HEAT-RESISTANT ELECTRIC WIRE
    11.
    发明申请
    HEAT-RESISTANT ELECTRIC WIRE 有权
    耐热电线

    公开(公告)号:US20160322128A1

    公开(公告)日:2016-11-03

    申请号:US15108104

    申请日:2014-12-19

    Abstract: A heat-resistant electric wire including a core wire and a coating that covers the core wire. The coating is formed from a modified fluorine-containing copolymer that is obtained by irradiating a copolymer with radiation at an exposure of 250 kGy or lower at a temperature of not higher than the melting point of the copolymer. The copolymer is at least one copolymer selected from a copolymer including a tetrafluoroethylene unit and a perfluoro(alkyl vinyl ether) unit and a copolymer including a tetrafluoroethylene unit and a hexafluoropropylene unit.

    Abstract translation: 一种耐热电线,包括芯线和覆盖芯线的涂层。 该涂层由改性的含氟共聚物形成,该改性含氟共聚物通过在不高于共聚物熔点的温度下以250kGy或更低的曝露度辐射共聚物而获得。 该共聚物是选自包含四氟乙烯单元和全氟(烷基乙烯基醚)单元的共聚物和包含四氟乙烯单元和六氟丙烯单元的共聚物中的至少一种共聚物。

    MODIFIED FLUORINE-CONTAINING COPOLYMER AND FLUORINE RESIN MOLDED ARTICLE
    12.
    发明申请
    MODIFIED FLUORINE-CONTAINING COPOLYMER AND FLUORINE RESIN MOLDED ARTICLE 有权
    改性含氟聚合物和氟树脂模塑制品

    公开(公告)号:US20160319089A1

    公开(公告)日:2016-11-03

    申请号:US15108090

    申请日:2014-12-19

    CPC classification number: C08J7/123 C08J2327/18

    Abstract: A modified fluorine-containing copolymer obtained by irradiating a copolymer with radiation at a temperature of not higher than the melting point of the copolymer. The copolymer includes at least one copolymer selected from a copolymer including a tetrafluoroethylene unit and a perfluoro(alkyl vinyl ether) unit and a copolymer including a tetrafluoroethylene unit and a hexafluoropropylene unit, and has 10 to 10000 functional groups in total per 106 carbon atoms.

    Abstract translation: 通过在不高于共聚物熔点的温度下用辐射照射共聚物得到的改性含氟共聚物。 共聚物包括至少一种选自包含四氟乙烯单元和全氟(烷基乙烯基醚)单元的共聚物的共聚物和包含四氟乙烯单元和六氟丙烯单元的共聚物,并且每106个碳原子总共具有10至10000个官能团。

    WELDED BODY
    15.
    发明申请

    公开(公告)号:US20220213996A1

    公开(公告)日:2022-07-07

    申请号:US17701246

    申请日:2022-03-22

    Abstract: The present disclosure provides a welded body having a connecting structure formed by welding a first molded body and a second molded body, wherein the first and second molded bodies contain at least one copolymer selected from the group consisting of a tetrafluoroethylene/fluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, and wherein the connecting structure has a liquid contact surface to be in contact with a liquid having a solubility parameter of 14 to 35 (MPa)1/2, a welded part formed in the connecting structure is not exposed to the liquid contact surface, and the number of particles of 30 nm or larger to be eluted from the liquid contact surface in the connecting structure is 1,000 particles/ml or less.

Patent Agency Ranking