公开(公告)号：US20060231521A1

公开(公告)日：2006-10-19

申请号：US11107083

申请日：2005-04-15

Applicant: Dan Chilcott

Inventor： Dan Chilcott

IPC: C23F1/00

CPC classification number: B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0135 ,  B81C2201/014 ,  B81C2201/017

Abstract: A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a first side of the handling wafer at an opening of the cavity. Then, a bulk etch is performed on the first side of the handling wafer to modify the sidewall of the cavity to a second angle greater than about 90 degrees, with respect to the first side of the handling wafer at the opening of the cavity. Next, a second side of a second wafer is bonded to the first side of the handling wafer.

Abstract translation: 微电子机械结构的制造技术包括多个步骤。 最初，空腔形成处理晶片的第一侧，空腔的侧壁在空腔的开口处相对于处理晶片的第一侧形成大于约54.7度的第一角度。 然后，在处理晶片的第一侧上执行体蚀刻，以将空腔的侧壁相对于处理晶片在空腔开口处的第一侧大于约90度的第二角度进行修改。 接下来，将第二晶片的第二面接合到处理晶片的第一侧。

公开(公告)号：US20050017175A1

公开(公告)日：2005-01-27

申请号：US10710260

申请日：2004-06-29

Applicant: Han-Sheng Lee ,  Dan Chilcott ,  James Logsdon

Inventor： Han-Sheng Lee ,  Dan Chilcott ,  James Logsdon

IPC: B81B7/00 ,  G01J5/10 ,  G01J5/00

CPC classification number: B81B7/0067 ,  B81C2203/0118 ,  G01J5/08 ,  G01J5/0853 ,  G01J5/10

Abstract: An optical sensor package with a substrate that supports a membrane carrying an optical sensor and through which radiation passes to impinge the sensor. The substrate has a first surface in which a cavity is defined, a second surface opposite the first surface, and a wall between the cavity and the second surface. The optical sensor is supported on the membrane, which is bonded to the substrate and spans the cavity in the substrate. A window is defined at the second surface of the substrate for enabling infrared radiation to pass through the wall of the substrate to the optical sensor.

Abstract translation: 一种光学传感器封装，其具有支撑携带光学传感器并且辐射通过该膜以撞击传感器的膜的基板。 衬底具有其中限定空腔的第一表面，与第一表面相对的第二表面以及腔和第二表面之间的壁。 光学传感器被支撑在膜上，该膜结合到基底并跨越基底中的空腔。 窗口被限定在基板的第二表面上，以使得红外辐射能够通过基板的壁到达光学传感器。

公开(公告)号：US20050016576A1

公开(公告)日：2005-01-27

申请号：US10710250

申请日：2004-06-29

Applicant: Qin Jiang ,  Han Lee ,  James Logsdon ,  Dan Chilcott ,  David Lambert ,  Shih-Chia Chang

Inventor： Qin Jiang ,  Han Lee ,  James Logsdon ,  Dan Chilcott ,  David Lambert ,  Shih-Chia Chang

IPC: G01K7/02 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L37/00

CPC classification number: G01K7/021

Abstract: A thermocouple structure capable of providing a more compact thermopile-based thermal sensor. The thermocouple structure has a stacked configuration that includes a plurality of first conductors on a surface, a dielectric layer on each of the first conductors, and a plurality of second conductors on the dielectric layer and formed of a different material than the first conductors. Each first conductor has first and second ends, and each second conductor has a first end overlying and contacting the first end of one of the first conductors, and a second end overlying but separated from the second end of the first conductor by the dielectric layer. A plurality of third conductors electrically interconnect one of the second ends of the second conductors with one of the second ends of the first conductors. Each third conductors is thicker than the second conductors to promote the robustness of the connection.

Abstract translation: 能够提供更紧凑的基于热电堆的热传感器的热电偶结构。 热电偶结构具有层叠结构，其包括表面上的多个第一导体，每个第一导体上的电介质层和介电层上的多个第二导体，并且由不同于第一导体的材料形成。 每个第一导体具有第一端和第二端，并且每个第二导体具有覆盖并接触第一导体中的一个的第一端的第一端，以及通过介电层覆盖但与第一导体的第二端分离的第二端。 多个第三导体将第二导体的第二端中的一个与第一导体的第二端之一电互连。 每个第三导体比第二导体厚，以促进连接的鲁棒性。