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公开(公告)号：US12081137B2
公开(公告)日：2024-09-03
申请号：US17954593
申请日：2022-09-28
Applicant: DENSO CORPORATION
Inventor： Yuuya Hashimoto , Yuu Yamahira , Toshiyuki Kouno , Hiromi Ichijyo , Kazuya Takeuchi , Tatsuya Murakami , Tetsuya Matsuoka
IPC: H02M7/00 , H02M7/5387 , H02P27/08
CPC classification number: H02M7/003 , H02M7/53871 , H02P27/08
Abstract: A power converter includes an inverter, a converter, an electrical-machine busbar, an electrical-machine sensor, an electrical-machine-sensor housing, a converter, a converter busbar, a converter-sensor housing. The inverter supplies a three-phase alternating current to a rotating electrical machine. The converter converts a voltage between a direct current power supply and the inverter. The electrical-machine busbar passes a current between the inverter and the rotating electrical machine. The electrical-machine sensor detects the current flowing through the electrical-machine busbar based on a magnetic field. The electrical-machine-sensor housing accommodates the electrical-machine sensor and the electrical-machine busbar together. The converter sensor detects the current flowing through the converter based on a magnetic field. The converter-sensor housing is disposed apart from the electrical-machine-sensor housing, and accommodates the converter sensor and the converter busbar together.
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公开(公告)号：US12074089B2
公开(公告)日：2024-08-27
申请号：US17066589
申请日：2020-10-09
Applicant: DENSO CORPORATION
Inventor： Xiaolin Guo , Koji Asagara , Kazuya Takeuchi , Akihiro Ohi
CPC classification number: H01L23/427 , B08B9/032 , F28D1/0325 , F28D1/05325 , F28G13/00 , H05K7/20
Abstract: A heat exchanger body that includes a circulation path through which a coolant is circulated and performs heat exchange between the coolant flowing through the circulation path and an electronic component; a circulation pump that supplies the coolant to the heat exchanger body; an accumulation determination unit that determines whether a foreign matter accumulation condition is fulfilled that is satisfied when foreign matter is expected to be accumulated in at least a part of the circulation path; and a process execution unit that in response to the foreign matter accumulation condition being satisfied, executes a foreign matter cleaning process of removing the foreign matter accumulated in the circulation path and cleaning the circulation path. In the foreign matter cleaning process, the process execution unit reduces an amount of coolant supplied from the circulation pump so that the coolant has a superheating degree in a nucleate boiling region.
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公开(公告)号：US11973432B2
公开(公告)日：2024-04-30
申请号：US17690141
申请日：2022-03-09
Applicant: DENSO CORPORATION
Inventor： Hiromi Ichijyo , Yuu Yamahira , Kazuya Takeuchi , Masanori Sakata , Masayoshi Nishihata
IPC: H02M7/00 , H01L23/31 , H01L23/528 , H01L25/18 , H02M7/5387 , H02P27/06
CPC classification number: H02M7/003 , H01L23/3107 , H01L23/5286 , H01L25/18 , H02M7/5387 , H02P27/06
Abstract: First switches include first electrodes, which are mutually connected with each other via a first internal bus bar, and second electrodes, which are mutually connected with each other via a second internal bus bar. A first resin member encapsulates the first switches and the first and second internal bus bars. Second switches include third electrodes, which are mutually connected with each other via a third internal bus bar, and fourth electrodes, which are mutually connected with each other via a fourth internal bus bar. A second resin member that encapsulates the second switches and the third and fourth internal bus bars. The second module is arranged alongside with the first module. The second internal bus bar and the third internal bus bar are partially exposed from the first resin member and the second resin member, respectively, and are directly joined with each other.
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公开(公告)号：US11778779B2
公开(公告)日：2023-10-03
申请号：US16689879
申请日：2019-11-20
Applicant: DENSO CORPORATION
Inventor： Xiaolin Guo , Koji Asagara , Kazuya Takeuchi
CPC classification number: H05K7/20281 , G05B15/02 , H05K7/20263 , H05K7/20272 , H05K7/20872 , H05K7/20927 , H05K7/20945
Abstract: In an electronic component cooling device, a cooler cools an electronic component, a coolant temperature acquisition unit acquires a temperature of a coolant, a coolant flow rate acquisition unit acquires the flow rate of the coolant, a heat loss estimation unit estimates a heat loss from the electronic component, and a loss threshold calculation unit calculates an upper limit threshold of the heat loss from the electronic component based on the coolant temperature and the coolant flow rate. A coolant flow rate control unit controls the flow rate of the coolant and is configured to, in response to an estimated heat loss which is the heat loss from the electronic component that has been estimated by the heat loss estimation unit exceeding the upper limit threshold, increase the flow rate of the coolant circulating through the cooler.
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公开(公告)号：US11232995B2
公开(公告)日：2022-01-25
申请号：US16554658
申请日：2019-08-29
Applicant: DENSO CORPORATION
Inventor： Hiroki Matsuzawa , Bahman Hossini Soltani , Kazuya Takeuchi
IPC: H01L23/367 , H01L23/46 , H01L21/48 , H01L23/473
Abstract: To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.
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Patent Agency Ranking
公开(公告)号：US09735700B2
公开(公告)日：2017-08-15
申请号：US15013503
申请日：2016-02-02
Applicant: DENSO CORPORATION
Inventor： Kazuya Takeuchi , Tetsuya Matsuoka , Ryota Tanabe
CPC classification number: H02M7/003 , H05K7/20263 , H05K7/20927
Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.
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公开(公告)号：US12261544B2
公开(公告)日：2025-03-25
申请号：US17878585
申请日：2022-08-01
Applicant: DENSO CORPORATION
Inventor： Kazuya Takeuchi , Yuuta Hashimoto
Abstract: A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.
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公开(公告)号：US12178023B2
公开(公告)日：2024-12-24
申请号：US17510771
申请日：2021-10-26
Applicant: DENSO CORPORATION
Inventor： Kazuya Takeuchi , Kenji Shibata , Yoshihito Takahashi
IPC: H05K7/20 , H01L23/40 , H01L23/473 , H02M7/537
Abstract: A power conversion device includes a semiconductor module, a cooling device, a case, which accommodates the semiconductor module and the cooling device, a connector, which is connected to an inlet pipe, which is a refrigerant flow pipe of the cooling device, and a sealing member, which seals between the inlet pipe and the connector. The connector includes a pipe portion, which communicates with the inlet pipe, and a flange portion, which is secured to the case. The pipe portion and the flange portion are joined to each other with the pipe portion located in an insertion hole of the flange portion.
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公开(公告)号：US20240215211A1
公开(公告)日：2024-06-27
申请号：US18594278
申请日：2024-03-04
Applicant: DENSO CORPORATION
Inventor： Tetsuya MATSUOKA , Yuta Hashimoto , Tomoki Kozawa , Kazuya Takeuchi , Shinji Takai , Takahiro Shimizu
CPC classification number: H05K7/20927 , H02M7/003 , H02M7/537
Abstract: The power conversion device has a case, a semiconductor module, a first cooler that cools the semiconductor module from one side, a second cooler that cools the semiconductor module from the back side, and a coupling pipe that couples a flow path of the first cooler with a flow path of the second cooler. A flow rate of the refrigerant is made different between the flow paths, and the flow path having a larger flow rate is larger in cross-sectional area than the flow path having a smaller flow rate. The first cooler having a wider flow path is formed by a part of the case that houses the semiconductor module, and the second cooler having a narrower flow path is housed in the case together with the semiconductor module.
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公开(公告)号：US11805628B2
公开(公告)日：2023-10-31
申请号：US17510938
申请日：2021-10-26
Applicant: DENSO CORPORATION
Inventor： Kazuya Takeuchi , Tomohiro Shimazu
IPC: H05K7/20 , H01L23/40 , H01L23/473 , H02M7/537
CPC classification number: H05K7/20927 , H01L23/40 , H01L23/473 , H02M7/537
Abstract: A power conversion device includes a connector and a sealing member. The connector is connected to a lead-in pipe of a cooling device on the outside of a case. The sealing member makes a watertight seal between a refrigerant flow pipe, which is the lead-in pipe, and the connector. The sealing member includes a connector-side tubular portion, a first watertight seal projection, and a second watertight seal projection. The connector-side tubular portion is located between an inner peripheral surface of the connector and an outer peripheral surface of the lead-in pipe. The first watertight seal projection projects radially outward in an annular shape from the connector-side tubular portion toward the inner peripheral surface of the connector. The second watertight seal projection projects radially inward in an annular shape from the connector-side tubular portion toward the outer peripheral surface of the lead-in pipe.
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