

公开(公告)号：US20210343542A1

公开(公告)日：2021-11-04

申请号：US17261931

申请日：2020-03-18

Applicant: DAICEL CORPORATION

Inventor： Yuichi SAKANISHI

IPC: H01L21/321 ,  C09G1/04

Abstract: Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface.
A hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid comprising water and a compound represented by Formula (1) below, and a total content of the water and the compound represented by Formula (1) below being 95 wt. % or greater. R1O—(C3H6O2)n—H  (1) where R1 denotes a hydrogen atom, a hydrocarbon group having from 1 to 24 carbon atoms and optionally having a hydroxyl group, or a group represented by R2CO, the R2 denoting a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit in the parentheses, and is from 2 to 60.

公开(公告)号：US20210292602A1

公开(公告)日：2021-09-23

申请号：US17262088

申请日：2020-03-18

Applicant: DAICEL CORPORATION

Inventor： Yuichi SAKANISHI

IPC: C09G1/02 ,  H01L21/304

Abstract: Provided is a polishing composition for semiconductor wiring providing an excellent polishing rate and preventing occurrence of dishing.
The polishing composition for semiconductor wiring according to the present invention contains a compound represented by Formula (1) below: R1O—(C3H6O2)n—H  (1) where R1 represents a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may include a hydroxyl group, or a group represented by R2CO, where the R2 represents a hydrocarbon group having from 1 to 24 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.