公开(公告)号：US20230261383A1

公开(公告)日：2023-08-17

申请号：US18108768

申请日：2023-02-13

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Hee Jun PARK ,  Young Ju KIM ,  Byung Eun JEON

IPC: H01Q9/04 ,  H01Q1/42

CPC classification number: H01Q9/0471 ,  H01Q9/0485 ,  H01Q1/422

Abstract: An antenna structure according to an embodiment includes a radiator including a plurality of radiating portions that have sequentially reducing widths, a transmission line electrically connected to the radiator, and a ground pattern around the transmission line to be physically spaced apart from the radiator and the transmission line. A broadband antenna structure capable of providing a multi-band radiation can be implemented.

公开(公告)号：US20230231294A1

公开(公告)日：2023-07-20

申请号：US18125271

申请日：2023-03-23

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Young Ju KIM ,  Dong Pil PARK ,  Byung Jin CHOI ,  Na Yeon KIM ,  Han Sub RYU

IPC: H01Q1/22 ,  H04M1/02 ,  H01Q1/38 ,  H05K3/46

CPC classification number: H01Q1/2266 ,  H01Q1/38 ,  H01Q1/2283 ,  H04M1/0277 ,  H05K3/4691 ,  H05K1/0216

Abstract: An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

公开(公告)号：US20230225046A1

公开(公告)日：2023-07-13

申请号：US18114677

申请日：2023-02-27

Applicant: DONGWOO FINE-CHEM CO., LTD. ,  POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Inventor： Byung Jin CHOI ,  Young Ju KIM ,  Dong Pil PARK ,  Won Bin HONG

IPC: H05K1/02 ,  H01Q1/38 ,  H01Q1/24

CPC classification number: H05K1/0243 ,  H01Q1/38 ,  H01Q1/243 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.

公开(公告)号：US20230043504A1

公开(公告)日：2023-02-09

申请号：US17878229

申请日：2022-08-01

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Hee Jun PARK ,  Won Hee LEE

IPC: H01Q1/12 ,  H05K1/02 ,  H05K1/11

Abstract: A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

公开(公告)号：US20220311133A1

公开(公告)日：2022-09-29

申请号：US17699540

申请日：2022-03-21

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Yun Seok OH ,  Young Ju KIM ,  Hee Jun PARK ,  Won Hee LEE ,  Jae Hyun LEE

IPC: H01Q1/36 ,  H01Q1/24

Abstract: An antenna element according to an exemplary embodiment includes a dielectric layer; and an antenna pattern formed in a mesh structure on the dielectric layer and including an irregularly-shaped edge. The antenna element according to the example is excellent in terms of the pattern visibility, while maintaining the antenna performance.

公开(公告)号：US20220158350A1

公开(公告)日：2022-05-19

申请号：US17524924

申请日：2021-11-12

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Byung Jin CHOI ,  Young Ju KIM ,  Dong Pil PARK

IPC: H01Q9/04 ,  H01Q1/48

Abstract: An antenna element according to an embodiment of the present invention includes a radiation body including a contact part which is concave toward the transmission line, a transmission line disposed on a different layer from the radiation body and connected to the radiation body through the contact part, and a signal pad connected to an end of the transmission line.

公开(公告)号：US20230411852A1

公开(公告)日：2023-12-21

申请号：US18206764

申请日：2023-06-07

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Young Ju KIM ,  Gi Taek OH ,  Won Hee LEE ,  Eun Hyun CHO

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q21/08

CPC classification number: H01Q9/0407 ,  H01Q21/08 ,  H01Q1/243

Abstract: An antenna device may include a substrate layer including a radiation region and a bonding region, an antenna unit including a radiator disposed on the radiation region of the substrate layer, and a transmission line disposed on the substrate layer and connected to the radiator, and a dummy bonding pad disposed on the bonding region of the substrate layer and physically spaced apart from the radiator in a width direction.

公开(公告)号：US20230299496A1

公开(公告)日：2023-09-21

申请号：US18118868

申请日：2023-03-08

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Young Ju KIM ,  Sung Hoe KIM ,  Hee Jun PARK ,  Young Sub SON

IPC: H01Q15/16 ,  H01Q1/22 ,  H01Q1/42

CPC classification number: H01Q15/168 ,  H01Q1/2283 ,  H01Q1/422

Abstract: An antenna device according to an embodiments of the present invention includes a substrate layer, a ground layer disposed on a bottom surface of the substrate layer, a radiation control layer disposed on a top surface of the substrate layer, the radiation control layer including a plurality of radiation control patterns formed of a conductive mesh structure, each of the radiation control patterns having a hollow portion, an antenna dielectric layer disposed on the radiation control layer, and an antenna unit disposed on the antenna dielectric layer.

公开(公告)号：US20230121298A1

公开(公告)日：2023-04-20

申请号：US17965932

申请日：2022-10-14

Applicant: DONGWOO FINE-CHEM CO., LTD. ,  KREEMO INC.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Yoon Ho HUH ,  In Seok JANG ,  Beak Jun SEONG ,  Jun Ho PARK ,  In Kyung HONG ,  John Joonho PARK

IPC: H01Q19/00 ,  H01Q5/55 ,  H01Q1/38 ,  H01Q5/385

Abstract: An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.

公开(公告)号：US20230035171A1

公开(公告)日：2023-02-02

申请号：US17873254

申请日：2022-07-26

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Hee Jun PARK ,  Young Ju KIM ,  Won Hee LEE ,  Sung Jin HAN

IPC: H01Q5/307 ,  H01Q1/24 ,  H01Q5/10

Abstract: An antenna structure according to an embodiment of the present disclosure includes a transmission line, and a radiator connected to the transmission line, the radiator having a linear perimeter region and a plurality of curved perimeter regions separated by the linear perimeter region, wherein an outermost portion of the radiator from the transmission line in a planar view has any one of the curved peripheral regions. A broadband antenna structure covering low frequency and high frequency bands is provided.