公开(公告)号：US20170117212A1

公开(公告)日：2017-04-27

申请号：US15398178

申请日：2017-01-04

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Takanori KAWASHIMA ,  Tomomi OKUMURA ,  Masayoshi NISHIHATA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/051

CPC classification number: H01L23/49568 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/072 ,  H01L29/7397 ,  H01L29/861 ,  H01L2224/2612 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor device includes: opposed first and second metal plates; a plurality of semiconductor elements each interposed between the first metal plate and the second metal plate; a metal block interposed between the first metal plate and each of the semiconductor elements; a solder member interposed between the first metal plate and the metal block and connecting the first metal plate to the metal block; and a resin molding sealing the semiconductor elements and the metal block. A face of the first metal plate, which is on an opposite side of a face of the first metal plate to which the metal block is connected via the solder member, is exposed from the resin molding. The first metal plate has a groove formed along an outer periphery of a region in which the solder member is provided, the groove collectively surrounding the solder member.

公开(公告)号：US20170018484A1

公开(公告)日：2017-01-19

申请号：US15123794

申请日：2015-01-15

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Takanori KAWASHIMA ,  Keita FUKUTANI ,  Tomomi OKUMURA ,  Masayoshi NISHIHATA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84138 ,  H01L2224/92165 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的顶面侧电极的导电的第一板状部件，并且包括从侧面突出的第一接合部，以及导电第二部件 板状部分包括从侧面突出的第二接合部。 第一接合部的底面和第二接合部的顶面彼此面对，并且经由导电接合材料电连接。 在第一接合部的底面和第二接合部的顶面彼此面对的区域中设置接合材料厚度确保装置，以确保导电接合材料的上部 第二接合部的前端和第一接合部的底面。